Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TFF11115HN by NXP Semiconductors is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 4mm x 4mm square package with 24 terminals and supports a nominal voltage of 3.3V. Ideal for surface mount designs, it ensures efficient thermal management in telecom circuits.
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Digiode
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One Stop Electronics
$726.000
UNI Independent Distributors
Corphita
The use of plastic/epoxy material ensures durability and protection against environmental factors, making the IC suitable for various applications.
Surface mount technology allows for compact design and efficient use of PCB space, making installation easier and reducing overall product size.
The square package shape provides uniform distribution of thermal and electrical properties, facilitating better performance in integrated circuits.
With 24 terminals, this IC offers multiple connection points for enhanced functionality and versatility in telecom applications.
The thin profile enables efficient thermal management and allows integration into tighter spaces, enhancing design flexibility.
This specification ensures reliable functionality in hotter environments, making the IC suitable for industrial applications.
Operating at low temperatures allows for reliable performance in extreme conditions, making it ideal for outdoor and rugged applications.
Quad terminal positioning enables better signal integrity and reduces interference, which is critical for telecom applications.
The low profile minimizes space requirements on the PCB while facilitating heat dissipation, ideal for modern compact designs.
A compact width aids in designing smaller devices, making the IC versatile for various telecom equipment.
This small length enhances layout efficiency on PCBs, allowing for more components in tight spaces.
Rated for industrial temperature ranges, ensuring reliability and performance in harsh environments typical of telecom installations.
No lead design facilitates lead-free soldering processes, supporting environmentally friendly manufacturing practices.
Designed specifically for telecom applications, it ensures compatibility and high performance in communication systems.
Operating at a low voltage level enhances energy efficiency, making it suitable for battery-powered devices.
A fine terminal pitch allows for high-density component layouts, maximizing space utilization on PCBs.
Other Function Telecom Interface ICs TFF11115HN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
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TFF11115HN Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM7805CT
Silicon Group
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Package Body Material: PLASTIC/EPOXY; Maximum Load Regulation: .05 %;
MMBF170LT1G
Onsemi
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
2N7002
Sinyork
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Operating Temperature: 85 Cel; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Operating Mode: ENHANCEMENT MODE;
Unisonic Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Body Material: PLASTIC/EPOXY; Package Shape: RECTANGULAR;
1N4148WS
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; No. of Elements: 1; Maximum Output Current: .2 A; Config: SINGLE;
RC0603FR-071KL
Yageo
Yageo's RC0603FR-071KL is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in electronics, it operates b/w -55 to 155 °C with a temperature coefficient of 100 ppm/°C.
SS14
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Samsung
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel; Maximum Line Regulation (%/V): .07;
LM317AEMP/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: SOP; Terminal Form: GULL WING; Qualification Status: Not Qualified; Width: 3.56 mm;
LL4148
Hy Electronic
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CM
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LM358N
Intersil
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148
Digitron Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M24308/2-1F
Amphenol
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body or Shell Style: RECEPTACLE; Body Length: 1.228 inch; No. of Rows Loaded: 2;
Secos
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .3 W; Maximum Drain Current (ID): .115 A; Maximum Drain-Source On Resistance: 7.5 ohm;
LM358AN
ULN2003ADR
Texas Instruments
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
BAV99
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
NRF52833-QIAA-R
Nordic Semiconductor Asa
NRF52833-QIAA-R by Nordic Semiconductor Asa is a telecom IC with 2 Mbps data rate. It operates in industrial temperature range (-40 to 105 °C) and has 73 terminals in a square chip carrier package. Ideal for telecom circuit applications, it is surface mountable and features quad terminal position.
MAX-M8W-0-10
U-blox Ag
MAX-M8W-0-10 by U-blox Ag is a GNSS module with 18 terminals and a rectangular package shape. It operates in industrial temperature range (-40 to 85 °C) and has a compact size of 2.5mm width and 10.1mm length. This module is suitable for various applications requiring precise positioning and navigation capabilities.
RN42XVP-I/RM
Microchip Technology
RN42XVP-I/RM by Microchip Technology is a telecom IC with 20 terminals, operating temperature range of -40 to 85 °C. It has a data rate of 0.3 Mbps and operates at a nominal voltage of 3.3 V. This rectangular package is ideal for industrial applications requiring reliable telecom circuit connectivity.
TSC2000IPWR
TSC2000IPWR by Texas Instruments is a Telecom Interface IC with 20 terminals, operating temperature range of -40 to 85°C. It features CMOS technology, single-ended input type, and nominal voltage of 2.7V. Ideal for telecom circuits due to its compact size and industrial temperature grade suitability.
