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TFF11115HN

NXP Semiconductors

TFF11115HN by NXP Semiconductors

TFF11115HN by NXP Semiconductors is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 4mm x 4mm square package with 24 terminals and supports a nominal voltage of 3.3V. Ideal for surface mount designs, it ensures efficient thermal management in telecom circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,900 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,900

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Anansix

USA . 1,619 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,619

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Vyrian

USA . 934 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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934

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 866 parts In-Stock

1+ parts

$726.000

100+ parts

-

1k+ parts

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10k+ parts

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866

$726.000

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UNI Independent Distributors

Spain . 5,826 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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5,826

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Corphita

USA . 589 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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589

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Overview

Unlock superior performance with the TFF11115HN from NXP Semiconductors, a trusted leader in innovative tech solutions. This versatile telecom interface IC is designed for industrial applications, delivering unmatched reliability and efficiency in challenging environments. With its compact and robust design, customers gain enhanced functionality while reducing space constraints. Experience the perfect blend of quality and value—choose TFF11115HN to elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making the IC suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, making installation easier and reducing overall product size.

Package Shape: SQUARE

The square package shape provides uniform distribution of thermal and electrical properties, facilitating better performance in integrated circuits.

No. of Terminals: 24

With 24 terminals, this IC offers multiple connection points for enhanced functionality and versatility in telecom applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile enables efficient thermal management and allows integration into tighter spaces, enhancing design flexibility.

Maximum Operating Temperature: 85 °C

This specification ensures reliable functionality in hotter environments, making the IC suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating at low temperatures allows for reliable performance in extreme conditions, making it ideal for outdoor and rugged applications.

Terminal Position: QUAD

Quad terminal positioning enables better signal integrity and reduces interference, which is critical for telecom applications.

Maximum Seated Height: 1 mm

The low profile minimizes space requirements on the PCB while facilitating heat dissipation, ideal for modern compact designs.

Width: 4 mm

A compact width aids in designing smaller devices, making the IC versatile for various telecom equipment.

Length: 4 mm

This small length enhances layout efficiency on PCBs, allowing for more components in tight spaces.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, ensuring reliability and performance in harsh environments typical of telecom installations.

Terminal Form: NO LEAD

No lead design facilitates lead-free soldering processes, supporting environmentally friendly manufacturing practices.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, it ensures compatibility and high performance in communication systems.

Nominal Supply Voltage: 3.3 V

Operating at a low voltage level enhances energy efficiency, making it suitable for battery-powered devices.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density component layouts, maximizing space utilization on PCBs.

Technical Specifications

Other Function Telecom Interface ICs TFF11115HN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TFF11115HN Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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