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82S126A/BEA

Philips Semiconductors

82S126A/BEA by Philips Semiconductors

OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; Technology: TTL;

Median Price

$182.390

Lifecycle Status

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4

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1k+

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Arrow

USA . 135 parts In-Stock

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$182.390

100+ parts

$95.750

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135

$182.390

$95.750

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Digiode

USA . 3,738 parts In-Stock

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$275.490

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3,738

$275.490

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Vyrian

USA . 6,177 parts In-Stock

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Anansix

USA . 298 parts In-Stock

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298

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Northwest PG Solutions

USA . 84 parts In-Stock

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$3.278

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84

$3.278

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Corphita

USA . 3,191 parts In-Stock

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$260.991

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3,191

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UNI Independent Distributors

Spain . 5,264 parts In-Stock

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Native Components

USA . 449 parts In-Stock

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$2.891

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449

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$2.891

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RTC Component Inc.

USA . 40 parts In-Stock

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Technical Specifications

OTP ROM 82S126A/BEA attributes and parameters. Explore more OTP ROM devices from Philips Semiconductors

Specs

Maximum Access Time:

35 ns

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

Memory Density:

1024 bit

Memory IC Type:

Memory Width:

4

No. of Terminals:

16

No. of Words:

256 words

No. of Words Code:

256

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

256X4

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

OTP ROMs

Maximum Supply Current:

125 mA

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

82S126A/BEA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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