Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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BGX7100HN/1,115 by NXP Semiconductors is a versatile telecom interface IC designed for surface mount applications. It operates at a nominal voltage of 5V and features a compact 24-terminal chip carrier package. Ideal for communication systems, it supports high-temperature reflow processes up to 260 °C.
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The use of plastic/epoxy as the package body material offers good thermal conductivity and protection against environmental factors, ensuring reliability in diverse applications.
Being surface mount enables easier assembly and integration into modern PCB designs, which is crucial for compact and efficient electronic devices.
The square package shape provides efficient use of PCB space and helps in the arrangement of other components around it, optimizing overall layout design.
Operating at a power supply of 5V is standard for many digital and telecom applications, ensuring compatibility with various systems and ease of integration.
Having 24 terminals allows for multiple connectivity options, making this IC versatile for different functions in telecom interfaces.
The chip carrier package style enhances the product's thermal performance and electrical properties, making it suitable for high-performance telecom applications.
The quad terminal positioning facilitates efficient routing on the PCB and improves layout flexibility, successfully accommodating complex designs.
A peak reflow temperature of 260 °C allows for compatibility with lead-free solder processes, promoting environmentally friendly manufacturing practices.
The no-lead terminal form enhances reliability and reduces the risk of corrosion over time, which is especially beneficial in high-density assemblies.
Operating at a nominal supply voltage of 5V ensures energy efficiency and reduces power consumption, making it a cost-effective choice for telecom interfaces.
A terminal pitch of 0.5 mm allows for high-density designs and makes it feasible to fit more components within a limited space, which is ideal for compact packages.
Other Function Telecom Interface ICs BGX7100HN/1,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
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Nominal Supply Voltage:
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BGX7100HN/1,115 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev EOL 31/May/2018
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
1N4148
Toshiba
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
Daco Semiconductor
EU2B-YS3103F
Idec
ROTARY SWITCH;
MMBT2222ALT1G
Rochester Electronics
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .3 W; Maximum Collector Current (IC): .6 A;
Yangzhou Yangjie Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Maximum Drain Current (ID): .34 A;
SMBJ18CA
STMicroelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Swampscott Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Plessey Semiconductors Discrete Components Div
Other Transistors;
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
International Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.1 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
SS14
Hy Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M85049/85-08W02
Glenair
CONNECTOR ACCESSORY; MIL Conformity: YES; Material: ALUMINIUM ALLOY; Associated Backshell Military - Specifications: MIL-DTL-38999; Shell Sizes: 08; DIN Conformity: NO;
LM555CN
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Continental Device India
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
Taitron Components
ULN2803A
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified;
XB3-24DMCM-J
Digi International
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
RN4678APL-V/RM100
Microchip Technology
Microchip Technology's RN4678APL-V/RM100 is a surface mount telecom IC with 33 terminals. Operating temperature range from -20 to 70°C, suitable for commercial applications. Nominal voltage of 1.9V, compact size of 12x22mm makes it ideal for telecom circuit integration.
ZED-F9R-01B
U-blox Ag
TELECOM CIRCUIT; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 4;
NEO-M8P-0-11
NEO-M8P-0-11 by U-blox Ag is a telecom IC with 24 terminals, operating temperature range of -40 to 85 °C. It has AEC-Q100 screening level and TS 16949 certification. Ideal for industrial applications requiring precise positioning and communication capabilities.
EQCO62T20.3
EQCO62T20.3 by Microchip Technology is a telecom interface IC with 1 function, 16 terminals, and a square package shape. It operates in an industrial temperature range of -40 to 85°C and has a nominal voltage of 1.2V. This IC is suitable for telecom circuit applications.
ST60-2230C-PU
Laird Technologies
TELECOM CIRCUIT;
MAX-M10S-00B
MAX-M10S-00B by U-blox Ag is a RECTANGULAR MICROELECTRONIC IC with 18 terminals, operating from -40 to 85°C. It has a width of 9.7mm and length of 10.1mm, suitable for TELECOM CIRCUITS at 3V supply voltage.
SA612AD/01,118
NXP Semiconductors
SA612AD/01,118 by NXP Semiconductors is an 8-terminal telecom IC with a supply voltage of 3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This small outline IC is suitable for telecom circuit applications due to its dual terminal position and gull wing form factor.
RN42N-I/RM
RN42N-I/RM by Microchip Technology is a telecom IC with 35 terminals, operating temperature range of -40 to 85°C, and data rate of 3 Mbps. It is a surface mount device suitable for industrial applications requiring a nominal voltage of 3.3V.
455-00001
NRF51822-QFAB-R7
Nordic Semiconductor Asa
NRF51822-QFAB-R7 by Nordic Semiconductor Asa is a 48-terminal telecom IC with a 1.8V supply voltage, operating b/w -25°C to 75°C. It features a square chip carrier package style and quad terminal position, suitable for telecom circuit applications requiring a very thin profile design.
GS2972-IBE3
Semtech
Semtech's GS2972-IBE3 is a telecom IC with 100 terminals in a square package. It operates b/w -20°C to 85°C, with a low profile grid array style. Featuring TIN SILVER COPPER finish, it has a 1.2V supply voltage and is ideal for telecom interface applications.
AT86RF215IQ-ZUR
AT86RF215IQ-ZUR by Microchip Technology is a telecom IC with RF and baseband circuit. It operates at temperatures ranging from -40 to 85 °C, has a package size of 7x7 mm, and uses a terminal pitch of 0.5 mm. It is suitable for applications in telecommunications and other industries.
M2-MAYA-W166-10C
BLUENRG-M2SP
BLUENRG-M2SP by STMicroelectronics is a 20-terminal telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It comes in a rectangular package style, suitable for industrial applications requiring reliable telecom circuit interfaces. With surface mount capability and compact dimensions of 13.5mm x 11.5mm x 2.5mm, it offers peak reflow temperature of 240°C for efficient assembly processes.
MD0100N8-G
Supertex
TELECOM CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: FLAT; No. of Terminals: 3; Package Code: LSOF; Package Shape: RECTANGULAR;
EFR32BG22C224F512IM32-C
Silicon Labs
CAM-M8C-0
ODIN-W260
ODIN-W260 by U-blox Ag is a TELECOM CIRCUIT with 3.3V supply, operating from -40°C to 85°C. RECTANGULAR MICROELECTRONIC ASSEMBLY package for telecom interfaces, ideal for various applications requiring reliable connectivity in extreme temperature conditions.
RN4870-I/RM128
RN4870-I/RM128 by Microchip Technology is a telecom IC with 33 terminals, operating temperature range of -40 to 85°C, and data rate of 0.01 Mbps. It is used in industrial applications requiring a nominal voltage of 3.3V for wireless communication.
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BGX7100HN/1,118
Other Telecom ICs; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: QCCN; Package Shape: SQUARE; Qualification: Not Qualified;
BGX7221HN
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Position: QUAD;
BGX7221HN/1,518
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE; No. of Functions: 1;
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