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SL3S1203AC2,118

NXP Semiconductors

SL3S1203AC2,118 by NXP Semiconductors

SL3S1203AC2,118 by NXP Semiconductors is an industrial-grade telecom interface IC operating b/w -40 °C and 85 °C. It features a nominal voltage of 1.8V and a max current of 0.265mA, ideal for low-power telecom applications. This component ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,884 parts In-Stock

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Anansix

USA . 159 parts In-Stock

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Digiode

USA . 102 parts In-Stock

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AZTECH Wire

Italy . 1,218 parts In-Stock

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$9.440

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One Stop Electronics

USA . 1,431 parts In-Stock

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$318.000

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UNI Independent Distributors

Spain . 6,379 parts In-Stock

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Corphita

USA . 2,797 parts In-Stock

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Perfect Parts

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Overview

Unlock the potential of your telecom applications with the SL3S1203AC2,118 from NXP Semiconductors. Designed for industrial environments, this high-quality interface IC delivers reliability even in extreme temperatures, ensuring uninterrupted performance. With minimal power consumption and robust manufacturing excellence, it’s the perfect solution for modern communication needs, providing lasting value and peace of mind to customers seeking efficiency and durability.

Feature Benefit Bullets

Power Supplies (V): 1.8 V

This low voltage operation makes the product energy efficient, ideal for battery-powered applications in telecommunication.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature indicates robust performance in demanding environments, ensuring reliability in various conditions.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C makes this product suitable for harsh conditions, enhancing its versatility in outdoor and extreme applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this specification assures durability and reliability in challenging operating environments.

Maximum Supply Current: 0.265 mA

The low supply current extends battery life, making it a perfect choice for low-power and energy-sensitive telecommunications applications.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed as a telecom circuit ensures optimized performance for telecommunication applications, increasing overall efficiency.

Nominal Supply Voltage: 1.8 V

This nominal supply voltage aligns with modern low-voltage standards, enhancing compatibility with a wide range of devices and systems.

Technical Specifications

Other Function Telecom Interface ICs SL3S1203AC2,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Equivalence Code:

DIE OR CHIP

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.265 mA

Nominal Supply Voltage:

1.8 V

Telecom IC Type:

Temperature Grade:

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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