Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SA5212AD/01,112
NXP Semiconductors
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G8
e4
4.9 mm
1
8
85 Cel
-40 Cel
PLASTIC/EPOXY
SOP
RECTANGULAR
SMALL OUTLINE
Not Qualified
1.75 mm
5 V
YES
BIPOLAR
TELECOM CIRCUIT
INDUSTRIAL
NICKEL PALLADIUM GOLD
GULL WING
1.27 mm
DUAL
3.9 mm
SA5212AD/01,118
SA5217D/01,112
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G20
12.8 mm
20
2.65 mm
7.5 mm
SA5217D/01,118
SA58646BD,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
S-PQFP-G64
e3
10 mm
64
LFQFP
SQUARE
FLATPACK, LOW PROFILE, FINE PITCH
1.6 mm
3 V
BICMOS
TIN
.5 mm
QUAD
SA602AN/01,112
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
R-PDIP-T8
9.5 mm
DIP
IN-LINE
4.2 mm
6 V
NO
THROUGH-HOLE
2.54 mm
7.62 mm
SA612AN/01,112
SA612AN/01,112 by NXP Semiconductors is an 8-terminal IC with a rectangular package style. Operating b/w -40°C to 85°C, it has a nominal voltage of 6V and terminal pitch of 2.54mm. Ideal for telecom circuits, this IC features nickel palladium gold terminal finish and is designed for industrial temperature grades.
SA602AD/01,112
SA602AD/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating from -40 to 85°C, it has a supply voltage of 3V and terminal pitch of 0.65mm. Ideal for telecom circuits, this IC is surface mountable and features nickel/palladium/gold/silver terminal finish.
6.5 mm
LSSOP
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
260
1.5 mm
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
.65 mm
30
4.4 mm
SA602AD/01,118
SA602AD/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features nickel palladium gold silver terminal finish and 3V nominal voltage.
NICKEL PALLADIUM GOLD SILVER
SA606D/01,112
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
SA606D/01,118
SA606D/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature ranges from -40 to 85°C. It features nickel palladium gold terminal finish and is ideal for telecom circuit applications.
SA606DK/01,112
SA606DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel/palladium/gold terminal finish and Gull Wing form factor.
Nickel/Palladium/Gold (Ni/Pd/Au)
SA606DK/01,118
SA606DK/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, with terminal finish of nickel palladium gold. Ideal for telecom circuits requiring nominal voltage of 3V and industrial temperature grade.
SA607DK/01,112
SA607DK/01,118
SA612AD/01,112
SA612AD/01,112 by NXP Semiconductors is an 8-terminal telecom IC with a supply voltage of 3V. It operates b/w -40 to 85°C and has a peak reflow temperature of 260°C. This small outline, low profile IC is ideal for telecom circuit applications.
SA612AD/01,118
SA612AD/01,118 by NXP Semiconductors is an 8-terminal telecom IC with a supply voltage of 3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This small outline IC is suitable for telecom circuit applications due to its dual terminal position and gull wing form factor.
SA616DK/01,112
SA616DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features nickel palladium gold terminal finish and gull wing form factor for telecom circuit applications.
SA616DK/01,118
SA616DK/01,118 by NXP Semiconductors is a telecom interface IC with 1 function. It has a small outline, low profile package style and operates at temperatures ranging from -40 to 85 °C. It is suitable for telecom circuit applications.
SA636DK/01,112
SA636DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features include nickel palladium gold terminal finish, 3V supply voltage, and gull wing terminal form for telecom circuit applications.
SSOP20,.25
SA636DK/01,118
SA636DK/01,118 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features nickel palladium gold terminal finish and 3V nominal voltage for telecom circuit applications.
SA639DH/01,112
SA639DH/01,112 by NXP Semiconductors is a telecom interface IC with 24 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features nickel palladium gold terminal finish and 3V nominal voltage for reliable telecom circuit performance.
