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HTMS1101FTB/AF

NXP Semiconductors

HTMS1101FTB/AF by NXP Semiconductors

HTMS1101FTB/AF by NXP Semiconductors is a telecom interface IC designed for industrial applications. It operates b/w -40 °C to 85 °C, features a 5V nominal voltage, and comes in a compact no-lead package with 3 terminals. Ideal for surface mount designs, it ensures reliable performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,613 parts In-Stock

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1,613

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Digiode

USA . 1,230 parts In-Stock

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1,230

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Anansix

USA . 502 parts In-Stock

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502

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Distributors (Availability)

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One Stop Electronics

USA . 416 parts In-Stock

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$17.000

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416

$17.000

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UNI Independent Distributors

Spain . 4,959 parts In-Stock

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4,959

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Corphita

USA . 3,490 parts In-Stock

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3,490

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Perfect Parts

USA . 129 parts In-Stock

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Overview

Unlock seamless communication with the HTMS1101FTB/AF from NXP Semiconductors, a trusted leader in high-quality electronics. This reliable telecom interface IC enhances connectivity in industrial applications, ensuring performance under extreme temperatures. Its compact design allows for efficient installation, maximizing your system's potential. Elevate your projects with unrivaled reliability and innovation, bringing exceptional value to your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this IC suitable for various applications.

Surface Mount: YES

Being surface mount allows for space-efficient designs and enables automated manufacturing processes, enhancing production efficiency.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier handling and integration into compact circuit designs, optimizing PCB layout.

No. of Terminals: 3

A three-terminal configuration simplifies connectivity and reduces the footprint on the PCB, ideal for compact applications.

Package Style (Meter): SMALL OUTLINE

The small outline package is advantageous for designs that require minimal space while ensuring performance and reliability.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is reliable in moderately harsh environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating down to -40 °C ensures functionality in extreme conditions, making it a versatile choice for diverse applications.

Terminal Position: DUAL

The dual terminal positioning provides flexibility and ease of integration into various circuit designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies robustness and suitability for use in demanding environments, ensuring longevity.

Terminal Form: NO LEAD

No lead terminals enhance soldering efficiency and provide a lower profile, reducing the risk of mechanical stress.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC delivers optimized performance in communication systems.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V ensures compatibility with widely used systems, facilitating easy integration and widespread application.

Technical Specifications

Other Function Telecom Interface ICs HTMS1101FTB/AF attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N3

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

HTMS1101FTB/AF Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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