Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HTMS1001FTK/AF,115 by NXP Semiconductors is a dual-terminal telecom interface IC designed for industrial applications. It operates b/w -40 °C to 85 °C and features a very thin profile of 2mm x 3mm. This CMOS technology ensures efficient performance in compact designs.
Median Price
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Vyrian
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Anansix
Digiode
One Stop Electronics
$565.000
UNI Independent Distributors
Corphita
The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this Telecom Interface IC reliable for various applications.
Surface mount technology allows for a compact design, enabling efficient use of space on circuit boards and simplifying the manufacturing process.
The rectangular package shape supports efficient layout design on PCBs, which is essential for optimizing space and performance in telecom applications.
With only two terminals, this IC is ideal for applications requiring minimal connectivity, reducing complexity and potential points of failure.
The small outline and thin profile make this IC suitable for space-constrained applications, while the heat sink feature helps in effective thermal management.
A maximum operating temperature of 85 °C indicates the IC's ability to function in higher thermal environments, enhancing reliability in industrial applications.
Operating efficiently at temperatures as low as -40 °C makes this IC suitable for harsh environmental conditions, ensuring consistent performance in a variety of settings.
The dual terminal position allows for versatile connections, providing flexibility for various circuit designs and configurations.
The low seated height contributes to a compact design, making it an excellent choice for applications where space is at a premium.
A width of 2 mm makes this IC highly compact, facilitating placement in densely populated circuit boards and reducing overall design footprint.
Short overall length (3 mm) enables efficient integration into tight spaces, ideal for modern electronics requiring high functionality in small packages.
Industrial temperature grading ensures dependable performance in challenging operational environments, making this IC suitable for a wide range of industrial applications.
CMOS technology provides low power consumption and high noise immunity, making this IC highly efficient and effective for telecom applications.
The no lead terminal form reduces the PCB real estate required for mounting, allowing for more complex and compact designs.
As a dedicated telecom circuit IC, this product is optimized for communication applications, ensuring high performance and compatibility with telecom standards.
Other Function Telecom Interface ICs HTMS1001FTK/AF,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
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NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LL4148
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
BAV99
Sprague Electric
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1.3 V; Maximum Output Current: .1 A; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
1N4148WT
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Unitrode
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Gulf Semiconductor
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
American Power Devices
L7805CV
Sgs-ates Componenti Electronici S P A
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Finish: Tin/Lead (Sn/Pb); Nominal Output Voltage-1: 5 V;
SMBJ18CA
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358ADR
Texas Instruments
LM358ADR by Texas Instruments is an operational amplifier with 2 functions, featuring a max input offset voltage of 5000 uV and nominal voltage of 5V. Widely used in applications requiring high voltage gain, it operates within a temperature range of 0-70°C and offers frequency compensation for stability.
2N2222A
Aeroflex/metelics
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Package Shape: ROUND; Transistor Application: SWITCHING;
BSS84-7-F
Diodes Incorporated
Diodes Inc. BSS84-7-F is a P-channel FET with 50V DS breakdown voltage, 0.13A max drain current, and 10 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package. Operating in enhancement mode at up to 150°C, it has Gull Wing terminals and matte tin finish.
RC0402FR-071KL
Yageo
The Yageo RC0402FR-071KL is a fixed resistor with a resistance of 1000 ohm and a tolerance of 1%. It is suitable for surface mount applications and has a max operating temperature of 155 °C.
BSS138-TP
Micro Commercial Components
BSS138-TP by Micro Commercial Components is a N-channel small signal FET with a min DS breakdown voltage of 50V and max drain current of 0.22A. It is commonly used in applications requiring enhancement mode operation, such as power management and switching circuits.
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
MBR0520LT3G
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
BSS123,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Moisture Sensitivity Level (MSL): 1; No. of Terminals: 3; Maximum Time At Peak Reflow Temperature (s): 30;
SN65DSI83ZQET
SN65DSI83ZQET by Texas Instruments is a telecom interface IC with 64 terminals in a square grid array package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It has a nominal voltage of 1.8V and terminal pitch of 0.5mm, ideal for telecom circuit applications.
TLV320AIC22CPT
TLV320AIC22CPT by Texas Instruments is a 48-terminal telecom IC with 16-bit linear coding and A/MU-LAW companding law. It operates at temperatures ranging from -40 to 85°C, suitable for industrial applications. The package style is flatpack, low profile, fine pitch, making it ideal for surface mount designs.
