Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SL2S2002FTB by NXP Semiconductors is a telecom IC with 3 terminals, CMOS technology, and industrial temperature grade. It has a small outline package style, tin terminal finish, and operates b/w -40 to 85 °C. Ideal for telecom interface applications due to its thin profile and dual terminal position.
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$896.000
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This material provides durability and flexibility, making it a reliable choice for various telecom interface applications.
The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.
The rectangular shape offers a compact design that maximizes space on PCBs, making it ideal for applications with limited area availability.
With three terminals, this IC provides simplified connectivity options, making it user-friendly for circuit integration and troubleshooting.
The small outline and thin profile design enhance space efficiency and promote airflow, reducing heat buildup for improved performance.
The high maximum operating temperature allows for reliable operation in various environments, ensuring consistent performance under challenging conditions.
The low minimum operating temperature range enables functionality in cold environments, making it versatile for use in diverse settings.
The tin terminal finish provides corrosion resistance and low electrical resistance, ensuring a stable and long-lasting connection.
The dual terminal position offers versatility in circuit design and installation, accommodating different wiring configurations for enhanced flexibility.
The low seated height minimizes the IC's footprint on the PCB, allowing for compact and space-efficient designs in telecom applications.
Other Function Telecom Interface ICs SL2S2002FTB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Qualification:
Maximum Seated Height:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
SL2S2002FTB Telecommunications trade compliance attributes, and parameters.
HTS
8542.32.00
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
2N2222A
Micro Commercial Components
Small Signal Bipolar Transistors; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-609 Code: e0;
SS14
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
BAV99
Infinex
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
General Instrument
1552200168
Molex
WIRE AND CABLE;
MMBT3906LT1G
Onsemi
MMBT3906LT1G by Onsemi is a PNP BJT with VCEsat of 0.4V, hFE of 30, and fT of 250MHz. Ideal for small signal applications in electronics due to its low power dissipation, high transition frequency, and compact SOT-23 package. Suitable for use in temperature-sensitive environments with an operating range from -65°C to 150°C.
Frontier Electronics
1N4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
M39029/58-360
TE Connectivity
TE Connectivity's M39029/58-360 is a CRIMP terminal backshell for 22-28 AWG wires, rated at 5A. Ideal for male contacts in Mil-Spec applications, it offers a cross-section area of 0.34 mm2 and ensures secure connections in demanding environments.
BSS138BK,215
NXP Semiconductors
NXP Semiconductors' BSS138BK,215 is a N-CHANNEL FET with 0.36A max drain current and 0.42W power dissipation. Ideal for applications requiring single configuration and surface mount technology, such as enhancement mode operation in temperatures up to 150°C.
ULN2803ADWR
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
SMBJ18CA
Continental Device India
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
LL4148
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
CYBT-343026-01
Infineon Technologies
Infineon's CYBT-343026-01 is a telecom IC with 24 terminals in a rectangular microelectronic assembly. Operating b/w -30°C to 85°C, it has a compact size of 12mm width and 15.5mm length with no-lead terminal form. Ideal for telecom interfaces, this surface-mount IC is suitable for various applications requiring reliable connectivity in limited space environments.
CLRC66301HN
CLRC66301HN by NXP Semiconductors is a telecom IC with 32 terminals, operating b/w -25°C to 85°C. It has a nominal voltage of 5V and terminal pitch of 0.5mm. This chip carrier is used in telecom circuits for various applications due to its compact size and surface-mount capability.
MGM240PB22VNA3
Silicon Labs
TELECOM CIRCUIT;
EFR32BG22C224F512GM32-C
TELECOM CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 2; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 40;
MFRC63102HN,151
The NXP Semiconductors MFRC63102HN,151 is a telecom interface IC with 32 terminals in a square chip carrier package. Operating temperature range from -25 to 85 °C, with data rate of 0.4 Mbps. Ideal for telecom circuits requiring a nominal voltage of 5V and surface mount compatibility.
ZM3102AE-CME1
ZM3102AE-CME1 by Silicon Labs is a surface mount telecom IC with 1 function and 18 terminals. It has a data rate of 0.04 Mbps and is used in telecom circuits.