HMC1122LP4METR
Analog Devices
Analog Devices' HMC1122LP4METR is a telecom IC with 24 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm. This chip carrier package is surface-mountable and suitable for industrial applications in telecom circuits.
TM1062DVA1
Inrcore
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Width: 10.16 mm;
RN4870-V/RM118
RN4870-V/RM118 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -20 to 70°C, and data rate of 0.01 Mbps. It is used in applications requiring a nominal voltage of 3.3V, such as IoT devices and wireless communication systems.
ESP32-D2WD
Espressif Systems (Shanghai)
ESP32-D2WD by Espressif Systems is a 48-terminal IC with CMOS technology. Operating from -40 to 105°C, it has a supply voltage of 3.3V. Ideal for telecom circuits, this chip carrier is surface-mountable and features a very thin profile for industrial applications.
ZED-F9R-01B
TELECOM CIRCUIT; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 4;
SA636DK/01
NXP Semiconductors
SA636DK/01 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V, it features gull wing terminals and is designed for telecom circuit applications.
WT12-A-AI3
Silicon Labs
Silicon Labs' WT12-A-AI3 is a telecom IC with 31 terminals, CMOS technology, and 3 Mbps data rate. It operates in industrial temperature range (-40 to 85°C) and requires a nominal voltage of 3.3V. This surface-mount rectangular package (14x25 mm) is ideal for telecom interface applications.
WFM200S022XNA3
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;
AX5043-1-TW30
AX5043-1-TW30 by Onsemi is a telecom IC with CMOS technology, operating at -40 to 85°C. It features a data rate of 0.125 Mbps, 28 terminals in a square chip carrier package, and terminal pitch of 0.5 mm. Ideal for telecom circuits, this IC has a nominal voltage of 3V and peak reflow temperature of 260°C.
TLK2711AIRCP
TLK2711AIRCP by Texas Instruments is a telecom IC with 64 terminals, operating at 2.5V. It has a temperature range of -40 to 85°C and features a flatpack package style. Ideal for telecom circuit applications due to its industrial-grade performance and very thin profile design.
BM70BLES1FC2-0B05BA
BM70BLES1FC2-0B05BA by Microchip Technology is a telecom interface IC with surface mount capability. It operates in an industrial temperature range of -40 to 85 °C and has a data rate of 0.0086 Mbps. This IC is commonly used in telecom circuits for various applications.
BGM13P22F512GA-V2R
TELECOM CIRCUIT;
BQ51013BRHLT
BQ51013BRHLT by Texas Instruments is a Telecom IC with 20 terminals, operating b/w -40 to 125°C. It has a supply voltage of 5V and data rate of 0.002 Mbps, suitable for automotive applications due to its nickel/palladium/gold terminal finish. The chip carrier package style with very thin profile makes it ideal for surface mount designs.
TMS3705EDRQ1
TMS3705EDRQ1 by Texas Instruments is a telecom IC with 16 terminals, operating b/w -40 to 85°C. It has a supply voltage of 5V and terminal pitch of 1.27mm. Ideal for industrial applications requiring AEC-Q100 screening level in a small outline package.
OPA380AIDGKRG4
OPA380AIDGKRG4 by Texas Instruments is a telecom IC with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 5V and low supply current of 0.008mA. This small outline IC in square package is ideal for automotive telecom applications.
AX5243-1-TA05
AX5243-1-TA05 by Onsemi is a telecom IC with CMOS technology, operating b/w -40 to 85°C. It features 20 terminals in a square chip carrier package style, suitable for telecom circuit applications. With a nominal voltage of 3V and terminal pitch of 0.5mm, it offers high performance in industrial temperature grades.
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TFF11092HN/N1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
TFF1024HN/N1,115
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: RECTANGULAR; Package Equivalence Code: LCC16,.1X.14,20;
TFF11101HN/N1,118
TFF11094HN
TFF11086HN/N1X
TFF11115HN/N1,111
TFF1007HN/N1,115
TFF11092HN/N1X
TFF1024HN/N1,135
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: RECTANGULAR; Length: 3.5 mm;
TFF11101HN
TFF11094HN/N1,111
TFF11086HN/N1,111
TFF11101HN/N1X
TFF1024HN
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: RECTANGULAR; Terminal Position: QUAD;
TFF11092HN
TFF1007HN
TFF1007HN/N1,118
TFF11086HN
TFF11094HN/N1,118
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