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SL2S1502FTB

NXP Semiconductors

SL2S1502FTB by NXP Semiconductors

SL2S1502FTB by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline, very thin profile makes it ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,028 parts In-Stock

1+ parts

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4,028

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Vyrian

USA . 3,331 parts In-Stock

1+ parts

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1k+ parts

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3,331

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Anansix

USA . 915 parts In-Stock

1+ parts

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915

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 600 parts In-Stock

1+ parts

$112.000

100+ parts

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600

$112.000

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UNI Independent Distributors

Spain . 4,997 parts In-Stock

1+ parts

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4,997

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Corphita

USA . 1,660 parts In-Stock

1+ parts

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1,660

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Overview

Unlock seamless connectivity with the SL2S1502FTB from NXP Semiconductors, a leader in innovation and reliability. This compact telecom interface IC is designed for diverse applications, delivering exceptional performance even in demanding environments. With its industrial-grade temperature range and low-profile design, it guarantees durability and efficiency. Elevate your projects with unmatched quality and versatility, ensuring your systems remain at the forefront of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy for the package body ensures durability and protection from environmental factors, making this product ideal for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern electronic circuits, saving space on PCBs.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout designs on circuit boards, optimizing space usage and component placement.

No. of Terminals: 3

With 3 terminals, this IC enables versatile configuration options while maintaining a simple connection scheme for easy integration.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The very thin profile of the small outline package allows for high-density layouts, making it ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for applications that require reliable performance in potentially hot environments.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C means the IC can function effectively in harsh, cold conditions, enhancing its versatility.

Terminal Position: DUAL

Dual terminal position allows for flexible routing on PC boards, optimizing connectivity and reducing layout complications.

Maximum Seated Height: 0.5 mm

A maximum seated height of 0.5 mm contributes to a low profile for the IC, making it suitable for ultra-thin devices.

Width: 1 mm

At just 1 mm wide, this component supports compact design requirements, allowing for efficient use of space in electronic projects.

Length: 1.45 mm

The small length of 1.45 mm helps maintain a slim profile, essential for miniaturizing electronic systems and enhancing portability.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this IC is built to withstand demanding environments, ensuring longevity and reliability in critical applications.

Technology: CMOS

Utilizing CMOS technology means low power consumption and high noise immunity, making this IC efficient and suitable for battery-powered devices.

Terminal Form: NO LEAD

A no-lead design enhances reliability and reduces the risk of solder joint failure, leading to improved product longevity.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically as a telecom circuit IC, it offers optimized performance for communication applications, ensuring efficient signal processing.

Terminal Pitch: 0.55 mm

A terminal pitch of 0.55 mm allows for greater density of connections on PCBs, making it suitable for compact designs with many components.

Technical Specifications

Other Function Telecom Interface ICs SL2S1502FTB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N3

Length:

1.45 mm

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Maximum Seated Height:

.5 mm

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.55 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

SL2S1502FTB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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