WL1835MODGBMOCR
The Texas Instruments WL1835MODGBMOCR is a telecom IC with 100 terminals in a rectangular grid array package. It operates at temperatures from -20 to 70°C, with a supply voltage of 3.7V and data rate of 100 Mbps. Ideal for telecom circuits, it features surface mount capability and nickel palladium gold terminal finish.
AD73311ARSZ-REEL
Analog Devices
AD73311ARSZ-REEL by Analog Devices is a 16-bit linear coding telecom IC with 20 terminals and a 3/5 V supply voltage. It operates in industrial temperature range (-40 to 85°C) and features a filter for precise signal processing. This small outline, surface-mount IC is ideal for telecom circuit applications requiring high gain tolerance and CMOS technology.
CYBLE-224116-01
CYBLE-224116-01 by Infineon is a telecom IC with 32 terminals, operating at -40 to 105°C. It has a supply voltage of 3.3V and terminal pitch of 0.76mm. Ideal for industrial applications requiring compact surface-mount telecom interface ICs.
RN42XVU-I/RM
RN42XVU-I/RM by Microchip Technology is a telecom interface IC with 1 function. It has a rectangular package shape with 20 terminals and a max seated height of 2mm. This industrial-grade IC operates at temperatures ranging from -40 to 85°C and has a nominal voltage of 3.3V, making it suitable for various telecom circuit applications.
AT86RF215IQ-ZUR
AT86RF215IQ-ZUR by Microchip Technology is a telecom IC with RF and baseband circuit. It operates at temperatures ranging from -40 to 85 °C, has a package size of 7x7 mm, and uses a terminal pitch of 0.5 mm. It is suitable for applications in telecommunications and other industries.
MRF24J40MD-I/RM
MRF24J40MD-I/RM by Microchip: Telecom IC with 12 terminals, 3.3V supply voltage, -40 to 85°C operating temp range. Ideal for industrial telecom applications requiring a compact MICROELECTRONIC ASSEMBLY package style.
CY7B923-JXI
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
SA638
Philips Semiconductors
Other Telecom ICs; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
AT86RF215-ZUR
Microchip Technology's AT86RF215-ZUR is a 48-terminal RF and baseband circuit IC with a nominal voltage of 3V. It operates in industrial temperature range (-40 to 85°C) and features matte tin terminal finish. This square chip carrier is designed for telecom applications requiring very thin profile package style.
RN41N-I/RM615
Microchip Technology's RN41N-I/RM615 is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm in width and 20.1mm in length, making it suitable for various telecom interface functions.
BM78SPPS5NC2-0002AA
BM78SPPS5NC2-0002AA by Microchip Tech is a RECTANGULAR MICROELECTRONIC ASSEMBLY with 33 terminals. Operating temp: -20 to 70°C, peak reflow temp: 255°C. Used in telecom circuits, it has a nominal voltage of 1.9V and terminal pitch of 1.1mm for commercial applications.
CYBT-353027-02
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 19; Package Shape: SQUARE; JESD-30 Code: S-XXMA-N19;
MFRC53101T/0FE,112
The NXP Semiconductors MFRC53101T/0FE,112 is a telecom interface IC with 32 terminals in a small outline package. It operates b/w -25°C to 85°C, with a nominal voltage of 3.3V. Ideal for telecom circuits, it has a peak reflow temperature of 250°C and terminal pitch of 1.27mm.
AD9363ABCZ
AD9363ABCZ by Analog Devices is a telecom IC with 144 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.3V. Ideal for telecom circuits, it features a low profile design and ball terminal form.
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SL2S2002FTB,115
The NXP Semiconductors SL2S2002FTB,115 is a small outline, very thin profile IC with 3 terminals and CMOS technology. It operates in industrial temperature range (-40 to 85 °C) and is suitable for telecom circuit applications. The package material is plastic/epoxy, surface mountable with tin finish terminals at 0.55mm pitch.
SL2S2102FUD,003
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;
SL2S2102FTB,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: VSON; Package Shape: RECTANGULAR;
SL2S1512FTB
SL2S1502FUF
Other Telecom ICs;
SL2S2002FUD,003
SL2S2102FTB
SL2S1402FUF
SL2S1502FTB
SL2S1512FUD
SL2S1512FUF
SL2S1502FTBX
SL2S1602FUD
SL2S2002FUD
SL2S1412FUF
SL2S1612FUD
SL2S1512FTBX
SL2S1402FUD
SL2S1412FUD
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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