Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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HTMS8101FTB/AF,115
NXP Semiconductors
HTMS8101FTB/AF,115 from NXP Semiconductors is a telecom interface IC designed for surface mount applications. It features a quad terminal configuration, operates at peak reflow temps of 260 °C, and utilizes CMOS technology. Ideal for enhancing telecom circuit performance in compact designs.
1
3
PLASTIC/EPOXY
QCCN
LCC3(UNSPEC)
CHIP CARRIER
260
Not Qualified
Other Telecom ICs
YES
CMOS
TELECOM CIRCUIT
NO LEAD
QUAD
HTMS8101FTK/AF,115
HTMS8101FTK/AF,115 by NXP Semiconductors is a CMOS telecom circuit IC designed for surface mount applications. It features a quad terminal position and can withstand peak reflow temperatures of 260 °C. Ideal for various telecom interface needs, it comes in a plastic/epoxy chip carrier package.
LCC(UNSPEC)
HTMS8201FTB/AF,115
HTMS8201FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC featuring a no-lead design with 3 terminals. It supports peak reflow temps of 260 °C and utilizes CMOS technology for efficient performance. Ideal for surface mount applications in telecom circuits.
HTMS8201FTK/AF,115
HTMS8201FTK/AF,115 by NXP Semiconductors is a CMOS telecom interface IC in a no-lead quad chip carrier package. It supports surface mount technology and withstands peak reflow temperatures of 260 °C. Ideal for various telecom applications, it ensures reliable performance.
SL3ICS3001FW/V1,00
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;
85 Cel
-40 Cel
DIE OR CHIP
INDUSTRIAL
HTCICC6402FUG/AM,0
TELECOM CIRCUIT; Nominal Supply Voltage: 5 V; Power Supplies (V): 5; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP;
5
5 V
HTCICC6403FUG/AM,0
TELECOM CIRCUIT; Qualification: Not Qualified; Power Supplies (V): 5; Package Equivalence Code: DIE OR CHIP; Nominal Supply Voltage: 5 V;
PN5120A0HN/C1,551
PN5120A0HN/C1,551 by NXP Semiconductors is a versatile telecom interface IC with a 40-terminal chip carrier design. It operates at power supplies of 1.8/3.3V and supports temperatures from -30 °C to 85 °C, making it ideal for various applications in communication systems. Its surface mount and no-lead features enhance integration in compact devices.
S-PQCC-N40
e4
40
-30 Cel
LCC40,.24SQ,20
SQUARE
1.8/3.3,2.5/3.3
OTHER
NICKEL PALLADIUM GOLD
.5 mm
30
PN5120A0HN/C1,557
PN5120A0HN/C1,557 by NXP Semiconductors is a versatile telecom interface IC with a 40-terminal chip carrier design. It operates at power supplies of 1.8/3.3V and withstands temperatures from -30 °C to 85 °C, making it ideal for robust applications in communication systems. Its surface mount and no-lead features enhance integration in compact devices.
PN5120A0HN/C2,518
PN5120A0HN/C2,518 by NXP Semiconductors is a 40-terminal IC with power supplies of 1.8/3.3V and 2.5/3.3V, operating b/w -30 to 85°C. It features a no-lead terminal form, nickel palladium gold finish, and is ideal for telecom interface applications due to its square package shape and moisture sensitivity level of 3.
PN5120A0HN/C2,551
PN5120A0HN/C2,551 by NXP Semiconductors is a 40-terminal IC with power supplies of 1.8/3.3V and 2.5/3.3V, operating b/w -30 to 85°C. Its no-lead terminal finish and quad position make it ideal for telecom interface applications requiring a moisture sensitivity level of 3 MSL.
SL3S1002AC2,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;
SL3S1202AC2,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Equivalence Code: DIE OR CHIP; Maximum Operating Temperature: 85 Cel; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel;
SL3S1203AC0,118
SL3S1203AC0,118 by NXP Semiconductors is an industrial-grade telecom interface IC operating b/w -40 °C and 85 °C. It features a nominal voltage of 1.8V and a max current of 0.265mA, ideal for reliable telecom applications in harsh environments.
1.8
.265 mA
1.8 V
SL3S1203AC2,118
SL3S1203AC2,118 by NXP Semiconductors is an industrial-grade telecom interface IC operating b/w -40 °C and 85 °C. It features a nominal voltage of 1.8V and a max current of 0.265mA, ideal for low-power telecom applications. This component ensures reliable performance in demanding environments.
