Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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BGX7221HN/1,518
NXP Semiconductors
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE; No. of Functions: 1;
S-PQCC-N36
6 mm
3
1
36
PLASTIC/EPOXY
HVQCCN
SQUARE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
260
1 mm
5 V
YES
TELECOM CIRCUIT
NO LEAD
.5 mm
QUAD
OL2300NHN/F,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N16
e4
3 mm
16
85 Cel
-25 Cel
LCC16,.12SQ,20
2.7
Not Qualified
Other Telecom ICs
19 mA
2.7 V
OTHER
NICKEL PALLADIUM GOLD
30
OL2311AHN/C0B,515
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N32
5 mm
2A
32
LCC32,.2SQ,20
.85 mm
21.5 mA
OL2381AHN/C0B,515
OL2381AHN/C0B,515 by NXP Semiconductors is a telecom interface IC with 32 terminals in a square chip carrier package. Operating at 2.7V, it has a temperature range of -25 to 85°C and low supply current of 0.0012mA. Ideal for telecom circuits, this IC is surface mountable and features a very thin profile for compact applications.
.0012 mA
SA616BS,115
SA616BS,115 by NXP Semiconductors is a Telecom Interface IC with 20 terminals in a square chip carrier package. Operating temperature range from -40 to 85 °C, suitable for industrial applications. Nominal voltage of 3V and terminal pitch of 0.5mm make it ideal for telecom circuits.
S-PQCC-N20
4 mm
20
-40 Cel
VQCCN
CHIP CARRIER, VERY THIN PROFILE
3 V
INDUSTRIAL
SA636BS,115
SA636BS,115 by NXP Semiconductors is a telecom interface IC with 1 function. It has a package style of CHIP CARRIER and a very thin profile. With an operating temperature range of -40 to 85 °C, it is suitable for industrial applications.
LCC20,.16SQ,20
SL2S1502FTBX
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: VSON; Package Shape: RECTANGULAR;
R-PDSO-N3
1.45 mm
VSON
RECTANGULAR
SMALL OUTLINE, VERY THIN PROFILE
CMOS
.55 mm
DUAL
SL2S2002FUD,003
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;
X-XUUC-N4
4
UNSPECIFIED
DIE
UNCASED CHIP
NOT SPECIFIED
UPPER
SL2S2102FTB,115
SL2S2102FTB,115 by NXP Semiconductors is a telecom interface IC with 3 terminals. It operates b/w -40 to 85°C and has a peak reflow temperature of 260°C. This CMOS technology IC is ideal for industrial telecom circuits due to its small outline and thin profile package style.
e3
TIN
SL2S2102FUD,003
SL2S2102FUD,003 by NXP Semiconductors is a CMOS telecom IC with 4 terminals. It operates in industrial temperature range (-40 to 85°C) and is surface mountable. Ideal for telecom circuit applications due to its uncased chip package style.
SL2S5002FUD,003
SL2S5102FUD,003
SL2S5302FUD,003
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: RECTANGULAR;
R-XUUC-N4
SL2S5402FUD,003
SL3S1001FTT,118
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
S-PDSO-G8
8
80 Cel
TSSOP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.1 mm
GULL WING
.65 mm
SL3S1003FTB0,115
NXP Semiconductors' SL3S1003FTB0,115 is a Telecom Interface IC with 6 terminals. It operates in temperatures ranging from -40 to 85°C and features CMOS technology. This small outline IC is ideal for telecom circuit applications due to its thin profile and no-lead terminal form.
R-PDSO-N6
6
SL3S1202FTB1,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 3; Package Code: BCC; Package Shape: RECTANGULAR;
R-PBCC-B3
BCC
LCC3(UNSPEC)
CHIP CARRIER
BUTT
BOTTOM
SL3S1202FTT,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: TSSOP; Package Shape: SQUARE;
TSSOP8,.19
SL3S1203FUF,003
DIE OR CHIP
1.8
.265 mA
1.8 V
SL3S1213FTB0,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;
SOLCC6,.04,20
SL3S1213FUF,003
TFF1007HN/N1,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N24
24
3.3 V
TFF1007HN/N1,118
TFF11086HN/N1,111
TFF11086HN/N1X
TFF11092HN/N1X
TFF11092HN/N1
TFF11101HN/N1,118
TFF11101HN/N1X
TFF11115HN/N1,111
TFF11139HN/N1,118
NXP Semiconductors TFF11139HN/N1,118 is a telecom interface IC with 24 terminals in a square chip carrier package. Operating from -40 to 85°C, it has a nominal voltage of 3.3V and terminal pitch of 0.5mm. Ideal for industrial telecom circuits, this IC is surface mountable and features a very thin profile design.
TFF11139HN/N1X
TFF11145HN/N1X
UAA3220TS/V1S,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
R-PDSO-G24
8.2 mm
SSOP
SMALL OUTLINE, SHRINK PITCH
2 mm
5.3 mm
PN5120A0HN1/C2,151
NXP Semiconductors PN5120A0HN1/C2,151 is a telecom IC with 32 terminals and operates at -30 to 85°C. It has a supply voltage of 3V and terminal pitch of 0.5mm. This chip carrier package is suitable for telecom circuits requiring low-profile components.
-30 Cel
1.8/3.3,2.5/3.3
PN512AA0HN1/C2,557
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
90 Cel
AEC-Q100
100 mA
PN5180A0ET/C1,151
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;
S-PBGA-B64
e1
5.5 mm
64
TFBGA
GRID ARRAY, THIN PROFILE, FINE PITCH
1.15 mm
TIN SILVER COPPER
BALL
PN5180A0HN/C1,551
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N40
40
MFRC52302HN1,151
NXP Semiconductors' MFRC52302HN1,151 is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -25°C to 85°C, with a nominal voltage of 3.3V. Ideal for applications requiring a very thin profile and surface mount compatibility.
MMG30271BT1
TELECOM CIRCUIT; Terminal Form: FLAT; No. of Terminals: 3; Package Code: LSOF; Package Shape: RECTANGULAR; JESD-30 Code: R-PSSO-F3;
R-PSSO-F3
4.5 mm
LSOF
SMALL OUTLINE, LOW PROFILE
1.6 mm
FLAT
1.5 mm
SINGLE
2.5 mm
MMG30301BT1
TELECOM CIRCUIT; Terminal Form: FLAT; No. of Terminals: 3; Package Code: LSOF; Package Shape: RECTANGULAR; No. of Functions: 1;
MFRC63103HNE
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 2; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD SILVER;
2
NICKEL PALLADIUM GOLD SILVER
MWCT1013VLHSTR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
S-PQFP-G64
10 mm
105 Cel
LFQFP
QFP64,.47SQ,20
FLATPACK, LOW PROFILE, FINE PITCH
MWCT1013VLHST
MWCT1R24ZVHT
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL GOLD; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 40;
NICKEL GOLD
TEF6657HN/V102Y
TELECOM CIRCUIT; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD;
TEF6659HN/V102K
TELECOM CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL PALLADIUM GOLD;
TEF6659HN/V102Y
TELECOM CIRCUIT; JESD-609 Code: e4; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
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