Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TFF11115HN by NXP Semiconductors is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 4mm x 4mm square package with 24 terminals and supports a nominal voltage of 3.3V. Ideal for surface mount designs, it ensures efficient thermal management in telecom circuits.
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Digiode
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Anansix
Vyrian
One Stop Electronics
$726.000
UNI Independent Distributors
Corphita
The use of plastic/epoxy material ensures durability and protection against environmental factors, making the IC suitable for various applications.
Surface mount technology allows for compact design and efficient use of PCB space, making installation easier and reducing overall product size.
The square package shape provides uniform distribution of thermal and electrical properties, facilitating better performance in integrated circuits.
With 24 terminals, this IC offers multiple connection points for enhanced functionality and versatility in telecom applications.
The thin profile enables efficient thermal management and allows integration into tighter spaces, enhancing design flexibility.
This specification ensures reliable functionality in hotter environments, making the IC suitable for industrial applications.
Operating at low temperatures allows for reliable performance in extreme conditions, making it ideal for outdoor and rugged applications.
Quad terminal positioning enables better signal integrity and reduces interference, which is critical for telecom applications.
The low profile minimizes space requirements on the PCB while facilitating heat dissipation, ideal for modern compact designs.
A compact width aids in designing smaller devices, making the IC versatile for various telecom equipment.
This small length enhances layout efficiency on PCBs, allowing for more components in tight spaces.
Rated for industrial temperature ranges, ensuring reliability and performance in harsh environments typical of telecom installations.
No lead design facilitates lead-free soldering processes, supporting environmentally friendly manufacturing practices.
Designed specifically for telecom applications, it ensures compatibility and high performance in communication systems.
Operating at a low voltage level enhances energy efficiency, making it suitable for battery-powered devices.
A fine terminal pitch allows for high-density component layouts, maximizing space utilization on PCBs.
Other Function Telecom Interface ICs TFF11115HN attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
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Telecom IC Type:
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TFF11115HN Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
CRCW040210K0FKED
Vishay Intertechnology
Vishay Intertechnology's CRCW040210K0FKED is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.063 W power dissipation. Ideal for surface mount applications in electronics due to its compact SMT package style and high operating temperature range of -55 to 155 °C.
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
1N4148WT
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW06031K00FKEAHP
Vishay Intertechnology's CRCW06031K00FKEAHP is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.33 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 standard compliance and operating voltage of 75 V.
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
LM358ADR
Texas Instruments
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
1N4148
Sun Wai Electronic
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Reverse Recovery Time: .004 us; Maximum Repetitive Peak Reverse Voltage: 100 V;
M39029/58-360
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
1552200168
Molex
WIRE AND CABLE;
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
SMBJ18CA
Secos
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Siemens
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain-Source On Resistance: 3.5 ohm; Terminal Finish: Tin/Lead (Sn/Pb);
DS18B20Z+T&R
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
ABS25-32.768KHZ-1-T
Abracon
Abracon's ABS25-32.768KHZ-1-T crystal oscillator offers 10 ppm frequency tolerance, 126% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal operating frequency, such as IoT devices and precision timing systems.
C1206C104K5RACTU
KEMET Corporation
KEMET C1206C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications due to its rectangular package shape and wraparound terminals.
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
EYSHSNZWZ
Kaga Electronics
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 28; Package Shape: RECTANGULAR; JESD-30 Code: R-XBGA-N28; Minimum Operating Temperature: -40 Cel;
MAX7042ATJ
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
ESP32-PICO-D4
Espressif Systems (Shanghai)
ESP32-PICO-D4 by Espressif Systems is a telecom IC with 48 terminals in a square package. Operating from -40 to 85°C, it has a supply voltage of 3.3V. Ideal for industrial applications, this surface-mount IC is designed for telecom circuits with a terminal pitch of 0.5mm.
MAX3946ETG+T
Analog Devices
MAX3946ETG+T by Analog Devices is a 24-terminal telecom IC with 3.3V supply voltage, operating from -40 to 95°C. It features a square chip carrier package style, matte tin finish, and industrial temperature grade. Ideal for telecom circuits, it has a terminal pitch of 0.5mm and no-lead terminal form.
SN65DSI86IPAPQ1
SN65DSI86IPAPQ1 by Texas Instruments is a telecom interface IC with 64 terminals in a square package. It operates b/w -40 to 85°C, with terminal finish of NiPdAu. This IC is suitable for industrial applications requiring a nominal voltage of 1.2V and features gull wing terminal form.
AD73311ARS-REEL
AD73311ARS-REEL by Analog Devices is a 16-bit linear coding telecom IC with 20 terminals in a small outline package. Operating b/w -40 to 85°C, it has a supply voltage of 3V and max gain tolerance of 1dB. Ideal for telecom circuits, this CMOS technology IC features a filter and tin lead terminal finish.
