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HTMS1201FTK/AF,115

NXP Semiconductors

HTMS1201FTK/AF,115 by NXP Semiconductors

HTMS1201FTK/AF,115 by NXP Semiconductors is a dual-terminal telecom interface IC designed for industrial applications. It operates in extreme temperatures from -40 °C to 85 °C and features a compact 2mm x 3mm size with no lead terminals. Ideal for surface mount technology, it ensures efficient performance in telecom circuits.

Median Price

$0.717

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 150 parts In-Stock

1+ parts

$0.717

100+ parts

$0.674

1k+ parts

$0.609

10k+ parts

-

150

$0.717

$0.674

$0.609

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,484 parts In-Stock

1+ parts

$0.681

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4,484

$0.681

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Vyrian

USA . 4,719 parts In-Stock

1+ parts

-

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4,719

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Anansix

USA . 833 parts In-Stock

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833

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,016 parts In-Stock

1+ parts

$0.645

100+ parts

-

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3,016

$0.645

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Component Stockers USA

USA . 617 parts In-Stock

1+ parts

$99.990

100+ parts

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617

$99.990

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UNI Independent Distributors

Spain . 6,905 parts In-Stock

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6,905

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 28 parts In-Stock

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28

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Overview

Elevate your designs with the HTMS1201FTK/AF,115 from NXP Semiconductors—where quality meets innovation. Perfectly engineered for telecom applications, this compact IC offers reliable performance in extreme conditions, ensuring your systems run smoothly from -40 °C to 85 °C. With NXP's renowned industry expertise, trust in unparalleled durability and efficiency, enhancing your projects while driving down costs. Experience the benefits of a cutting-edge solution that puts you ahead!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient assembly and minimizes board space, facilitating integration into compact designs.

Package Shape: RECTANGULAR

The rectangular shape is ideal for space-constrained applications, providing flexibility in layout and design.

No. of Terminals: 2

Having only 2 terminals simplifies the circuit connections, making it easier for designers to integrate with other components.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and thin profile enhance the product's versatility, allowing it to fit into low-profile designs and providing excellent thermal performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in standard industrial environments, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this product ideal for extreme conditions, enabling its use in outdoor or harsh environments.

Terminal Position: DUAL

Dual terminal positioning allows for better PCB layout flexibility and enhances the routing capabilities of the design.

Maximum Seated Height: 1 mm

A low seated height of 1 mm supports ultra-thin designs, catering to modern compact device requirements.

Width: 2 mm

A width of 2 mm is well-suited for tightly packed circuitry, ensuring minimal space is consumed on the PCB.

Length: 3 mm

At 3 mm in length, this component's size allows for high-density layouts, making it a great choice for space-limited applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature ranges ensures this product is robust and reliable for various industrial applications.

Technology: CMOS

Utilizing CMOS technology enhances power efficiency and performance, making it ideal for battery-operated or power-sensitive devices.

Terminal Form: NO LEAD

No lead terminals promote a smaller footprint and eliminate concerns related to lead soldering, contributing to environmental sustainability.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit, this IC is specifically designed for telecom applications, ensuring optimized performance in communication systems.

Technical Specifications

Other Function Telecom Interface ICs HTMS1201FTK/AF,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N2

Length:

3 mm

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

HTMS1201FTK/AF,115 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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