PN512AA0HN1/C2,551
PN512AA0HN1/C2,551 by NXP Semiconductors is a versatile telecom interface IC with a quad terminal layout and operates b/w -30 °C to 85 °C. It supports power supplies of 1.8/3.3V and has a max supply current of 100mA. Ideal for automotive applications, it meets AEC-Q100 standards.
S-PQCC-N32
32
LCC32,.2SQ,20
AEC-Q100
100 mA
BGX7100HN/1,118
BGX7100HN/1,118 by NXP Semiconductors is a versatile telecom interface IC designed for surface mount applications. It operates at a nominal voltage of 5V and features a compact 24-terminal chip carrier package. Ideal for communication systems, it supports peak reflow temps up to 260 °C.
S-PQCC-N24
24
LCC24,.16SQ,20
BGX7100HN/1,115
BGX7100HN/1,115 by NXP Semiconductors is a versatile telecom interface IC designed for surface mount applications. It operates at a nominal voltage of 5V and features a compact 24-terminal chip carrier package. Ideal for communication systems, it supports high-temperature reflow processes up to 260 °C.
MFRC63102HN,157
MFRC63102HN,157 by NXP Semiconductors is a compact telecom interface IC with a 5V supply and operates b/w -25 °C to 85 °C. It features a data rate of 0.4 Mbps and comes in a very thin profile package with 32 terminals. Ideal for applications requiring efficient communication in space-constrained environments.
.4 Mbps
5 mm
-25 Cel
HVQCCN
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
1 mm
SL3S1213FUD/BG,003
SL3S1213FUD/BG,003 by NXP Semiconductors is an industrial-grade telecom interface IC operating b/w -40 °C and 85 °C. It features a nominal voltage of 1.8V and a max current of 0.265mA, ideal for low-power telecom applications. This CMOS technology ensures reliable performance in demanding environments.
HT2MOA2S20/E/3,118
TELECOM CIRCUIT; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Technology: HYBRID; Qualification: Not Qualified; Package Equivalence Code: MODULE(UNSPEC); Package Body Material: PLASTIC/EPOXY;
MODULE(UNSPEC)
MICROELECTRONIC ASSEMBLY
HYBRID
PRH601HL/C1,557
PRH601HL/C1,557 by NXP Semiconductors is a versatile telecom interface IC designed for surface mount applications. It operates at 3.3V and 5V with a max temp of 70 °C, featuring a compact flatpack design with 100 terminals. Ideal for communication systems requiring reliable performance in varying conditions.
S-PQFP-G100
100
70 Cel
QFP
QFP100,.63SQ,20
FLATPACK
3.3,5
GULL WING
HT1ICS3002W/V6F,00
TELECOM CIRCUIT; Temperature Grade: OTHER; Package Equivalence Code: WAFER; Minimum Operating Temperature: -25 Cel; Qualification: Not Qualified; Maximum Operating Temperature: 85 Cel;
WAFER
SL3S4011FHK,125
SL3S4011FHK,125 by NXP Semiconductors is a telecom interface IC with 8 terminals in a square chip carrier package. Operating at -40 to 85°C, it supports power supplies of 1.8/3.6V for industrial applications. This surface-mount IC has a terminal pitch of 0.5mm and is ideal for telecom circuit integration.
S-PQCC-N8
8
LCC8,.06SQ,20
1.8/3.6
SL3S4021FHKH
The NXP Semiconductors SL3S4021FHKH is an 8-terminal telecom interface IC in a square chip carrier package. Operating at temperatures from -40 to 85°C, it supports power supplies of 1.8/3.6V and features nickel palladium gold terminal finish. Ideal for industrial telecom circuits, this surface-mount IC has a terminal pitch of 0.5mm and is suitable for various applications requiring reliable telecommunications functionality.
PN5120A0ET/C2J
PN5120A0ET/C2J by NXP Semiconductors is a telecom interface IC with 64 terminals in a square package. Operating at -30 to 85°C, it requires 3/3.3V power supply and has a peak reflow temp of 260°C. Ideal for applications requiring fine pitch grid array style packages.
S-PBGA-B64
64
FBGA
BGA64,8X8,25
GRID ARRAY, FINE PITCH
3/3.3
BALL
.635 mm
BOTTOM
PN5120A0ET/C2EL
PN5120A0ET/C2EL by NXP Semiconductors is a versatile telecom interface IC designed for surface mount applications. It operates at 3/3.3V with a max current of 100mA and supports temperatures from -30 °C to 85 °C. Ideal for compact, high-performance electronic devices.
