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HTMS1001FUG/AM

NXP Semiconductors

HTMS1001FUG/AM by NXP Semiconductors

HTMS1001FUG/AM by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It operates b/w -40 °C to 85 °C, with a nominal voltage of 5V and features a no-lead design in a rectangular package. Ideal for surface mount technology, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,723 parts In-Stock

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2,723

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Anansix

USA . 2,028 parts In-Stock

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2,028

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Digiode

USA . 1,281 parts In-Stock

1+ parts

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1,281

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,398 parts In-Stock

1+ parts

$203.000

100+ parts

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1,398

$203.000

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Corphita

USA . 2,432 parts In-Stock

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2,432

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UNI Independent Distributors

Spain . 819 parts In-Stock

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819

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Overview

Unlock unmatched performance and reliability with the HTMS1001FUG/AM from NXP Semiconductors, a leader in innovative technology. Designed for industrial telecom applications, this surface-mount IC delivers exceptional durability across extreme temperatures, ensuring your systems run smoothly under any conditions. Benefit from its compact design and impressive efficiency, making it an ideal choice for enhancing connectivity in demanding environments. Elevate your projects with NXP’s trusted quality!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for efficient space utilization on circuit boards, making it ideal for compact applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a better footprint for PCB layouts, enhancing integration and placement flexibility.

No. of Terminals: 5

With five terminals, this IC is designed for versatile connections, facilitating simplified integration into various telecom applications.

Package Style (Meter): UNCASED CHIP

The uncased chip design lowers weight and volume, improving overall product efficiency and reducing costs in high-volume production.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can function reliably in diverse and demanding industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures this product is suitable for harsh and extreme conditions, making it a robust choice for various applications.

Terminal Position: UPPER

Upper terminal positioning can simplify routing and connections on PCBs, contributing to a more straightforward design process.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures indicates robustness and reliability, crucial for long-term deployments in telecom systems.

Terminal Form: NO LEAD

The no-lead terminal form minimizes parasitic capacitance and resistance, enhancing performance in high-frequency applications typical in telecom.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically as a telecom circuit, this IC meets the specialized needs of the industry, ensuring optimal performance in communication tasks.

Nominal Supply Voltage: 5 V

The nominal 5 V supply voltage is widely compatible with numerous systems and components, providing ease of integration and standardized performance.

Technical Specifications

Other Function Telecom Interface ICs HTMS1001FUG/AM attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-XUUC-N5

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

HTMS1001FUG/AM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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