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SL2S2002FTB

NXP Semiconductors

SL2S2002FTB by NXP Semiconductors

SL2S2002FTB by NXP Semiconductors is a telecom IC with 3 terminals, CMOS technology, and industrial temperature grade. It has a small outline package style, tin terminal finish, and operates b/w -40 to 85 °C. Ideal for telecom interface applications due to its thin profile and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,217 parts In-Stock

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Anansix

USA . 1,805 parts In-Stock

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Vyrian

USA . 1,647 parts In-Stock

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Nova Conductors

Japan . 98 parts In-Stock

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AZTECH Wire

Italy . 266 parts In-Stock

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$18.270

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Ampacity Inc.

Singapore . 254 parts In-Stock

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$324.000

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One Stop Electronics

USA . 432 parts In-Stock

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$896.000

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Continental Prestige Electronics

USA . 6,177 parts In-Stock

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UNI Independent Distributors

Spain . 4,509 parts In-Stock

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Corphita

USA . 4,403 parts In-Stock

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Lixinc

USA . 1,936 parts In-Stock

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Bastille Electronics

Australia . 120 parts In-Stock

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Argo Parts USA

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Overview

Experience the cutting-edge technology with the SL2S2002FTB by NXP Semiconductors. This innovative product offers unparalleled quality and reliability, thanks to the expertise of its manufacturer. Designed for telecom interface applications, this small outline, very thin profile IC provides customers with exceptional value and benefits. Trust in NXP Semiconductors to deliver top-of-the-line solutions for all your telecommunication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making it a reliable choice for various telecom interface applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape offers a compact design that maximizes space on PCBs, making it ideal for applications with limited area availability.

No. of Terminals: 3

With three terminals, this IC provides simplified connectivity options, making it user-friendly for circuit integration and troubleshooting.

Package Style: SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile design enhance space efficiency and promote airflow, reducing heat buildup for improved performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable operation in various environments, ensuring consistent performance under challenging conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables functionality in cold environments, making it versatile for use in diverse settings.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and low electrical resistance, ensuring a stable and long-lasting connection.

Terminal Position: DUAL

The dual terminal position offers versatility in circuit design and installation, accommodating different wiring configurations for enhanced flexibility.

Maximum Seated Height: 0.5 mm

The low seated height minimizes the IC's footprint on the PCB, allowing for compact and space-efficient designs in telecom applications.

Technical Specifications

Other Function Telecom Interface ICs SL2S2002FTB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N3

JESD-609 Code:

e3

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.55 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

SL2S2002FTB Telecommunications trade compliance attributes, and parameters.

HTS

8542.32.00

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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