PN5120A0ET/C2QL
NXP Semiconductors' PN5120A0ET/C2QL is a telecom interface IC with 64 terminals, operating at temperatures from -30 to 85°C. It has a power supply of 3/3.3V and peak reflow temperature of 260°C. This square-shaped IC in plastic/epoxy package is ideal for applications requiring fine pitch grid array style components.
CLRC66302HN,157
The NXP Semiconductors CLRC66302HN,157 is a telecom interface IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 105°C and has a data rate of 1 Mbps at 5V supply voltage. Ideal for industrial applications requiring high-speed communication in compact spaces.
1 Mbps
105 Cel
SL3S1204FTB0X
SL3S1204FTB0X by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It features a dual terminal form with a -40 °C to 85 °C operating temp range and comes in a compact 6-terminal, no-lead package. Ideal for reliable telecom circuit integration, it ensures efficient performance in demanding environments.
R-PDSO-N6
6
SON
SOLCC6,.04,20
RECTANGULAR
SMALL OUTLINE
DUAL
SL3ICS1002FUG/V7AF
SL3ICS1002FUG/V7AF by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It features an operating temp range of -40 °C to 85 °C, an 8-terminal no-lead design, and utilizes CMOS technology. Ideal for surface mount integration in telecom circuits.
R-XUUC-N8
UNSPECIFIED
DIE
UNCASED CHIP
NOT SPECIFIED
UPPER
SL3ICS1202FUG/V7AF
SL3ICS1202FUG/V7AF by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It features an operating temp range of -40 °C to 85 °C, 8 terminals in a no-lead package, and utilizes CMOS technology for efficient performance. Ideal for surface mount integration in telecom systems.
MFRC53001T/0FE,112
NXP Semiconductors' MFRC53001T/0FE,112 is a telecom IC with 32 terminals in a small outline package. Operating b/w -25°C to 85°C, it has a nominal voltage of 5V and terminal pitch of 1.27mm. Ideal for telecom circuits, this IC is surface mountable and features gull wing terminals.
R-PDSO-G32
20.5 mm
SOP
250
2.65 mm
1.27 mm
7.5 mm
SA606DK/03,118
SA606DK/03,118 by NXP Semiconductors is a telecom interface IC designed for industrial applications. It features a dual terminal configuration with a max operating temp of 85 °C and operates at a nominal voltage of 3V. Its compact size (4.4mm x 6.5mm) ensures efficient integration in various devices.
R-PDSO-G20
6.5 mm
20
LSSOP
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
1.5 mm
3 V
.65 mm
4.4 mm
HTMS1101FTB/AF,115
HTMS1101FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline and no-lead form factor make it ideal for space-constrained environments.
R-PDSO-N3
1.45 mm
VSON
SMALL OUTLINE, VERY THIN PROFILE
HTMS1201FUG/AM,005
HTMS1201FUG/AM,005 by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It operates in extreme temperatures from -40 °C to 85 °C and features a no-lead terminal form in a square package. Ideal for surface mount technology, it ensures reliable performance in demanding environments.
S-XUUC-N
HTMS1201FTB/AF,115
HTMS1201FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline and no-lead form factor make it ideal for space-constrained environments.
P5DF081HN/T1AD2060
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HQCCN; Package Shape: SQUARE;
HQCCN
CHIP CARRIER, HEAT SINK/SLUG
HT2DC20S20/F,122
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Shape: RECTANGULAR; No. of Functions: 1; Qualification: Not Qualified;
R-PXSS-N
SPECIAL SHAPE
HTRC11001T/02EE,11
NXP Semiconductors' HTRC11001T/02EE,11 is a telecom interface IC with 14 terminals and 5V supply voltage. It operates b/w -40 to 85°C, suitable for industrial applications. The package style is small outline, surface mountable, with nickel palladium gold finish.
R-PDSO-G14
8.75 mm
14
SOP14,.25
.01 mA
4 mm
HTSFCH4801EV/DH,11
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Qualification: Not Qualified;
X-XUUC-N
HTSMOH3201EV,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -25 Cel;
HTSMOH5601EV,118
SILVER
PN5110A0HN1/C2,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
PN5110A0HN1/C2,151
PN5120A0HN1/C1,151
PN5120A0HN1/C1,151 by NXP Semiconductors is a telecom interface IC with 32 terminals and power supplies of 1.8/3.3V, suitable for telecom circuits. It operates b/w -30 to 85°C, has a terminal pitch of 0.5mm, and features a nickel palladium gold finish for robust connectivity in various applications.
SA5211D/01,112
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
8.65 mm
1.75 mm
BIPOLAR
3.9 mm
SA5211D/01,118
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