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HTMS1101FUG/AM,005

NXP Semiconductors

HTMS1101FUG/AM,005 by NXP Semiconductors

HTMS1101FUG/AM,005 by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It operates in extreme temperatures from -40 °C to 85 °C and features a no-lead terminal form in a square package. Ideal for surface mount technology, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,968 parts In-Stock

1+ parts

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2,968

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Anansix

USA . 2,568 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,568

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Digiode

USA . 1,104 parts In-Stock

1+ parts

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100+ parts

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1,104

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,528 parts In-Stock

1+ parts

$604.000

100+ parts

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1k+ parts

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10k+ parts

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1,528

$604.000

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Corphita

USA . 3,314 parts In-Stock

1+ parts

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3,314

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UNI Independent Distributors

Spain . 675 parts In-Stock

1+ parts

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100+ parts

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675

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Overview

Elevate your telecom solutions with the HTMS1101FUG/AM,005 from NXP Semiconductors. Renowned for its unwavering quality and reliability, this industrial-grade Telecom Interface IC offers outstanding performance in extreme temperatures, ensuring seamless communication even in the toughest environments. Its innovative design and surface mount capability optimize space and efficiency, making it an ideal choice for a variety of applications. Trust in NXP's excellence to enhance your projects and drive success!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easy integration into compact electronic systems, saving space and facilitating automated assembly.

Package Shape: SQUARE

The square package shape contributes to a more efficient layout on circuit boards, optimizing space utilization and improving thermal management.

Package Style (Meter): UNCASED CHIP

Being an uncasd chip, this component is versatile and can be directly integrated into various applications, enhancing customization for specific designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can be used in a wide range of environments, ensuring reliability in demanding conditions.

Minimum Operating Temperature: -40 °C

The capability to operate at temperatures as low as -40 °C makes this product suitable for industrial and outdoor applications, ensuring performance in extreme conditions.

Terminal Position: UPPER

The upper terminal position simplifies the connection process and allows for better access during assembly and maintenance.

Temperature Grade: INDUSTRIAL

This industrial-grade specification means the product is built to endure harsher environments, providing longevity and reliability for critical applications.

Technology: CMOS

Utilizing CMOS technology enables lower power consumption and higher speed operation, making this IC efficient and suitable for battery-powered devices.

Terminal Form: NO LEAD

The no-lead terminal form facilitates a more compact design and improves soldering, allowing for better electrical performance and reduced footprint.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit IC, it is specifically designed for telecommunications applications, ensuring compliance with industry standards and optimal performance.

Technical Specifications

Other Function Telecom Interface ICs HTMS1101FUG/AM,005 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

WAFER

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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