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HTMS1001FTK/AF

NXP Semiconductors

HTMS1001FTK/AF by NXP Semiconductors

HTMS1001FTK/AF by NXP Semiconductors is a dual-terminal telecom circuit IC designed for industrial applications. It operates within -40 °C to 85 °C and features a 5V nominal voltage. Its compact, no-lead design ensures efficient surface mounting in various telecom devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,905 parts In-Stock

1+ parts

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2,905

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Anansix

USA . 1,333 parts In-Stock

1+ parts

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1,333

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Digiode

USA . 1,015 parts In-Stock

1+ parts

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1,015

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 467 parts In-Stock

1+ parts

$976.000

100+ parts

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467

$976.000

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UNI Independent Distributors

Spain . 8,054 parts In-Stock

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8,054

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Corphita

USA . 4,231 parts In-Stock

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4,231

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Perfect Parts

USA . 129 parts In-Stock

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129

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Overview

Unlock the potential of your telecommunications projects with the HTMS1001FTK/AF from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP offers this reliable telecom interface IC that excels in diverse environments, ensuring optimal performance from -40 °C to 85 °C. Designed for seamless integration, its compact size and advanced features provide you with efficiency and durability, empowering your applications to thrive in demanding industrial settings. Choose NXP for superior reliability and elevate your connectivity solutions today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and reliability, making the product suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, facilitating high-density applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout and spacing on circuit boards, supporting better electrical performance.

No. of Terminals: 2

With only two terminals, this IC simplifies connections, reducing potential points of failure and making integration easier.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing for flexible PCB designs.

Maximum Operating Temperature: 85 °C

The product can operate at high temperatures, increasing its utility in industrial applications that experience heat.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product is suitable for extreme conditions, ensuring reliable performance in harsh environments.

Terminal Position: DUAL

Dual terminal positioning simplifies layout and helps minimize signal integrity issues by providing efficient routing options.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this temperature grade ensures enhanced reliability and longevity in demanding environments.

Terminal Form: NO LEAD

No lead design minimizes footprint and supports modern manufacturing techniques, reducing potential stress on the PCB.

Telecom IC Type: TELECOM CIRCUIT

Being categorized as a telecom circuit ensures compatibility with a wide range of communication systems and applications.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage of 5V enhances compatibility with numerous power systems, making it easier to integrate into existing designs.

Technical Specifications

Other Function Telecom Interface ICs HTMS1001FTK/AF attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N2

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

HTMS1001FTK/AF Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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