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HTMS1201FTB/AF

NXP Semiconductors

HTMS1201FTB/AF by NXP Semiconductors

HTMS1201FTB/AF by NXP Semiconductors is a telecom interface IC designed for industrial applications. It operates within -40 °C to 85 °C, features a 5V nominal voltage, and comes in a compact no-lead package with 3 terminals. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,730 parts In-Stock

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4,730

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Anansix

USA . 2,629 parts In-Stock

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2,629

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Vyrian

USA . 2,121 parts In-Stock

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2,121

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 313 parts In-Stock

1+ parts

$338.000

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313

$338.000

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UNI Independent Distributors

Spain . 2,395 parts In-Stock

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2,395

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Corphita

USA . 659 parts In-Stock

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659

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Perfect Parts

USA . 129 parts In-Stock

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129

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Overview

Unlock seamless communication with the HTMS1201FTB/AF from NXP Semiconductors, a leader in innovative technology. This compact telecom interface IC ensures reliability and exceptional performance across industrial applications, thriving in extreme temperatures. With NXP's renowned commitment to quality, this product not only enhances system efficiency but also delivers unmatched durability, empowering your designs for success in any demanding environment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures robustness and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for high-density PCB designs and automation in assembly, improving production efficiency.

Package Shape: RECTANGULAR

A rectangular shape optimizes space utilization on PCBs and facilitates easier integration into various designs.

No. of Terminals: 3

With 3 terminals, it offers a simple connection interface, which can streamline the design process for engineers.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to compact designs, making it ideal for space-constrained applications in telecommunications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in a range of environments, particularly in industrial settings.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, the product is suitable for extreme conditions, enhancing its versatility in various applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layout options, facilitating easier integration into different designs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this product is designed to withstand harsh conditions, ensuring longevity and reliability.

Terminal Form: NO LEAD

No-lead terminal form contributes to lower profile designs and is better suited for environmentally-friendly manufacturing processes.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit IC, this product is specifically designed to meet the demanding requirements of telecommunications applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V, it is compatible with standard electronic designs, simplifying integration and reducing design complexity.

Technical Specifications

Other Function Telecom Interface ICs HTMS1201FTB/AF attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N3

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

HTMS1201FTB/AF Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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