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SL2S2102FUD,003

NXP Semiconductors

SL2S2102FUD,003 by NXP Semiconductors

SL2S2102FUD,003 by NXP Semiconductors is a CMOS telecom IC with 4 terminals. It operates in industrial temperature range (-40 to 85°C) and is surface mountable. Ideal for telecom circuit applications due to its uncased chip package style.

Median Price

$0.175

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 10,000 parts In-Stock

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$0.175

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$0.175

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Vyrian

USA . 4,629 parts In-Stock

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4,629

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Digiode

USA . 2,862 parts In-Stock

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Anansix

USA . 1,850 parts In-Stock

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Nova Conductors

Japan . 58 parts In-Stock

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58

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Distributors (Availability)

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AZTECH Wire

Italy . 729 parts In-Stock

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$7.021

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729

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One Stop Electronics

USA . 1,575 parts In-Stock

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$36.000

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Ampacity Inc.

Singapore . 543 parts In-Stock

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$354.000

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543

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Argo Parts USA

USA . 4,228 parts In-Stock

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UNI Independent Distributors

Spain . 2,012 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,581 parts In-Stock

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Corphita

USA . 459 parts In-Stock

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459

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Enhance your telecom equipment with the SL2S2102FUD,003 by NXP Semiconductors. This high-quality telecom circuit offers superior performance and reliability, thanks to NXP's reputation as a leading manufacturer in the industry. With its surface mount capability and industrial temperature grade, this product is perfect for a wide range of applications. Experience the value and benefits of this innovative technology, designed to meet your needs and exceed your expectations. Upgrade your devices with the SL2S2102FUD,003 and stay ahead in today's fast-paced telecommunications market.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and reducing overall production costs.

No. of Terminals: 4

Having a low number of terminals simplifies the design and integration process, making it easier to work with.

Package Style (Meter): UNCASED CHIP

The unencased chip package style provides flexibility in terms of mounting and integration options, allowing for customized solutions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions, ensuring reliability and longevity.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range indicates that this product can perform effectively in extreme cold conditions, making it suitable for various environments.

Terminal Position: UPPER

The upper terminal position makes it easier to connect and interface with other components, enhancing ease of use and compatibility.

Temperature Grade: INDUSTRIAL

Being industrial-grade means this product is designed to meet the durability and performance requirements of industrial applications, making it a reliable choice for demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient operation and reliable performance.

Terminal Form: NO LEAD

The no-lead terminal form factor simplifies the manufacturing process and improves reliability, making it a cost-effective and dependable option.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed for telecom circuits, this product offers optimized performance and functionality for telecommunications applications, ensuring seamless communication.

Technical Specifications

Other Function Telecom Interface ICs SL2S2102FUD,003 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

X-XUUC-N4

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SL2S2102FUD,003 Telecommunications trade compliance attributes, and parameters.

HTS

8542.32.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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