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MWCT1111CLH

NXP Semiconductors

MWCT1111CLH by NXP Semiconductors

The NXP Semiconductors MWCT1111CLH is a telecom interface IC with 64 terminals, operating temperature range of -40 to 85°C, and supply voltage of 3.3V. It is designed for telecom circuits in industrial applications requiring surface mount packaging with gull wing terminals.

Median Price

$3.440

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 24,530 parts In-Stock

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$3.440

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$3.440

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Flip Electronics (Authorized)

USA . 24,530 parts In-Stock

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24,530

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Rochester

USA . 1,645 parts In-Stock

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$3.230

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$2.890

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$2.720

1,645

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$3.230

$2.890

$2.720

Verical

USA . 960 parts In-Stock

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$7.513

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960

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$7.513

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Distributors (In-Stock)

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Digiode

USA . 1,752 parts In-Stock

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$3.401

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1,752

$3.401

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Vyrian

USA . 2,927 parts In-Stock

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$3.580

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Flip Electronics

USA . 24,530 parts In-Stock

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Anansix

USA . 1,157 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,309 parts In-Stock

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$3.222

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2,309

$3.222

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Component Stockers USA

USA . 1,822 parts In-Stock

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$4.110

100+ parts

$3.870

1k+ parts

$3.490

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1,822

$4.110

$3.870

$3.490

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One Stop Electronics

USA . 6,669 parts In-Stock

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$6.620

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6,669

$6.620

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Microchip USA

USA . 7,490 parts In-Stock

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$17.724

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$17.724

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Kepictronics

USA . 68,204 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 11,691 parts In-Stock

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Lixinc

USA . 7,198 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,717 parts In-Stock

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UNI Independent Distributors

Spain . 5,933 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Overview

Upgrade your telecom interface systems with the MWCT1111CLH by NXP Semiconductors. This high-quality product boasts reliability and efficiency, making it a top choice for various applications. With its advanced technology and durable construction, this telecom IC offers unparalleled performance and functionality. Experience seamless communication and enhanced connectivity with the MWCT1111CLH, providing you with exceptional value and benefits that cater to your specific needs. Elevate your projects with this superior solution from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for telecom applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto printed circuit boards, saving time and cost in production processes.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options, allowing for more features and functionality in the device.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and performance in a wide range of operating environments.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is commonly used in telecom applications, ensuring compatibility with existing systems.

Technical Specifications

Other Function Telecom Interface ICs MWCT1111CLH attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Trade Compliance

MWCT1111CLH Telecommunications trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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