Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HTMS8201FTK/AF,115 by NXP Semiconductors is a CMOS telecom interface IC in a no-lead quad chip carrier package. It supports surface mount technology and withstands peak reflow temperatures of 260 °C. Ideal for various telecom applications, it ensures reliable performance.
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The use of durable plastic/epoxy material ensures reliability and resilience in various operating environments, making the product suitable for long-term use.
Surface mount technology allows for compact design and efficient use of space on the circuit board, facilitating easier integration into modern electronic devices.
The chip carrier package style enhances thermal performance and connection stability, which is essential for high-frequency telecommunications applications.
The quad terminal position optimizes layout flexibility and routing options on the PCB, making it easier to design efficient circuits.
With a peak reflow temperature of 260 °C, this product is compatible with high-temperature soldering processes, ensuring robust assembly in production.
CMOS technology is known for low power consumption and high noise immunity, ensuring energy efficiency and reliability in telecommunications applications.
The no-lead terminal form promotes a smaller footprint and reduces potential for solder bridging, enhancing the overall performance of the product.
As a dedicated telecom circuit IC, it is optimized for telecom applications, ensuring optimal performance in communication and signal processing tasks.
Other Function Telecom Interface ICs HTMS8201FTK/AF,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
Moisture Sensitivity Level (MSL):
Package Body Material:
Package Code:
Package Equivalence Code:
Package Style (Meter):
Peak Reflow Temperature (C):
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Surface Mount:
Technology:
Telecom IC Type:
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HTMS8201FTK/AF,115 Telecommunications trade compliance attributes, and parameters.
HTS
8542.32.00
SB
8542.39.00.00
PCN Obsolescence/ EOL - A710x/HTMS8x/OM5569x/PRH601Hx/SL3S12 11/Jul/2022
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
Central Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
MMBT2222ALT1G
Onsemi
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
1N4148WS
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N5819HW-7-F
Diodes Incorporated
1N5819HW-7-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 1A output current, and 0.75V forward voltage. It's a surface mount device in a small outline package ideal for efficiency applications at temperatures ranging from -65 to 125°C.
BSS138PS,115
NXP Semiconductors
NXP Semiconductors' BSS138PS,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A max drain current. Ideal for switching applications, it features a 1.6 ohm max on-resistance and operates in enhancement mode. The transistor comes in a small outline package with GULL WING terminals, making it suitable for surface mount designs.
OHN3020U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
SS14
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Non Repetitive Peak Forward Current: 40 A; Technology: SCHOTTKY; No. of Elements: 1;
RC0603JR-070RL
Yageo
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
1N4148WT
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
NDT2955
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
Panjit International
Lite-on Semiconductor
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
NCH-RSL10-101Q48-ABG
NCH-RSL10-101Q48-ABG by Onsemi is a telecom interface IC with 48 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, with matte tin finish and no lead terminal form. It has a data rate of 2 Mbps and nominal voltage of 1.25V, suitable for industrial telecom circuit applications.
BMD-380-A-R
U-blox Ag
TELECOM CIRCUIT;
HMC624ALP4ETR
Analog Devices
Analog Devices' HMC624ALP4ETR is a 24-terminal CMOS telecom IC with a square chip carrier package. Operating from -40 to 85°C, it has a very thin profile and matte tin finish. Ideal for telecom circuits, this IC has a terminal pitch of 0.5mm and no lead terminal form.
ADRV9009BBCZ-REEL
ADRV9009BBCZ-REEL by Analog Devices is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features low profile and fine pitch design for industrial applications.
CC2640F128RHBR
CC2640F128RHBR by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom circuits, it features a terminal pitch of 0.5mm and no-lead terminal form.
TESEO-LIV3F
STMicroelectronics
TESEO-LIV3F by STMicroelectronics is a telecom IC with 18 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and compact dimensions of 9.7mm width and 10.1mm length. Ideal for industrial applications requiring a telecom circuit with a terminal pitch of 1.1mm in a rectangular package style.
NINA-B112-04B
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 4;
NEO-M8T
NEO-M8T by U-blox Ag is a telecom IC with 24 terminals, operating temperature range of -40 to 85°C. It features AEC-Q100 screening and TS 16949 certification, suitable for industrial applications requiring a 3V supply voltage. The surface-mountable rectangular package makes it ideal for compact designs in various industries.
EQCO62R20.3
Microchip Technology
Microchip Technology EQCO62R20.3 is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature range from -40 to 85°C, with terminal finish of Ni/Pd/Au. Ideal for telecom circuit applications requiring low profile and industrial-grade reliability.
WT32I-A-AI61IAP
Silicon Labs
Other Telecom ICs;
ODIN-W260-05B-00
Other Telecom ICs; Moisture Sensitivity Level (MSL): 4;
2615011136000
Wuerth Elektronik & Kg
SA606DK/01,112
SA606DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Ideal for telecom circuits, it features nickel/palladium/gold terminal finish and Gull Wing form factor.
SX1233IMLTRT
Semtech
Semtech's SX1233IMLTRT is a 24-terminal IC with 3.3V supply, operating from -40 to 85°C. It features AEC-Q100 screening and is ideal for telecom circuits due to its industrial temperature grade and square chip carrier package style.
2613021137000
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3;
NINA-B306-00B-00
MFRC53101T/0FE,112
The NXP Semiconductors MFRC53101T/0FE,112 is a telecom interface IC with 32 terminals in a small outline package. It operates b/w -25°C to 85°C, with a nominal voltage of 3.3V. Ideal for telecom circuits, it has a peak reflow temperature of 250°C and terminal pitch of 1.27mm.
BQ51003YFPT
BQ51003YFPT by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w -40 to 85°C, with a peak reflow temperature of 260°C. Suitable for telecom circuits, it has a battery supply of 5V and very thin profile at 0.5mm seated height.
453-00020C
Laird Technologies
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
ODIN-W262-06B
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HTMS1201FTK/AF,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: HVSON; Package Shape: RECTANGULAR;
HTMS1101FTK/AF,115
HTMS1001FTK/AF,115
HTMS1201FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Qualification: Not Qualified; Technology: CMOS;
HTMS1101FUG/AM,005
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: SQUARE; Package Equivalence Code: WAFER;
HTMS1101FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Package Body Material: PLASTIC/EPOXY; Terminal Position: QUAD;
HTMS1201FUG/AM
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 5; Package Code: DIE; Package Shape: RECTANGULAR;
HTMS1001FTB/AF,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: VSON; Package Shape: RECTANGULAR;
HTMS1101FUG/AM
HTMS1001FUG/AM
HTMS1201FTB/AF,115
HTMS1101FUG/AM,026
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: SQUARE; No. of Functions: 1;
HTMS1101FTB/AF,115
HTMS1201FTK/AF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: SON; Package Shape: RECTANGULAR;
HTMS1001FTK/AF
HTMS1101FTK/AF
HTMS1001FTB/AF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: SON; Package Shape: RECTANGULAR;
HTMS1001FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Terminal Position: QUAD; Qualification: Not Qualified;
HTMS1101FTB/AF
HTMS1201FTB/AF
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