Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HTMS1101FUG/AM,005 by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It operates in extreme temperatures from -40 °C to 85 °C and features a no-lead terminal form in a square package. Ideal for surface mount technology, it ensures reliable performance in demanding environments.
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The surface mount design allows for easy integration into compact electronic systems, saving space and facilitating automated assembly.
The square package shape contributes to a more efficient layout on circuit boards, optimizing space utilization and improving thermal management.
Being an uncasd chip, this component is versatile and can be directly integrated into various applications, enhancing customization for specific designs.
With a maximum operating temperature of 85 °C, this IC can be used in a wide range of environments, ensuring reliability in demanding conditions.
The capability to operate at temperatures as low as -40 °C makes this product suitable for industrial and outdoor applications, ensuring performance in extreme conditions.
The upper terminal position simplifies the connection process and allows for better access during assembly and maintenance.
This industrial-grade specification means the product is built to endure harsher environments, providing longevity and reliability for critical applications.
Utilizing CMOS technology enables lower power consumption and higher speed operation, making this IC efficient and suitable for battery-powered devices.
The no-lead terminal form facilitates a more compact design and improves soldering, allowing for better electrical performance and reduced footprint.
As a dedicated telecom circuit IC, it is specifically designed for telecommunications applications, ensuring compliance with industry standards and optimal performance.
Other Function Telecom Interface ICs HTMS1101FUG/AM,005 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
No. of Functions:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Qualification:
Sub-Category:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Position:
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
Laube Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
MBRS130LT3G
Rochester Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
Continental Device India
2N2222A
New England Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
1N4148WS
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
NE555D
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Weitronic Enterprise
FDN5618P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
ERJ3GEY0R00V
Panasonic
ERJ3GEY0R00V by Panasonic is a SMT fixed resistor with 0 ohm resistance, suitable for jumper applications. It features a metal glaze/thick film technology, rated for temperatures b/w -55 to 155 °C. With a compact rectangular construction and matte tin over nickel terminal finish, it is ideal for surface mount installations in various electronic devices.
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
BSS138LT3G
Onsemi
BSS138LT3G by Onsemi is a N-CHANNEL FET with a min DS breakdown voltage of 50V. It is used for switching applications and has a max drain current of 0.2A and max drain-source on resistance of 3.5 ohm.
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
EU2B-YS2J03C
Idec
ROTARY SWITCH;
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CY7B923-JXC
Infineon Technologies
CY7B923-JXC by Infineon is a BICMOS telecom IC with 28 terminals, operating at 5V. It has a data rate of 400 Mbps and can handle a max supply current of 85mA. This chip carrier package is ideal for telecom circuits requiring high-speed data transmission in commercial temperature environments.
EQCO62T20.3
EQCO62T20.3 by Microchip Technology is a telecom interface IC with 1 function, 16 terminals, and a square package shape. It operates in an industrial temperature range of -40 to 85°C and has a nominal voltage of 1.2V. This IC is suitable for telecom circuit applications.
NRF52840-CKAA-R7
Nordic Semiconductor Asa
NRF52840-CKAA-R7 by Nordic Semiconductor Asa is a 93-terminal GRID ARRAY IC with 2 Mbps data rate, operating from -40 to 85 °C. Ideal for TELECOM CIRCUIT applications due to its low profile and fine pitch design.
AD8015ARZ
Analog Devices
AD8015ARZ by Analog Devices is a telecom interface IC with 8 terminals in a small outline package. It operates b/w -40 to 85°C, with a supply current of 26mA at 5V. Ideal for industrial applications requiring high-speed telecom circuits.
ATPL250A-AKU-R
Atmel
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;
XCC3135MODRNMMOBR
Texas Instruments
XCC3135MODRNMMOBR by Texas Instruments is a telecom IC with 63 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and comes in a rectangular chip carrier package style. Ideal for industrial applications requiring telecom circuit interfaces.
MAX7042ATJ+
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
NEO-M8U-0
U-blox Ag
NEO-M8U-0 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. Its AEC-Q100 screening level and TS 16949 certification make it ideal for industrial applications requiring a 3V supply voltage. With a compact rectangular package style, this IC is suitable for various telecom circuit functions.
