Loading...

HTMS1101FTB/AF,115

NXP Semiconductors

HTMS1101FTB/AF,115 by NXP Semiconductors

HTMS1101FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline and no-lead form factor make it ideal for space-constrained environments.

Median Price

$0.210

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8,023 parts In-Stock

1+ parts

$0.190

100+ parts

$0.190

1k+ parts

$0.180

10k+ parts

-

8,023

$0.190

$0.190

$0.180

-

Verical

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.230

4,500

-

-

-

$0.230

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,203 parts In-Stock

1+ parts

$0.206

100+ parts

-

1k+ parts

-

10k+ parts

-

3,203

$0.206

-

-

-

Vyrian

USA . 6,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,126

-

-

-

-

Anansix

USA . 2,330 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,330

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 25 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,378 parts In-Stock

1+ parts

$0.195

100+ parts

-

1k+ parts

-

10k+ parts

-

4,378

$0.195

-

-

-

Continental Prestige Electronics

USA . 8,023 parts In-Stock

1+ parts

$0.523

100+ parts

$0.260

1k+ parts

$0.195

10k+ parts

$0.175

8,023

$0.523

$0.260

$0.195

$0.175

AZTECH Wire

Italy . 179 parts In-Stock

1+ parts

$11.040

100+ parts

-

1k+ parts

-

10k+ parts

-

179

$11.040

-

-

-

UNI Independent Distributors

Spain . 312 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

312

-

-

-

-

Perfect Parts

USA . 56 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

56

-

-

-

-

Cyclops Electronics Ltd (Excess)

UK . 25 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25

-

-

-

-

Overview

Unlock exceptional performance with the HTMS1101FTB/AF,115 from NXP Semiconductors—a leader in innovative solutions. This compact, high-quality telecom interface IC is designed for durability and reliability across a broad range of applications, ensuring optimal communication in industrial environments. With its advanced technology and precise engineering, customers benefit from enhanced efficiency and longevity, making it the ideal choice for demanding projects. Elevate your designs with NXP’s trusted excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and reliability, making the product suitable for various telecom applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs, leading to smaller end products and facilitating automated assembly.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact footprint, enhancing the design flexibility for integrators and engineers.

No. of Terminals: 3

With 3 terminals, this IC facilitates simple connections and easy integration in cost-sensitive telecom applications.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and very thin profile minimize space requirements on PCBs, making it ideal for designs where size is critical.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in demanding environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C is essential for outdoor or harsh applications, ensuring reliable functionality in extreme conditions.

Terminal Position: DUAL

Dual terminal positions improve connectivity options and layout flexibility on PCBs, facilitating easier design integration.

Maximum Seated Height: 0.5 mm

A low maximum seated height contributes to a thinner assembly profile, accommodating applications where vertical space is a premium.

Width: 1 mm

The compact width allows for tighter integration on PCBs, making it valuable for space-constrained designs.

Length: 1.45 mm

Short length enables placement in compact areas, making it suitable for small handheld devices or densely packed circuits.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this IC ensures performance stability over a wide temperature range typical for telecom applications.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making this IC energy-efficient while maintaining performance.

Terminal Form: NO LEAD

No lead design offers enhanced reliability and environmental benefits, facilitating compliance with lead-free standards.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit IC, it is optimized for communication functions, ensuring it meets the specific requirements of telecom applications.

Technical Specifications

Other Function Telecom Interface ICs HTMS1101FTB/AF,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N3

Length:

1.45 mm

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC3(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

HTMS1101FTB/AF,115 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19