Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SL2S1512FTB by NXP Semiconductors is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 3-terminal, very thin profile with a data rate of 0.848 Mbps. Ideal for surface mount technology in telecom circuits.
Median Price
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1k+
Vyrian
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Anansix
Digiode
Microchip USA
$1.166
One Stop Electronics
$192.000
UNI Independent Distributors
Corphita
The use of plastic/epoxy offers durability and resistance to environmental factors, making this product reliable in various conditions.
Surface mount technology allows for compact circuit design and efficient use of space, enhancing overall performance in modern electronic devices.
The rectangular shape enables efficient layout and high-density component placement on printed circuit boards.
Having three terminals is suitable for simple, low-power applications while maintaining functionality, ideal for cost-sensitive designs.
A small outline and very thin profile facilitate integration into compact devices where space is at a premium.
Operating at a maximum temperature of 85 °C ensures reliable performance in higher temperature environments, suitable for industrial applications.
The ability to function down to -40 °C makes this product suitable for extreme environments, enhancing its versatility across various applications.
Dual terminal positioning provides flexibility in layout design, allowing for better component arrangement on the PCB.
A low seated height enables a compact design profile, ensuring successful integration into thin devices without compromising performance.
A width of 1 mm contributes to an ultra-compact design, making it an excellent choice for miniaturized electronic systems.
The short length helps save space on the PCB layout, allowing engineers to optimize their designs for size and performance.
Being rated for industrial temperature grades ensures reliability in harsh conditions, making it suitable for a wide range of industrial applications.
CMOS technology provides low power consumption, making this IC efficient for battery-operated devices and portable applications.
No lead terminal form reduces the footprint and enhances reliability, as it minimizes the risk of solder joint failure.
Designed specifically for telecom applications, this product meets the demands of communication systems, ensuring robust performance.
A terminal pitch of 0.55 mm allows for tighter packing of components, saving space on the PCB without sacrificing electrical performance.
With a data rate of 0.848 Mbps, this IC provides sufficient bandwidth for a variety of communication tasks, ensuring smooth data transmission.
Other Function Telecom Interface ICs SL2S1512FTB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
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JESD-30 Code:
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SL2S1512FTB Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
BAV99
Electronic Devices
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Shandong Yiguang Electronic Joint Stock
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
SMBJ18CA
STMicroelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
LM358D-T
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
GRM155R71H103KA88D
Murata Manufacturing
The Murata Manufacturing GRM155R71H103KA88D is a ceramic capacitor with 0.01uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and high reliability.
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
LM7805CT
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %;
ESP32-WROVER-IB
Espressif Systems (shanghai)
ESP32-WROVER-IB by Espressif Systems is a telecom IC with 150 Mbps data rate, operating at -40 to 85°C. It has 38 terminals in a rectangular package, suitable for surface mount applications. With a nominal voltage of 3.3V, it's ideal for IoT devices and wireless communication systems.
SARA-R510S-00B
U-blox Ag
TELECOM CIRCUIT;
MAX-M10S-00B
MAX-M10S-00B by U-blox Ag is a RECTANGULAR MICROELECTRONIC IC with 18 terminals, operating from -40 to 85°C. It has a width of 9.7mm and length of 10.1mm, suitable for TELECOM CIRCUITS at 3V supply voltage.
SL3S4011FHK,125
SL3S4011FHK,125 by NXP Semiconductors is a telecom interface IC with 8 terminals in a square chip carrier package. Operating at -40 to 85°C, it supports power supplies of 1.8/3.6V for industrial applications. This surface-mount IC has a terminal pitch of 0.5mm and is ideal for telecom circuit integration.
RN42XVU-I/RM
Microchip Technology
RN42XVU-I/RM by Microchip Technology is a telecom interface IC with 1 function. It has a rectangular package shape with 20 terminals and a max seated height of 2mm. This industrial-grade IC operates at temperatures ranging from -40 to 85°C and has a nominal voltage of 3.3V, making it suitable for various telecom circuit applications.
MAX2771ETI+
Analog Devices
Analog Devices' MAX2771ETI+ is a BICMOS telecom IC with 28 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial applications. With a nominal voltage of 2.85V, it's ideal for telecom circuit interfaces requiring precise temperature control.
