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HTMS1201FUG/AM

NXP Semiconductors

HTMS1201FUG/AM by NXP Semiconductors

HTMS1201FUG/AM by NXP Semiconductors is a telecom interface IC designed for industrial applications. It operates within -40 °C to 85 °C, features a 5V nominal voltage, and comes in a no-lead rectangular package with 5 terminals. Ideal for robust telecom circuits, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,716 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,716

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-

-

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Vyrian

USA . 2,266 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,266

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Anansix

USA . 725 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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725

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,469 parts In-Stock

1+ parts

$663.000

100+ parts

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1k+ parts

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10k+ parts

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1,469

$663.000

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UNI Independent Distributors

Spain . 7,560 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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7,560

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Corphita

USA . 2,239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,239

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Overview

Unlock unparalleled performance with the HTMS1201FUG/AM from NXP Semiconductors, a trusted leader in innovative solutions. This robust Telecom Interface IC boasts exceptional quality and reliability, ideal for demanding industrial applications. Designed for seamless integration, it ensures superior communication efficiency, ultimately enhancing your product's capabilities. Elevate your projects with cutting-edge technology that delivers lasting value and peace of mind.

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for high-density circuit board layouts, optimizing space and enabling efficient use of modern PCB technology.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy integration into various applications, promoting versatility and compatibility with different circuit designs.

No. of Terminals: 5

Having 5 terminals provides ample connectivity options for various configurations, ensuring flexibility in circuit design and ease of assembly.

Package Style (Meter): UNCASED CHIP

As an uncashed chip, this product minimizes size and weight, which is particularly advantageous in compact telecom applications.

Maximum Operating Temperature: 85 °C

The ability to operate at high temperatures ensures reliability and performance in demanding industrial environments.

Minimum Operating Temperature: -40 °C

With a low operating temperature range, this telecom IC can function effectively in extreme conditions, making it suitable for various outdoor and harsh environments.

Terminal Position: UPPER

Upper terminal positioning allows for easier access and connections on the PCB, streamlining assembly and maintenance processes.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this IC meets rigorous performance standards, ensuring durability and long-term reliability.

Terminal Form: NO LEAD

The no-lead design enhances reliability and reduces the risk of solder defects, while also enabling a more compact footprint.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC delivers optimal performance and features tailored for communication devices.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V allows for easier integration with standard power supplies, enhancing compatibility in various systems.

Technical Specifications

Other Function Telecom Interface ICs HTMS1201FUG/AM attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-XUUC-N5

No. of Functions:

1

No. of Terminals:

5

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

HTMS1201FUG/AM Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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