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HTMS1101FTB/AF,118

NXP Semiconductors

HTMS1101FTB/AF,118 by NXP Semiconductors

HTMS1101FTB/AF,118 from NXP Semiconductors is a CMOS telecom circuit IC designed for surface mount applications. It features a quad terminal configuration with 3 terminals and comes in a plastic/epoxy chip carrier package. Ideal for enhancing telecom interfaces, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,041 parts In-Stock

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3,041

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Anansix

USA . 1,405 parts In-Stock

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1,405

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Vyrian

USA . 890 parts In-Stock

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890

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 985 parts In-Stock

1+ parts

$681.000

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985

$681.000

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UNI Independent Distributors

Spain . 2,954 parts In-Stock

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2,954

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Corphita

USA . 2,124 parts In-Stock

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Overview

Unlock seamless communication with the HTMS1101FTB/AF,118 by NXP Semiconductors. Renowned for its cutting-edge innovation and reliability, NXP delivers a telecom interface IC that enhances connectivity in various applications—from telecommunications to consumer electronics. With its compact design and superior performance, this versatile chip ensures efficient signal processing, making it an indispensable asset for engineers seeking quality and innovation. Experience the difference of trusted engineering with NXP!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology enables compact design and high-density PCB layouts, which is essential for modern electronic devices.

No. of Terminals: 3

Having 3 terminals facilitates efficient connectivity and integration into circuits, which can streamline designs.

Package Style (Meter): CHIP CARRIER

Chip carrier packages allow for better thermal performance and signal integrity, ideal for high-speed telecom applications.

Terminal Position: QUAD

Quad terminal positioning enhances layout flexibility on PCBs, enabling easier routing of signals and power.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, which are critical for enhancing battery life and performance in telecom devices.

Terminal Form: NO LEAD

No lead terminals result in a smaller package size and improved electrical performance, contributing to the advancement of miniaturized device design.

Telecom IC Type: TELECOM CIRCUIT

Being a specialized telecom circuit ensures optimized performance for communication applications, making it ideal for dedicated telecom solutions.

Technical Specifications

Other Function Telecom Interface ICs HTMS1101FTB/AF,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC3(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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