SIM7600G
Simcom Wireless Solutions
SIM7600G by Simcom Wireless Solutions is a telecom IC with 135 terminals, operating from -40 to 85°C. It supports data rates up to 42 Mbps at a supply voltage of 3.8V. Ideal for industrial applications requiring high-speed cellular connectivity in a compact square package.
JN5168-001-M03Z
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 240;
ST60-SIPT
Laird Technologies
ST60-SIPT by Laird Technologies is a surface mount telecom IC with 84 terminals. Operating temp range: -30 to 85°C. Data rate: 866.7 Mbps, suitable for telecom circuit applications due to its compact rectangular package style and low nominal voltage of 3.3V.
PN5321A3HN/C106,51
PN5321A3HN/C106,51 by NXP Semiconductors is a telecom IC with 40 terminals in a square chip carrier package. Operating b/w -30 to 85°C, it has a nominal voltage of 5V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and has a low profile design.
BGM15LA12E6327XTSA1
Infineon Technologies
BGM15LA12E6327XTSA1 by Infineon is a telecom IC with 12 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It has a nominal voltage of 2.8V and terminal finish of gold nickel, ideal for telecom circuit applications.
BQ51013BYFPT
Texas Instruments
BQ51013BYFPT by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, suitable for AUTOMOTIVE applications. It operates b/w -40 to 125 °C and has a supply voltage of 5 V. With a data rate of 0.002 Mbps, it is ideal for TELECOM CIRCUITS requiring fine pitch and very thin profile packaging.
BGM111A256V2
Silicon Labs
BGM111A256V2 by Silicon Labs is a telecom IC with 31 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1.2mm. This rectangular surface-mount package is ideal for industrial applications requiring reliable telecom circuit interfaces.
MAX2769CETI+T
Maxim Integrated
TELECOM CIRCUIT; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1;
BT832AF
Fanstel
BT832AF by Fanstel is a telecom IC with 1 Mbps data rate, suitable for industrial applications. It features a rectangular microelectronic assembly package style, surface mount design, and operates b/w -40 to 85°C temperatures. With 40 terminals and compact dimensions of 14mm width and 20.8mm length, it offers versatile connectivity options in telecom interfaces.
HMC624ALP4E
Hittite Microwave
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
NRF905-REEL
Nordic Semiconductor Asa
NRF905-REEL by Nordic Semiconductor Asa is a 32-terminal telecom IC with 3V supply voltage. It operates in industrial temperature range (-40 to 85°C) and has a compact square chip carrier package. Ideal for telecom circuits, it features surface mount capability and quad terminal position for versatile applications.
USB3740B-AI9TR
Standard Microsystems
USB3740B-AI9TR by Standard Microsystems is a telecom IC with 10 terminals, operating b/w -40 to 85°C. It has a thin profile chip carrier package style, suitable for industrial applications at 5V supply voltage. With surface mount and quad terminal position, it's ideal for compact telecom circuit designs.
RS9116W-SB00-QMS-B24
CC2530F256RHAR
CC2530F256RHAR by Texas Instruments is a telecom IC with 40 terminals, operating from -40 to 125°C. It has a supply voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3. Ideal for automotive applications due to its nickel palladium gold finish and no-lead terminal form.
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SL2S2002FTB,115
The NXP Semiconductors SL2S2002FTB,115 is a small outline, very thin profile IC with 3 terminals and CMOS technology. It operates in industrial temperature range (-40 to 85 °C) and is suitable for telecom circuit applications. The package material is plastic/epoxy, surface mountable with tin finish terminals at 0.55mm pitch.
SL2S2002FTB
SL2S2002FTB by NXP Semiconductors is a telecom IC with 3 terminals, CMOS technology, and industrial temperature grade. It has a small outline package style, tin terminal finish, and operates b/w -40 to 85 °C. Ideal for telecom interface applications due to its thin profile and dual terminal position.
SL2S2102FUD,003
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 4; Package Code: DIE; Package Shape: UNSPECIFIED;
SL2S2102FTB,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: VSON; Package Shape: RECTANGULAR;
SL2S1502FUF
Other Telecom ICs;
SL2S2002FUD,003
SL2S2102FTB
SL2S1402FUF
SL2S1502FTB
SL2S1512FUD
SL2S1512FUF
SL2S1502FTBX
SL2S1602FUD
SL2S2002FUD
SL2S1412FUF
SL2S1612FUD
SL2S1512FTBX
SL2S1402FUD
SL2S1412FUD
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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