Loading...

HTMS1001FTB/AF

NXP Semiconductors

HTMS1001FTB/AF by NXP Semiconductors

HTMS1001FTB/AF by NXP Semiconductors is a telecom interface IC designed for industrial applications. It operates b/w -40 °C to 85 °C, features a 5V nominal voltage, and comes in a compact no-lead package with 3 terminals. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,650

-

-

-

-

Digiode

USA . 1,557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,557

-

-

-

-

Anansix

USA . 1,369 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,369

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 344 parts In-Stock

1+ parts

$613.000

100+ parts

-

1k+ parts

-

10k+ parts

-

344

$613.000

-

-

-

Corphita

USA . 4,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,326

-

-

-

-

UNI Independent Distributors

Spain . 643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

643

-

-

-

-

Perfect Parts

USA . 129 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

129

-

-

-

-

Overview

Unlock superior connectivity with the HTMS1001FTB/AF from NXP Semiconductors, a leader in innovative technology. Designed for industrial excellence, this compact telecom interface IC ensures seamless performance across various applications, from communications to automation. With its robust operating temperature range and reliable construction, it offers unmatched stability and efficiency. Elevate your projects with a solution that combines quality, durability, and expert engineering from NXP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for long-term use in various settings.

Surface Mount: YES

Surface mount technology allows for smaller circuit board designs and improved space efficiency, which is ideal for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for efficient layout and integration into various applications.

No. of Terminals: 3

With three terminals, this IC offers a simple yet effective connection scheme that simplifies integration into your circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style is perfect for compact electronic devices where space is limited, enhancing versatility for product designers.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in challenging environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product can function in extreme cold conditions, expanding its usability in various climates.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in circuit design while ensuring stable and reliable connectivity.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this temperature grade guarantees robustness in harsh conditions and extended lifespan.

Terminal Form: NO LEAD

No lead terminals facilitate easier assembly and soldering processes, meeting modern manufacturing standards while reducing environmental impact.

Telecom IC Type: TELECOM CIRCUIT

Specialization as a telecom circuit IC means it is tailored for communication systems, ensuring high performance and reliability in telecom applications.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, this IC is compatible with a wide range of power supplies, making it easy to integrate into existing systems.

Technical Specifications

Other Function Telecom Interface ICs HTMS1001FTB/AF attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N3

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

HTMS1001FTB/AF Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19