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HTMS1001FTB/AF,118

NXP Semiconductors

HTMS1001FTB/AF,118 by NXP Semiconductors

HTMS1001FTB/AF,118 by NXP Semiconductors is a CMOS telecom circuit IC designed for surface mount applications. It features a quad terminal configuration with 3 terminals and comes in a plastic/epoxy chip carrier package. Ideal for enhancing telecom interfaces, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,902 parts In-Stock

1+ parts

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4,902

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Digiode

USA . 2,320 parts In-Stock

1+ parts

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2,320

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Anansix

USA . 2,246 parts In-Stock

1+ parts

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2,246

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,145 parts In-Stock

1+ parts

$677.000

100+ parts

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1k+ parts

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10k+ parts

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1,145

$677.000

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Corphita

USA . 2,187 parts In-Stock

1+ parts

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2,187

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UNI Independent Distributors

Spain . 1,567 parts In-Stock

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1,567

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Overview

Elevate your telecom projects with the HTMS1001FTB/AF,118 from NXP Semiconductors, a trusted leader in innovation. This high-quality interface IC is designed for seamless integration and reliability, ensuring optimal performance in various applications. Experience the advantages of superior technology that enhances connectivity, reduces power consumption, and simplifies design, empowering you to deliver cutting-edge solutions that stand out in the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making the product reliable in various conditions.

Surface Mount: YES

Being surface mount compatible allows for easier integration into modern circuit designs, saving space and enhancing performance in compact assemblies.

No. of Terminals: 3

With three terminals, the design is optimized for simplicity and ease of handling, reducing complexity in circuit design and improving assembly efficiency.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides excellent thermal and electrical performance, making it ideal for high-speed applications in telecom.

Terminal Position: QUAD

The quad terminal position offers balanced connectivity for efficient signal integrity and power distribution, critical in telecom applications.

Technology: CMOS

Utilizing CMOS technology results in low power consumption and high-speed performance, making this product suitable for battery-operated devices and energy-efficient designs.

Terminal Form: NO LEAD

The no lead terminal form simplifies mounting and reduces parasitic inductance, enhancing overall performance and reliability in high-frequency applications.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit type, this IC is specifically designed for communication applications, ensuring optimized performance and compatibility in telecom systems.

Technical Specifications

Other Function Telecom Interface ICs HTMS1001FTB/AF,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC3(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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