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SL2S1512FTB

NXP Semiconductors

SL2S1512FTB by NXP Semiconductors

SL2S1512FTB by NXP Semiconductors is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 3-terminal, very thin profile with a data rate of 0.848 Mbps. Ideal for surface mount technology in telecom circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,272 parts In-Stock

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3,272

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Anansix

USA . 2,779 parts In-Stock

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2,779

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Digiode

USA . 387 parts In-Stock

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387

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Distributors (Availability)

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Microchip USA

USA . 564 parts In-Stock

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$1.166

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564

$1.166

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One Stop Electronics

USA . 754 parts In-Stock

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$192.000

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754

$192.000

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UNI Independent Distributors

Spain . 5,753 parts In-Stock

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5,753

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Corphita

USA . 488 parts In-Stock

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488

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Overview

Unlock the future of connectivity with the SL2S1512FTB from NXP Semiconductors—your go-to solution for reliable telecom interfaces. Crafted with precision and designed for performance, this compact IC offers unmatched stability across a wide temperature range, perfect for industrial applications. Elevate your projects with NXP’s commitment to quality, ensuring longevity and efficiency in every connection. Experience seamless communication and boost your innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and resistance to environmental factors, making this product reliable in various conditions.

Surface Mount: YES

Surface mount technology allows for compact circuit design and efficient use of space, enhancing overall performance in modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape enables efficient layout and high-density component placement on printed circuit boards.

No. of Terminals: 3

Having three terminals is suitable for simple, low-power applications while maintaining functionality, ideal for cost-sensitive designs.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

A small outline and very thin profile facilitate integration into compact devices where space is at a premium.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85 °C ensures reliable performance in higher temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to function down to -40 °C makes this product suitable for extreme environments, enhancing its versatility across various applications.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in layout design, allowing for better component arrangement on the PCB.

Maximum Seated Height: 0.5 mm

A low seated height enables a compact design profile, ensuring successful integration into thin devices without compromising performance.

Width: 1 mm

A width of 1 mm contributes to an ultra-compact design, making it an excellent choice for miniaturized electronic systems.

Length: 1.45 mm

The short length helps save space on the PCB layout, allowing engineers to optimize their designs for size and performance.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures reliability in harsh conditions, making it suitable for a wide range of industrial applications.

Technology: CMOS

CMOS technology provides low power consumption, making this IC efficient for battery-operated devices and portable applications.

Terminal Form: NO LEAD

No lead terminal form reduces the footprint and enhances reliability, as it minimizes the risk of solder joint failure.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this product meets the demands of communication systems, ensuring robust performance.

Terminal Pitch: 0.55 mm

A terminal pitch of 0.55 mm allows for tighter packing of components, saving space on the PCB without sacrificing electrical performance.

Data Rate: 0.848 Mbps

With a data rate of 0.848 Mbps, this IC provides sufficient bandwidth for a variety of communication tasks, ensuring smooth data transmission.

Technical Specifications

Other Function Telecom Interface ICs SL2S1512FTB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

Data Rate:

.848 Mbps

JESD-30 Code:

R-PDSO-N3

Length:

1.45 mm

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Maximum Seated Height:

.5 mm

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.55 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

SL2S1512FTB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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