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HTMS1001FTB/AF,115

NXP Semiconductors

HTMS1001FTB/AF,115 by NXP Semiconductors

HTMS1001FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC designed for industrial applications. It features a dual terminal design with a max operating temp of 85 °C and operates in extreme conditions from -40 °C. Its small outline and no-lead form factor make it ideal for space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,753 parts In-Stock

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4,753

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Vyrian

USA . 3,502 parts In-Stock

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3,502

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Anansix

USA . 2,692 parts In-Stock

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2,692

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One Stop Electronics

USA . 1,070 parts In-Stock

1+ parts

$155.000

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1,070

$155.000

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UNI Independent Distributors

Spain . 6,450 parts In-Stock

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6,450

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Corphita

USA . 487 parts In-Stock

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487

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Perfect Parts

USA . 11 parts In-Stock

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Overview

Elevate your telecom solutions with the HTMS1001FTB/AF,115 from NXP Semiconductors, a leader renowned for innovation and reliability. This compact and robust interface IC is designed for industrial applications, ensuring optimal performance across extreme temperatures. Its space-saving design offers seamless integration, empowering your projects with enhanced efficiency and durability. Trust NXP’s legacy of quality to drive your success in the fast-paced telecom landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the IC suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for a more compact design and easier automation in manufacturing, improving the efficiency of assembly.

Package Shape: RECTANGULAR

The rectangular shape enables efficient space utilization on PCBs, allowing more components to fit in a smaller area.

No. of Terminals: 3

Having three terminals provides sufficient connectivity for essential functions while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile enhance the versatility of the IC for applications where space is a critical factor.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC can function reliably in a wide range of thermal environments.

Minimum Operating Temperature: -40 °C

The ability to operate as low as -40 °C makes this product suitable for use in extreme conditions, particularly in industrial and outdoor applications.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in circuit design and routing on the PCB.

Maximum Seated Height: 0.5 mm

A low seated height allows for minimal stacking height on PCBs, contributing to overall space savings in component arrangement.

Width: 1 mm

The narrow width of 1 mm enables the design of compact and lightweight electronics.

Length: 1.45 mm

The short length further facilitates dense packing of components on the printed circuit board, maximizing performance in limited spaces.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this product is robust enough for demanding applications across various industries.

Technology: CMOS

CMOS technology is known for low power consumption and high integration capacity, making this IC efficient and suitable for modern applications.

Terminal Form: NO LEAD

No-lead terminals reduce the risk of environmental contamination while enhancing thermal and electrical performance.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC ensures superior performance and reliability in communication systems.

Technical Specifications

Other Function Telecom Interface ICs HTMS1001FTB/AF,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N3

Length:

1.45 mm

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC3(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Width:

1 mm

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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