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HTMS1201FTB/AF,118

NXP Semiconductors

HTMS1201FTB/AF,118 by NXP Semiconductors

HTMS1201FTB/AF,118 by NXP Semiconductors is a CMOS telecom circuit IC designed for surface mount applications. It features a quad terminal configuration with 3 terminals and comes in a plastic/epoxy chip carrier package. Ideal for enhancing telecom interfaces, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,236 parts In-Stock

1+ parts

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2,236

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Digiode

USA . 382 parts In-Stock

1+ parts

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1k+ parts

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382

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Anansix

USA . 344 parts In-Stock

1+ parts

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344

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,024 parts In-Stock

1+ parts

$553.000

100+ parts

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1,024

$553.000

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UNI Independent Distributors

Spain . 6,748 parts In-Stock

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6,748

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Corphita

USA . 499 parts In-Stock

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499

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Overview

Elevate your telecom solutions with the HTMS1201FTB/AF,118 from NXP Semiconductors. Renowned for innovation and unmatched quality, NXP delivers a versatile interface IC that seamlessly integrates into your systems, enhancing performance and reliability. Its advanced design ensures efficient communication in various applications, making it the ideal choice for industry leaders seeking to optimize operations while enjoying the benefits of reduced complexity and superior durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection against environmental factors, making the product reliable in various telecom applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient circuit layouts, making this IC suitable for modern electronics where space is at a premium.

No. of Terminals: 3

With three terminals, this IC provides a simple yet effective interface, making it easier to integrate into existing circuits and reducing the complexity of designs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style allows for effective thermal management and signal integrity, making it suitable for high-performance telecom applications.

Terminal Position: QUAD

The quad terminal position enhances connectivity options and facilitates easier routing on printed circuit boards, which is beneficial for complex telecommunications systems.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an excellent choice for energy-efficient telecom devices without sacrificing performance.

Terminal Form: NO LEAD

No lead terminals provide a compact design and better PCB layout options, which can enhance the overall performance of telecom systems by reducing parasitic capacitance.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit IC, it is specifically designed to meet the requirements of telecommunications, ensuring optimal performance in communication applications.

Technical Specifications

Other Function Telecom Interface ICs HTMS1201FTB/AF,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC3(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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