453-00005
Laird Technologies
453-00005 by Laird Technologies is a surface mount telecom IC with 39 terminals. Operating b/w -40 to 85°C, it has a compact rectangular package style measuring 14x10x2.33mm. Ideal for industrial applications requiring a 3V supply voltage and telecom circuit functionality.
NINA-B112-04B
U-blox Ag
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 4;
TM266DVA1
Inrcore
TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP28,.5;
Taiyo Yuden
EYSHSNZWZ by Taiyo Yuden is a RECTANGULAR telecom IC with 28 terminals, HYBRID technology, and 3V supply voltage. It operates b/w -40°C to 85°C, suitable for telecom circuit applications requiring compact design with surface mount capability.
MD0101K6-G
Microchip Technology
MD0101K6-G by Microchip Tech is a telecom IC with 18 terminals in a small outline package. Operating temp range from -40 to 125°C makes it suitable for automotive applications. Terminal finish of NiPdAu ensures reliable performance in various environments.
PN5321A3HN/C106
NXP Semiconductors
PN5321A3HN/C106 by NXP Semiconductors is a telecom IC with 40 terminals in a square chip carrier package. Operating from -30 to 85°C, it features nickel palladium gold terminal finish and quad position. With a compact size of 6x6mm and 0.5mm pitch, it's ideal for telecom circuit applications.
ATWILC1000-MR110UB
ATWILC1000-MR110UB by Microchip Technology is a surface mount telecom interface IC with 1 function. It operates at temperatures ranging from -40 to 85 °C and has a data rate of 72.2 Mbps. This IC is commonly used in industrial applications requiring a nominal voltage of 3.3 V.
PN5120A0HN1/C2,118
NXP Semiconductors PN5120A0HN1/C2,118 is a telecom IC with 32 terminals in a square chip carrier package. Operating at -30 to 85°C, it supports power supplies of 1.8/3.3V and 2.5/3.3V for various applications requiring surface mount technology and moisture sensitivity level of 1.
NRF51822-CFAC-R7
Nordic Semiconductor Asa
NRF51822-CFAC-R7 by Nordic Semiconductor Asa is a telecom IC with 62 terminals in a square grid array package. It operates b/w -25°C to 75°C, with a supply voltage of 1.8V. Ideal for applications requiring fine pitch and thin profile components in the commercial extended temperature range.
SIM7000G
Simcom Wireless Solutions
SIM7000G by Simcom Wireless Solutions is a telecom IC with 68 terminals, operating from -40 to 85°C. It supports data rates up to 0.375 Mbps and operates at a nominal voltage of 3.8V. Ideal for industrial applications requiring reliable communication in harsh environments.
SX1276IMLTRT
Semtech
Semtech's SX1276IMLTRT is a 28-terminal IC with 3.3V supply, operating from -40 to 85°C. Telecom circuit type with 0.65mm pitch, ideal for industrial applications requiring low-profile square package and matte tin finish.
OPA380AIDGKT
OPA380AIDGKT by Texas Instruments is a telecom interface IC with 8 terminals, operating at -40 to 125°C. It has a supply voltage of 5V and low supply current of 0.008mA, suitable for automotive applications. The package is small outline, thin profile, with gull wing terminals and moisture sensitivity level of 2.
AD9671KBCZ
AD9671KBCZ by Analog Devices is a 144-terminal GRID ARRAY IC with low profile and fine pitch. Operating b/w 0-85°C, it has a supply voltage of 1.4V and terminal pitch of 0.8mm. Ideal for telecom circuits, its package is made of PLASTIC/EPOXY and is surface mountable for various applications.
EFR32BG22C224F512GM40-C
Silicon Labs
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 2; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 40; Terminal Finish: MATTE TIN; Peak Reflow Temperature (C): 260;
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TFF11092HN/N1
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
TFF1024HN/N1,115
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: RECTANGULAR; Package Equivalence Code: LCC16,.1X.14,20;
TFF11101HN/N1,118
TFF11094HN
TFF11086HN/N1X
TFF11115HN/N1,111
TFF1007HN/N1,115
TFF11092HN/N1X
TFF1024HN/N1,135
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: RECTANGULAR; Length: 3.5 mm;
TFF11101HN
TFF11094HN/N1,111
TFF11086HN/N1,111
TFF11101HN/N1X
TFF1024HN
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: RECTANGULAR; Terminal Position: QUAD;
TFF11092HN
TFF1007HN
TFF1007HN/N1,118
TFF11086HN
TFF11094HN/N1,118
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