Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HTMS1001FTB/AF,118 by NXP Semiconductors is a CMOS telecom circuit IC designed for surface mount applications. It features a quad terminal configuration with 3 terminals and comes in a plastic/epoxy chip carrier package. Ideal for enhancing telecom interfaces, it ensures reliable performance in compact designs.
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The use of plastic/epoxy as the package body material ensures durability and resistance to environmental factors, making the product reliable in various conditions.
Being surface mount compatible allows for easier integration into modern circuit designs, saving space and enhancing performance in compact assemblies.
With three terminals, the design is optimized for simplicity and ease of handling, reducing complexity in circuit design and improving assembly efficiency.
The chip carrier package style provides excellent thermal and electrical performance, making it ideal for high-speed applications in telecom.
The quad terminal position offers balanced connectivity for efficient signal integrity and power distribution, critical in telecom applications.
Utilizing CMOS technology results in low power consumption and high-speed performance, making this product suitable for battery-operated devices and energy-efficient designs.
The no lead terminal form simplifies mounting and reduces parasitic inductance, enhancing overall performance and reliability in high-frequency applications.
As a telecom circuit type, this IC is specifically designed for communication applications, ensuring optimized performance and compatibility in telecom systems.
Other Function Telecom Interface ICs HTMS1001FTB/AF,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
No. of Terminals:
Package Body Material:
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NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
2N2222A
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
BAV99
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Tri-star Electronics International
CONNECTOR ACCESSORY; Material: COPPER ALLOY; MIL Conformity: YES; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; MIL-Connector Accessory Name: CONTACT; Terminal Type: CRIMP;
ULN2803A
Vishay Intertechnology
NPN; Configuration: COMPLEX; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; JESD-30 Code: R-PDIP-T18;
2N7002
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
ECS-.327-12.5-17X-TR
Ecs International
ECS-0.327-12.5-17X-TR by Ecs International is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing in temperature ranges from -40 to 85 °C, such as telecommunications and industrial automation.
Allegro MicroSystems
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
Weitron Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
Conesys
CONNECTOR ACCESSORY; MIL Conformity: YES; Mating Contacts: M39029/57-354; Terminal Type: CRIMP; DIN Conformity: NO; MIL-Connector Accessory Name: CONTACT;
1N4148W-7-F
Multicomp Pro
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MS3V-T1R32.768KHZ+/-20PPM12.5PF
Golledge Electronics
MS3V-T1R32.768KHZ+/-20PPM12.5PF by Golledge Electronics is a crystal oscillator with 20 ppm frequency tolerance, 126% stability, and 12.5 pF load capacitance. It is ideal for applications requiring precise timing in temperature-sensitive environments due to its -40 to 85 °C operating range.
LL4148
Onsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Tesla Elektronicke Soucastky
1N4148
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Finish: Matte Tin (Sn) - annealed;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
2N7002-T1-E3
Vishay Intertechnology's 2N7002-T1-E3 is a N-CHANNEL FET for SWITCHING applications. Features include 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. With ENHANCEMENT MODE operation, this GULL WING transistor is ideal for small outline surface mount designs up to 150°C.
CC1200RHBT
Texas Instruments
The Texas Instruments CC1200RHBT is a telecom IC with 32 terminals, operating at 3V. It offers a data rate of 1.25 Mbps and can withstand temperatures from -40 to 85°C. Ideal for telecom circuits, this chip carrier package has a very thin profile and is surface mountable.
LEA-M8T-0-10
U-blox Ag
LEA-M8T-0-10 by U-blox Ag is a surface mount telecom interface IC with 1 function. It has a rectangular package shape, 24 terminals, and a max seated height of 2.7 mm. This industrial-grade IC operates b/w -40°C to 85°C and is suitable for various telecom circuit applications.
SA616DK/01,112
SA616DK/01,112 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features nickel palladium gold terminal finish and gull wing form factor for telecom circuit applications.
RN4678-V/RM111
Microchip Technology
RN4678-V/RM111 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -20 to 70°C, and supply voltage of 1.9V. It is designed for surface mount applications in telecom circuits, meeting TS 16949 screening standards. With a compact rectangular package style and no-lead terminal form, it is ideal for commercial use in various electronic devices.
BM71BLES1FC2-0B05BA
BM71BLES1FC2-0B05BA by Microchip Technology is a surface mount telecom interface IC with 16 terminals. It operates at temperatures ranging from -40 to 85 °C and has a max seated height of 2.1 mm. With a data rate of 0.0086 Mbps, it is suitable for various telecom circuit applications.
BLUENRG-MSCSP
STMicroelectronics
BLUENRG-MSCSP by STMicroelectronics is a telecom IC with 34 terminals, operating at -40 to 85°C. Its grid array package has a very thin profile and fine pitch, suitable for industrial applications requiring a 3V supply voltage. The IC is designed for surface mount assembly in compact devices due to its small dimensions of 2.56mm width and 2.66mm length.
