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TFF11094HN

NXP Semiconductors

TFF11094HN by NXP Semiconductors

TFF11094HN by NXP Semiconductors is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 4mm x 4mm size with a 3.3V supply voltage and no lead terminals. Ideal for surface mount designs, it ensures efficient performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,812 parts In-Stock

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4,812

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Anansix

USA . 1,869 parts In-Stock

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1,869

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Vyrian

USA . 229 parts In-Stock

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229

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 280 parts In-Stock

1+ parts

$378.000

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280

$378.000

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UNI Independent Distributors

Spain . 4,514 parts In-Stock

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4,514

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Corphita

USA . 498 parts In-Stock

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498

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Overview

Unlock superior performance with the TFF11094HN from NXP Semiconductors, a trusted leader in innovation. Designed for robust telecom applications, this advanced interface IC ensures seamless connectivity in challenging environments, operating reliably from -40 °C to 85 °C. Its compact design and surface-mount capabilities make it an ideal choice for modern devices, delivering exceptional value through unmatched quality and efficiency, empowering your projects to thrive.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount capability allows for compact designs with efficient space utilization, facilitating easier integration into modern electronic devices.

Package Shape: SQUARE

Square package shape enhances layout flexibility on PCBs and optimizes space for high-density applications.

No. of Terminals: 24

With 24 terminals, this IC can support multiple functions and features, providing greater versatility in design.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile design allows the product to be used in applications with limited space, while the heat sink/slug features dissipate heat efficiently for reliable performance.

Maximum Operating Temperature: 85 °C

Able to operate at 85 °C maximum ensures stability and performance in industrial environments, expanding its range of applications.

Minimum Operating Temperature: -40 °C

The capability to function down to -40 °C makes this IC suitable for demanding outdoor and industrial environments.

Terminal Position: QUAD

Quad terminal positioning offers optimal layout options and simplifies PCB designs, facilitating easier routing and soldering.

Maximum Seated Height: 1 mm

A maximum seated height of 1 mm allows for a very low profile on the PCB, which is advantageous in compact electronic designs.

Width: 4 mm

The compact width of 4 mm makes this telecom IC suitable for space-constrained applications, enhancing design flexibility.

Length: 4 mm

With a length of 4 mm, the IC maintains a small footprint, facilitating easier integration into various designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grade, this IC is reliable and robust, ensuring longevity and performance in harsh conditions.

Terminal Form: NO LEAD

The no-lead terminal form reduces device size and enhances soldering reliability, minimizing the risk of mechanical stress.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit IC, it optimizes performance for telecommunications applications, ensuring effective signal processing and reliability.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V ensures compatibility with low-power systems, contributing to energy efficiency.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density connections on PCBs, which is crucial for modern electronic designs.

Technical Specifications

Other Function Telecom Interface ICs TFF11094HN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TFF11094HN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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