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SL2S2102FTB

NXP Semiconductors

SL2S2102FTB by NXP Semiconductors

SL2S2102FTB by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a -40 °C to 85 °C operating temp range, a very thin profile (0.5mm height), and dual terminal positioning. Ideal for space-constrained environments, it ensures reliable performance in telecom circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,359 parts In-Stock

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2,359

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Anansix

USA . 2,146 parts In-Stock

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2,146

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Digiode

USA . 883 parts In-Stock

1+ parts

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883

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,528 parts In-Stock

1+ parts

$821.000

100+ parts

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1,528

$821.000

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UNI Independent Distributors

Spain . 5,435 parts In-Stock

1+ parts

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5,435

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Corphita

USA . 3,682 parts In-Stock

1+ parts

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3,682

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Perfect Parts

USA . 129 parts In-Stock

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129

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Overview

Unlock unparalleled performance with the SL2S2102FTB from NXP Semiconductors, a leader in innovative solutions. Engineered for reliability in demanding telecom applications, this sleek, compact IC delivers exceptional functionality while enhancing system efficiency. Designed to thrive in extreme temperatures, it promises durability without compromising on quality. Elevate your projects with the trust and expertise that only NXP can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, enhancing the reliability of the IC in various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, making it easier to integrate into small circuit boards, which is vital for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on the PCB, allowing for more components to be placed within a limited area.

No. of Terminals: 3

Having three terminals simplifies connections, making installations and circuit designs straightforward and efficient.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The very thin profile is ideal for space-constrained applications, enabling the design of slimmer devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for industrial applications where it may be exposed to high temperatures.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40 °C ensures functionality in extreme environmental conditions, suitable for outdoor and harsh environments.

Terminal Finish: TIN

Tin terminal finish offers good solderability and enhances the lifespan of the component by preventing oxidation.

Terminal Position: DUAL

The dual terminal position allows for versatile layout configurations, accommodating various circuit designs and helping to optimize space.

Maximum Seated Height: 0.5 mm

A low seated height contributes to a compact design, which is crucial for portable devices and applications where space is at a premium.

Width: 1 mm

A width of just 1 mm provides excellent footprint efficiency, allowing for high-density circuit designs.

Length: 1.45 mm

With a length of 1.45 mm, this IC can fit into very tight spaces, making it suitable for advanced miniaturized electronics.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can withstand more rigorous conditions, making it reliable for critical operations.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, enhancing performance and efficiency in signal processing.

Terminal Form: NO LEAD

The no-lead design minimizes the package size and allows for increased mounting area, improving the device's thermal performance.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit IC ensures its functionality is specifically optimized for communication applications, enhancing connectivity.

Terminal Pitch: 0.55 mm

A terminal pitch of 0.55 mm allows for finer pitch PCB layouts, enabling higher density designs and reducing the overall size of the circuit.

Technical Specifications

Other Function Telecom Interface ICs SL2S2102FTB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N3

JESD-609 Code:

e3

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.55 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

SL2S2102FTB Telecommunications trade compliance attributes, and parameters.

HTS

8542.32.00

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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