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HTMS1201FTK/AF

NXP Semiconductors

HTMS1201FTK/AF by NXP Semiconductors

HTMS1201FTK/AF by NXP Semiconductors is a dual-terminal telecom circuit IC designed for industrial applications. It operates b/w -40 °C to 85 °C and features a 5V nominal voltage. Its compact, no-lead design ensures efficient surface mounting in various telecom devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,494 parts In-Stock

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4,494

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Digiode

USA . 3,378 parts In-Stock

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3,378

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Anansix

USA . 1,768 parts In-Stock

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1,768

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One Stop Electronics

USA . 1,319 parts In-Stock

1+ parts

$81.000

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1,319

$81.000

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UNI Independent Distributors

Spain . 6,306 parts In-Stock

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6,306

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Corphita

USA . 681 parts In-Stock

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681

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Perfect Parts

USA . 129 parts In-Stock

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Overview

Elevate your telecom solutions with the HTMS1201FTK/AF from NXP Semiconductors, a trusted leader in high-quality technology. This robust interface IC is expertly designed for industrial applications, ensuring reliability across extreme temperatures. With its compact surface-mount design and dual terminal configuration, it streamlines integration while enhancing performance. Choose NXP’s cutting-edge innovation to empower your next project with unparalleled efficiency and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device enables easy integration into compact circuit designs and facilitates automated assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on printed circuit boards, allowing for efficient layout designs.

No. of Terminals: 2

With only 2 terminals, this IC simplifies connections, reducing potential points of failure while maintaining essential functionality.

Package Style (Meter): SMALL OUTLINE

The small outline design minimizes real estate on PCBs, making it ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in industrial environments where higher temperature ranges may be present.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for use in extreme climates, ensuring consistent operation in harsh conditions.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting options and simplified circuit connections.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this IC provides enhanced reliability and performance in demanding applications.

Terminal Form: NO LEAD

The no-lead terminal form helps in reducing footprints in PCB designs, contributing to overall miniaturization of electronic devices.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, it is specifically tailored for telecommunications applications, ensuring optimized functionality in communication systems.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage of 5V makes it compatible with a wide range of other components, facilitating easier integration into existing systems.

Technical Specifications

Other Function Telecom Interface ICs HTMS1201FTK/AF attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N2

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

HTMS1201FTK/AF Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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