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SL2S2002FUD

NXP Semiconductors

SL2S2002FUD by NXP Semiconductors

SL2S2002FUD by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It features a wide operating temperature range from -40 °C to 85 °C, a no-lead terminal form, and surface mount capability. Ideal for reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,780 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,780

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-

-

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Vyrian

USA . 2,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,585

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-

-

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Anansix

USA . 575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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575

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,397 parts In-Stock

1+ parts

$717.000

100+ parts

-

1k+ parts

-

10k+ parts

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1,397

$717.000

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Corphita

USA . 4,084 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,084

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UNI Independent Distributors

Spain . 4,005 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,005

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-

-

-

Perfect Parts

USA . 3 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3

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Overview

Unlock seamless connectivity with the SL2S2002FUD from NXP Semiconductors, a trusted leader in innovative tech solutions. This versatile telecom interface IC offers exceptional performance in demanding environments, ensuring reliability from industrial temperatures of -40 °C to 85 °C. Perfect for diverse applications, its compact design enables easy integration while enhancing your products' quality and longevity. Experience the superior value and benefits that only NXP can deliver!

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easier integration into compact designs, making it suitable for modern electronics where space efficiency is critical.

No. of Terminals: 4

With 4 terminals, this product offers a simple and effective connection method, facilitating ease of use in various applications while minimizing complexity.

Package Style (Meter): UNCASED CHIP

The unencased chip package style provides versatility for custom applications, enabling designs that require direct chip-on-board connections.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in many industrial environments, where heat dissipation can be a challenge.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40 °C makes this telecom interface IC ideal for outdoor and harsh conditions, assuring performance in a wide range of climates.

Terminal Position: UPPER

The upper terminal position facilitates better access and integration into circuit designs, helping engineers to optimize layout for PCB assembly.

Temperature Grade: INDUSTRIAL

Being classified as industrial-grade means this IC is designed for durability and long-term performance in demanding applications, ensuring longevity and reliability.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making this product suitable for battery-operated devices in telecom applications.

Terminal Form: NO LEAD

The no lead terminal form reduces the product's footprint and allows for greater flexibility in circuit design, enhancing layout options for manufacturers.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, it is specifically designed for telecommunications applications, ensuring optimized performance for signal processing and transmission.

Technical Specifications

Other Function Telecom Interface ICs SL2S2002FUD attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

X-XUUC-N4

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

SL2S2002FUD Telecommunications trade compliance attributes, and parameters.

HTS

8542.32.00

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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