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MWCT1R24ZVHT

NXP Semiconductors

MWCT1R24ZVHT by NXP Semiconductors

TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: NICKEL GOLD; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 40;

Median Price

$7.098

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 525 parts In-Stock

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Verical

USA . 525 parts In-Stock

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Digiode

USA . 4,776 parts In-Stock

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Vyrian

USA . 2,746 parts In-Stock

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Anansix

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Distributors (Availability)

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AZTECH Wire

Italy . 56 parts In-Stock

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Microchip USA

USA . 2,932 parts In-Stock

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UNI Independent Distributors

Spain . 5,534 parts In-Stock

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Corphita

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Technical Specifications

Other Function Telecom Interface ICs MWCT1R24ZVHT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Telecom IC Type:

Terminal Finish:

NICKEL GOLD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MWCT1R24ZVHT Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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