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HTMS1101FUG/AM,026

NXP Semiconductors

HTMS1101FUG/AM,026 by NXP Semiconductors

HTMS1101FUG/AM,026 by NXP Semiconductors is a telecom interface IC designed for industrial applications. It operates in extreme temperatures from -40 °C to 85 °C and features a no-lead terminal form in a square package. Ideal for surface mount technology, it utilizes CMOS for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,905 parts In-Stock

1+ parts

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3,905

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Anansix

USA . 1,993 parts In-Stock

1+ parts

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1k+ parts

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1,993

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Digiode

USA . 1,580 parts In-Stock

1+ parts

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1,580

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 503 parts In-Stock

1+ parts

$413.000

100+ parts

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1k+ parts

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10k+ parts

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503

$413.000

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UNI Independent Distributors

Spain . 7,794 parts In-Stock

1+ parts

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7,794

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Corphita

USA . 2,082 parts In-Stock

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2,082

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Overview

Elevate your telecom solutions with the HTMS1101FUG/AM,026 from NXP Semiconductors, a leader in semiconductor innovation. This robust interface IC ensures reliable performance in demanding industrial environments, operating seamlessly between -40 °C and 85 °C. Its compact design and no-lead format make it ideal for space-constrained applications, delivering exceptional value by enhancing efficiency and reducing downtime. Trust NXP for quality and performance that drives your technology forward!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration into modern electronic devices, saving space on the PCB.

Package Shape: SQUARE

The square package shape optimizes the thermal management and electrical performance, making it suitable for high-performance applications.

Package Style (Meter): UNCASED CHIP

The uncasem chip style enables flexibility in custom mounting solutions, ideal for specialized applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is capable of functioning in challenging environments without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C ensures reliability in extreme cold conditions, making it suitable for industrial applications.

Terminal Position: UPPER

The upper terminal position facilitates easier access during assembly and testing, improving manufacturing efficiency.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature ranges, this IC guarantees robustness and longevity in demanding environments.

Technology: CMOS

The use of CMOS technology results in lower power consumption and higher noise immunity, making this IC energy-efficient.

Terminal Form: NO LEAD

The no-lead terminal form enhances performance by reducing parasitic capacitance, making it suitable for high-frequency applications.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC meets the stringent standards required for reliable communication systems.

Technical Specifications

Other Function Telecom Interface ICs HTMS1101FUG/AM,026 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Equivalence Code:

WAFER

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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