CY7B933-JXC
Cypress Semiconductor
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;
PN5180A0HN/C3E
NXP Semiconductors
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: NICKEL PALLADIUM GOLD; Peak Reflow Temperature (C): 260; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 3;
BGM15MA12E6327XTSA1
BGM15MA12E6327XTSA1 by Infineon is a telecom IC with 12 terminals, operating temperature range of -40 to 85°C. It features a chip carrier package style, very thin profile, and no-lead terminal form. Ideal for telecom circuit applications with a nominal voltage of 2.8V and compact dimensions of 1.9mm x 1.1mm x 0.65mm.
ESP32-WROVER-IB
Espressif Systems (shanghai)
ESP32-WROVER-IB by Espressif Systems is a telecom IC with 150 Mbps data rate, operating at -40 to 85°C. It has 38 terminals in a rectangular package, suitable for surface mount applications. With a nominal voltage of 3.3V, it's ideal for IoT devices and wireless communication systems.
XB3-24APS
Digi International
The Digi International XB3-24APS is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40 to 85 °C, making it suitable for telecom applications. The RECTANGULAR package shape and SPECIAL SHAPE style enhance its performance in Other Function Telecom Interface ICs.
BT832
Fanstel
BT832 by Fanstel is a surface mount telecom IC with 40 terminals. Operating temperature range of -40 to 85°C, suitable for industrial applications. Features data rate of 1 Mbps, ideal for telecom circuit interfaces.
AT86RF215M-ZUR
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: VQCCN; Package Shape: SQUARE;
CC2592RGVR
CC2592RGVR by Texas Instruments is a Telecom IC with 16 terminals in a square chip carrier package. It operates b/w -40 to 125°C, suitable for automotive applications. With a nominal voltage of 3V and terminal pitch of 0.65mm, it is ideal for telecom circuit interfaces.
LEA-M8T-0
LEA-M8T-0 by U-blox Ag is a telecom IC with 28 terminals, operating at -40 to 85°C. With a compact size of 17x22.4mm, it has a supply voltage of 3V and MSL level of 4. Ideal for industrial applications requiring precise telecom circuit interfacing in tight spaces.
A1101R08A00GM
Ttm Technologies
TELECOM CIRCUIT;
U2270B-MFPY
U2270B-MFPY by Atmel is a telecom interface IC with 1 function. It has a small outline, low profile package style and operates in temperatures ranging from -40 to 105 °C. It is commonly used in telecom circuits for various applications.
CYBLE-214015-01
CYBLE-214015-01 by Infineon Technologies is a surface mount telecom IC with 1 function and 32 terminals. It has a square package shape, measuring 11mm in width and length, with a max seated height of 1.8mm. With an operating temperature range of -40 to 85°C, it is suitable for industrial applications.
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HTMS1201FTK/AF,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: HVSON; Package Shape: RECTANGULAR;
HTMS1101FTK/AF,115
HTMS1001FTK/AF,115
HTMS1201FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Qualification: Not Qualified; Technology: CMOS;
HTMS1101FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Package Body Material: PLASTIC/EPOXY; Terminal Position: QUAD;
HTMS1201FUG/AM
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 5; Package Code: DIE; Package Shape: RECTANGULAR;
HTMS1001FTB/AF,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: VSON; Package Shape: RECTANGULAR;
HTMS1101FUG/AM
HTMS1001FUG/AM
HTMS1201FTB/AF,115
HTMS1101FUG/AM,026
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: SQUARE; No. of Functions: 1;
HTMS1101FTB/AF,115
HTMS1201FTK/AF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: SON; Package Shape: RECTANGULAR;
HTMS1001FTK/AF
HTMS1101FTK/AF
HTMS1001FTB/AF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: SON; Package Shape: RECTANGULAR;
HTMS1001FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Terminal Position: QUAD; Qualification: Not Qualified;
HTMS1101FTB/AF
HTMS1201FTB/AF
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