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HTMS1101FTK/AF,115

NXP Semiconductors

HTMS1101FTK/AF,115 by NXP Semiconductors

HTMS1101FTK/AF,115 by NXP Semiconductors is a dual-terminal telecom interface IC designed for industrial applications. It operates b/w -40 °C to 85 °C and features a very thin profile of 2mm x 3mm. This CMOS device is ideal for compact telecom solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip1Stop

Japan . 15 parts In-Stock

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Vyrian

USA . 8,334 parts In-Stock

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Digiode

USA . 3,384 parts In-Stock

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Anansix

USA . 2,157 parts In-Stock

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Component Stockers USA

USA . 627 parts In-Stock

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$99.990

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One Stop Electronics

USA . 129 parts In-Stock

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UNI Independent Distributors

Spain . 5,702 parts In-Stock

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Corphita

USA . 2,140 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Overview

Unlock unparalleled performance with the HTMS1101FTK/AF,115 from NXP Semiconductors, a leader in cutting-edge technology. Designed for seamless telecom applications, this compact interface IC combines reliability with exceptional quality, ensuring your systems operate smoothly in diverse environments. Its robust design withstands extreme temperatures, making it perfect for industrial use. Choose NXP for innovation that empowers your projects and elevates your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body ensures durability and resistance to environmental influences, making it suitable for various telecom applications.

Surface Mount: YES

The surface mount capability allows for compact and efficient PCB designs, making the product ideal for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into designs, promoting versatility in placement on PCBs.

No. of Terminals: 2

With only two terminals, the product offers simplicity in connections, reducing the risk of wiring errors in telecom applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and very thin profile enhance space-saving designs, allowing for integration in compact telecom devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in demanding environments typically found in telecom systems.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this product is capable of functioning in extreme cold conditions, enhancing its reliability in various climates.

Terminal Position: DUAL

The dual terminal position design aids in better connectivity and ensures minimal signal loss in telecommunication applications.

Maximum Seated Height: 1 mm

A low maximum seated height allows for low-profile designs, enabling easy integration into sleek and modern telecom devices.

Width: 2 mm

The compact width supports integration into highly miniaturized products, maintaining the performance without taking up substantial space.

Length: 3 mm

The short length enhances PCB layout flexibility and allows for closer placement of components, which is essential in complex telecom circuits.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robust performance in harsh conditions, catering to reliability in critical telecom infrastructure.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption while maintaining high performance, which is vital in telecom applications to prolong battery life.

Terminal Form: NO LEAD

The no-lead terminal form offers enhanced solderability and allows for a reduced footprint on the PCB, promoting efficient assembly practices.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit type IC, it is specifically designed to manage telecom signals efficiently, making it an ideal solution for various telecommunication projects.

Technical Specifications

Other Function Telecom Interface ICs HTMS1101FTK/AF,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N2

Length:

3 mm

No. of Functions:

1

No. of Terminals:

2

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

HTMS1101FTK/AF,115 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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