ZOE-M8Q-0-10
U-blox Ag
ZOE-M8Q-0-10 by U-blox Ag is a telecom IC with 51 terminals, operating at -40 to 85°C. It features a 3V supply voltage, 0.5mm terminal pitch, and AEC-Q100 screening for industrial applications. This surface-mount device in square package shape is ideal for compact telecom circuit designs.
CC2564BYFVR
The Texas Instruments CC2564BYFVR is a telecom IC with 54 terminals in a grid array package. It operates at -40 to 85°C, with a supply voltage of 3.6V and data rate of 4 Mbps. Ideal for telecom circuits, it features very thin profile and fine pitch terminal style for compact designs.
453-00041R
Laird Technologies
TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30;
HMC980LP4ETR
Analog Devices
Analog Devices' HMC980LP4ETR is a 24-terminal telecom IC with matte tin finish, operating b/w -40 to 85°C. It comes in a square chip carrier package style, suitable for industrial applications requiring a nominal voltage of 12V. The IC is surface mountable and has a terminal pitch of 0.5mm, making it ideal for telecom circuit designs.
NINA-B112-03B-00
TELECOM CIRCUIT;
CY7B923-JXIT
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
SIM7600G-H
Simcom Wireless Solutions
SIM7600G-H by Simcom Wireless Solutions is a telecom IC with 136 terminals, operating from -40 to 85°C. It supports data rates up to 150 Mbps and operates at a nominal voltage of 3.8V. Ideal for industrial applications requiring high-speed connectivity in a compact square package.
75S10010A200BR
Integrated Device Technology
Other Telecom ICs;
CYBLE-224116-01
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Shape: RECTANGULAR; Package Body Material: UNSPECIFIED;
L86-M33
Quectel Wireless Solutions
Quectel Wireless Solutions' L86-M33 is a telecom IC with 12 terminals, operating from -40 to 85°C. It has a nominal voltage of 3.3V and is designed for industrial applications. With a compact square package style and no-lead terminal form, it's ideal for space-constrained telecom interfaces.
SA636DK/01
NXP Semiconductors
SA636DK/01 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V, it features gull wing terminals and is designed for telecom circuit applications.
TSC2000IPWRG4
TSC2000IPWRG4 by Texas Instruments is a Telecom Interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, single-ended input type, and nominal voltage of 2.7V for telecom circuit applications.
MP45DT02TR-M
STMicroelectronics
STMicroelectronics MP45DT02TR-M is a telecom IC with 6 terminals, operating b/w -30 to 85°C. It has a rectangular shape, grid array package style, and nickel palladium gold finish. With a nominal voltage of 1.8V, it's ideal for telecom circuit applications due to its compact size (4.72mm x 3.76mm) and no-lead terminal form.
CC1125RHBT
CC1125RHBT by Texas Instruments is a telecom IC with 32 terminals, operating at 3V. It has a data rate of 0.2 Mbps and can withstand temperatures from -40 to 85°C. This chip carrier package is ideal for industrial telecom applications requiring a compact design and surface mount capability.
NEO-M8L-06B
ESP32-D0WDQ6-V3
Espressif Systems (shanghai)
ESP32-D0WDQ6-V3 by Espressif Systems is a surface mount telecom IC with 1 function. It has a square package shape, 48 terminals, and a very thin profile. With a data rate of 150 Mbps, it is suitable for various telecom circuit applications.
MFRC63003HNE
TELECOM CIRCUIT; JESD-609 Code: e4; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
HTMS1201FTK/AF,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: HVSON; Package Shape: RECTANGULAR;
HTMS1101FTK/AF,115
HTMS1201FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Qualification: Not Qualified; Technology: CMOS;
HTMS1101FUG/AM,005
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: SQUARE; Package Equivalence Code: WAFER;
HTMS1101FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Package Body Material: PLASTIC/EPOXY; Terminal Position: QUAD;
HTMS1201FUG/AM
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 5; Package Code: DIE; Package Shape: RECTANGULAR;
HTMS1001FTB/AF,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: VSON; Package Shape: RECTANGULAR;
HTMS1101FUG/AM
HTMS1001FUG/AM
HTMS1201FTB/AF,115
HTMS1101FUG/AM,026
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: SQUARE; No. of Functions: 1;
HTMS1101FTB/AF,115
HTMS1201FTK/AF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: SON; Package Shape: RECTANGULAR;
HTMS1001FTK/AF
HTMS1101FTK/AF
HTMS1001FTB/AF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: SON; Package Shape: RECTANGULAR;
HTMS1001FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Terminal Position: QUAD; Qualification: Not Qualified;
HTMS1101FTB/AF
HTMS1201FTB/AF
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