CLRC66303HNY
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Terminal Finish: NICKEL PALLADIUM GOLD SILVER; JESD-609 Code: e4;
XB3-24Z8PS-J
Digi International
The Digi International XB3-24Z8PS-J is a telecom IC with 37 terminals, suitable for industrial applications. It operates b/w -40°C to 85°C and comes in a surface-mount rectangular package. This IC is designed for telecom circuits, offering reliable performance in various communication systems.
SIM900
Simcom Wireless Solutions
SIM900 by Simcom Wireless Solutions is a telecom IC with 0.0856 Mbps data rate. It operates in industrial temperature range (-40 to 85 °C) and has 68 terminals in a square package. Ideal for telecom applications requiring high-speed data transmission.
LMS7002M
Lime Microsystems
Lime Microsystems' LMS7002M is a telecom IC with 261 terminals, operating from -40 to 85°C. It has a nominal voltage of 1.2V and uses a grid array package style. Ideal for industrial applications requiring precise telecom circuit functionality in compact form factor.
BGM113A256V2
Silicon Labs
BGM113A256V2 by Silicon Labs is a telecom IC with 36 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and terminal pitch of 0.8mm. This rectangular microelectronic assembly is ideal for industrial applications requiring telecom circuit interfaces.
TLK2711AIRCP
TLK2711AIRCP by Texas Instruments is a telecom IC with 64 terminals, operating at 2.5V. It has a temperature range of -40 to 85°C and features a flatpack package style. Ideal for telecom circuit applications due to its industrial-grade performance and very thin profile design.
450-0177C
Ls Research
TELECOM CIRCUIT;
RN41-I/RM615
Microchip Technology's RN41-I/RM615 is a telecom IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V and matte tin finish, suitable for industrial applications. This surface-mount IC in rectangular package measures 13.2mm x 25.8mm with a seated height of 2.2mm, ideal for telecom interface functions.
SX1233IMLTRT
Semtech
Semtech's SX1233IMLTRT is a 24-terminal IC with 3.3V supply, operating from -40 to 85°C. It features AEC-Q100 screening and is ideal for telecom circuits due to its industrial temperature grade and square chip carrier package style.
BLUENRG-MSQTR
BLUENRG-MSQTR by STMicroelectronics is a 32-terminal telecom IC with a 3V supply voltage. It operates b/w -40 to 85°C, suitable for industrial use. With a square shape and chip carrier package style, it's ideal for telecom circuit applications.
BT121-A-V2
BT121-A-V2 by Silicon Labs is a telecom IC with 33 terminals, operating at -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 1mm. This surface-mount IC is ideal for industrial applications requiring compact MICROELECTRONIC ASSEMBLY packages.
ADRV9008BBCZ-1REEL
Analog Devices
Analog Devices ADRV9008BBCZ-1REEL is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuit applications requiring fine pitch and bottom terminal position.
LEA-M8S-0
LEA-M8S-0 by U-blox Ag is a surface mount RF and baseband circuit with 28 terminals. It operates in industrial temperature range (-40 to 85°C) and has a supply voltage of 3V. This telecom IC is AEC-Q100 certified, suitable for automotive applications.
ATECC508A-SSHDA-B
Microchip ATECC508A-SSHDA-B is an 8-terminal IC with CMOS tech, operating temp range -40 to 85°C. Telecom circuit type with 3.6V supply voltage, ideal for industrial applications requiring TS16949 screening level. Package style: small outline, surface mountable in plastic/epoxy material, suitable for telecom interfaces.
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HTMS1201FTK/AF,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: HVSON; Package Shape: RECTANGULAR;
HTMS1101FTK/AF,115
HTMS1001FTK/AF,115
HTMS1201FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Qualification: Not Qualified; Technology: CMOS;
HTMS1101FUG/AM,005
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: SQUARE; Package Equivalence Code: WAFER;
HTMS1101FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Package Body Material: PLASTIC/EPOXY; Terminal Position: QUAD;
HTMS1201FUG/AM
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 5; Package Code: DIE; Package Shape: RECTANGULAR;
HTMS1001FTB/AF,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: VSON; Package Shape: RECTANGULAR;
HTMS1101FUG/AM
HTMS1001FUG/AM
HTMS1201FTB/AF,115
HTMS1101FUG/AM,026
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: SQUARE; No. of Functions: 1;
HTMS1101FTB/AF,115
HTMS1201FTK/AF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: SON; Package Shape: RECTANGULAR;
HTMS1001FTK/AF
HTMS1101FTK/AF
HTMS1001FTB/AF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: SON; Package Shape: RECTANGULAR;
HTMS1101FTB/AF
HTMS1201FTB/AF
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