R-PDSO-G24
7.8 mm
24
TSSOP
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
1.1 mm
HTRM800/AED,122
TELECOM CIRCUIT; Temperature Grade: OTHER; Maximum Operating Temperature: 70 Cel; Qualification: Not Qualified; Package Body Material: PLASTIC/EPOXY; Nominal Negative Supply Voltage: -15 V;
-15 V
70 Cel
-25 Cel
MODULE(UNSPEC)
MICROELECTRONIC ASSEMBLY
+-15
Other Telecom ICs
.55 mA
15 V
OTHER
UAA3201T/V1,112
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G16
16
SOP16,.25
3.5/6
UAA3220TS/V1,118
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
8.2 mm
SSOP
SMALL OUTLINE, SHRINK PITCH
2 mm
5.3 mm
PN5110A0HN1/C2,157
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N32
5 mm
32
-30 Cel
HVQCCN
LCC32,.2SQ,20
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
1.8/3.3
1 mm
.1 mA
CMOS
COMMERCIAL EXTENDED
NO LEAD
PN5120A0HN1/C1,157
PN5120A0HN1/C1,157 by NXP Semiconductors is a telecom interface IC with 32 terminals in a square package. Operating at -30 to 85°C, it supports power supplies of 1.8/3.3V and 2.5/3.3V. Ideal for telecom circuits, this chip carrier has a very thin profile and nickel palladium gold finish for robust performance in various applications.
1.8/3.3,2.5/3.3
SA5211D,602
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
R-PDSO-G14
8.65 mm
14
SOP14,.25
5
.031 mA
40
SA5212AD,602
SOP8,.25
.033 mA
SA602AD,602
SA602AD,602 by NXP Semiconductors is an 8-terminal telecom IC with a supply voltage of 6V. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package style. Ideal for telecom circuits, it features gull wing terminals and is surface mountable.
SA606DK,112
SA606DK,112 by NXP Semiconductors is a telecom interface IC with 20 terminals. It operates b/w -40 to 85°C and has a supply voltage of 3V. With a small outline package style, it's ideal for industrial telecom circuit applications.
SA606DK,118
SA606DK,118 by NXP Semiconductors is a telecom interface IC with 20 terminals. It operates b/w -40 to 85°C and has a supply voltage of 3V. The package is small outline, low profile, ideal for industrial telecom circuit applications.
SA612AN,112
SA612AN,112 by NXP Semiconductors is an 8-terminal telecom interface IC with a rectangular package style. It operates b/w -40 to 85°C and has a nominal voltage of 6V. Ideal for industrial applications requiring reliable telecom circuitry in compact designs.
250
SA636DK,112
SA636DK,118
SA639DH,512
SA639DH,512 by NXP Semiconductors is a Telecom Interface IC with 24 terminals. It operates at temperatures from -40 to 85°C and has a supply voltage of 3V. The package style is small outline, thin profile, shrink pitch making it suitable for industrial telecom circuit applications.
TSSOP24,.25
3/5
.01 mA
SA647DH,112
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: TSSOP; Package Shape: RECTANGULAR;
SA647DH,118
PN5180A0ET/C1QL
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; JESD-609 Code: e1;
e1
TIN SILVER COPPER
PN5180A0ET/C2QL
TELECOM CIRCUIT; Terminal Finish: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; JESD-609 Code: e1;
MWCT1012VLF
TELECOM CIRCUIT; JESD-609 Code: e3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;
3
SA636DK/02J
SA636DK/02J by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial applications. Features nickel palladium gold terminal finish, 3V supply voltage, and peak reflow temperature of 260°C.
TFF1024HN/N1,135
RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: RECTANGULAR; Length: 3.5 mm;
R-PQCC-N16
3.5 mm
LCC16,.1X.14,20
RF AND BASEBAND CIRCUIT
2.5 mm
MFRC52302HN1,157
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;
PN7150B0HN/C11004E
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;
S-PQCC-N40
6 mm
LCC40,.24SQ,20
2.75 V
PN7150B0HN/C11004Y
BGU8004X
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;
R-PBGA-B6
6
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
.32 mm
1.8 V
BALL
.22 mm
BOTTOM
.44 mm
BGU8004Z
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