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TFF11139HN/N1,118

NXP Semiconductors

TFF11139HN/N1,118 by NXP Semiconductors

NXP Semiconductors TFF11139HN/N1,118 is a telecom interface IC with 24 terminals in a square chip carrier package. Operating from -40 to 85°C, it has a nominal voltage of 3.3V and terminal pitch of 0.5mm. Ideal for industrial telecom circuits, this IC is surface mountable and features a very thin profile design.

Median Price

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Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 7,454 parts In-Stock

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Anansix

USA . 2,130 parts In-Stock

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Digiode

USA . 120 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 775 parts In-Stock

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$9.572

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Microchip USA

USA . 8,042 parts In-Stock

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$15.827

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Component Stockers USA

USA . 394 parts In-Stock

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$66.160

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One Stop Electronics

USA . 1,076 parts In-Stock

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UNI Independent Distributors

Spain . 5,325 parts In-Stock

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Aranea Global

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Corphita

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Authorized Procurement Solutions

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Overview

Discover the unparalleled quality and reliability of the TFF11139HN/N1,118 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers cutting-edge telecom interface ICs that offer a wide range of applications. With a focus on innovation and performance, this product provides customers with unmatched value and benefits. Whether you're looking to enhance communication systems or improve networking capabilities, the TFF11139HN/N1,118 is the perfect solution for your needs. Experience the advantages of NXP Semiconductors' top-notch technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package material is lightweight, cost-effective, and offers good thermal properties, making the product durable and efficient.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving time and effort during manufacturing.

Package Shape: SQUARE

Square package shape helps in simplified PCB layout and provides a compact design, saving space in the overall system.

No. of Terminals: 24

Having 24 terminals allows for connectivity to multiple external components, enhancing the versatility and functionality of the product.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and compact form factor for improved performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring reliable operation in industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function in cold environments without compromising performance, suitable for a wide range of applications.

Terminal Position: QUAD

Quad terminal position facilitates easy connection and soldering, enhancing the overall reliability and durability of the product.

Maximum Seated Height: 1 mm

The low maximum seated height contributes to a slim and compact form factor, making the product suitable for space-constrained applications.

Width: 4 mm

The narrow width of 4mm enables easy integration into various electronic systems, allowing for efficient usage of PCB real estate.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the soldering process without degrading, ensuring reliability during manufacturing.

Length: 4 mm

The short length of 4mm contributes to a compact and space-saving design, suitable for applications where size constraints are critical.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating makes the product suitable for use in demanding environments, ensuring stable performance under varying temperature conditions.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of lead contamination and aligns with RoHS compliance standards, making the product environmentally friendly.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom circuits, this product ensures optimized performance and compatibility with telecom systems for reliable communication.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V, the product offers energy efficiency, making it suitable for battery-powered or low-power applications.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, the product enables high-density mounting, allowing for more connections in a limited space, enhancing functionality.

Technical Specifications

Other Function Telecom Interface ICs TFF11139HN/N1,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TFF11139HN/N1,118 Telecommunications trade compliance attributes, and parameters.

HTS

8541.21.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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