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HTMS8201FTK/AF,115

NXP Semiconductors

HTMS8201FTK/AF,115 by NXP Semiconductors

HTMS8201FTK/AF,115 by NXP Semiconductors is a CMOS telecom interface IC in a no-lead quad chip carrier package. It supports surface mount technology and withstands peak reflow temperatures of 260 °C. Ideal for various telecom applications, it ensures reliable performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,851 parts In-Stock

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5,851

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Anansix

USA . 1,555 parts In-Stock

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1,555

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Digiode

USA . 886 parts In-Stock

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886

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Distributors (Availability)

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AZTECH Wire

Italy . 583 parts In-Stock

1+ parts

$16.620

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583

$16.620

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One Stop Electronics

USA . 736 parts In-Stock

1+ parts

$584.000

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736

$584.000

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Corphita

USA . 2,824 parts In-Stock

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2,824

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UNI Independent Distributors

Spain . 2,738 parts In-Stock

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2,738

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Perfect Parts

USA . 28 parts In-Stock

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28

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Cyclops Electronics Ltd (Excess)

UK . 25 parts In-Stock

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25

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Overview

Elevate your telecom solutions with the HTMS8201FTK/AF,115 from NXP Semiconductors, a trusted leader in innovation. Designed for reliability and efficiency, this cutting-edge interface IC excels in diverse applications, ensuring seamless communication. Its compact, no-lead package optimizes space while delivering superb performance. Experience enhanced quality and reduced costs, empowering your projects with unmatched value and precision that only NXP can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and resilience in various operating environments, making the product suitable for long-term use.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of space on the circuit board, facilitating easier integration into modern electronic devices.

Package Style (Meter): CHIP CARRIER

The chip carrier package style enhances thermal performance and connection stability, which is essential for high-frequency telecommunications applications.

Terminal Position: QUAD

The quad terminal position optimizes layout flexibility and routing options on the PCB, making it easier to design efficient circuits.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this product is compatible with high-temperature soldering processes, ensuring robust assembly in production.

Technology: CMOS

CMOS technology is known for low power consumption and high noise immunity, ensuring energy efficiency and reliability in telecommunications applications.

Terminal Form: NO LEAD

The no-lead terminal form promotes a smaller footprint and reduces potential for solder bridging, enhancing the overall performance of the product.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit IC, it is optimized for telecom applications, ensuring optimal performance in communication and signal processing tasks.

Technical Specifications

Other Function Telecom Interface ICs HTMS8201FTK/AF,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

HTMS8201FTK/AF,115 Telecommunications trade compliance attributes, and parameters.

HTS

8542.32.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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