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BGX7100HN/1,118

NXP Semiconductors

BGX7100HN/1,118 by NXP Semiconductors

BGX7100HN/1,118 by NXP Semiconductors is a versatile telecom interface IC designed for surface mount applications. It operates at a nominal voltage of 5V and features a compact 24-terminal chip carrier package. Ideal for communication systems, it supports peak reflow temps up to 260 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,638 parts In-Stock

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Digiode

USA . 2,233 parts In-Stock

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2,233

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Anansix

USA . 614 parts In-Stock

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614

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Distributors (Availability)

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Native Components

USA . 911 parts In-Stock

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$0.512

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911

$0.512

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Northwest PG Solutions

USA . 1,780 parts In-Stock

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$0.563

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$0.497

1,780

$0.563

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$0.497

AZTECH Wire

Italy . 402 parts In-Stock

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$15.480

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402

$15.480

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Microchip USA

USA . 2,575 parts In-Stock

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$16.575

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2,575

$16.575

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One Stop Electronics

USA . 631 parts In-Stock

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$79.000

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631

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UNI Independent Distributors

Spain . 3,004 parts In-Stock

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Corphita

USA . 1,974 parts In-Stock

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Overview

Elevate your connectivity with the BGX7100HN/1,118 from NXP Semiconductors—a leader in innovative technology. This versatile telecom interface IC is designed for seamless integration into various applications, ensuring reliability and quality you can trust. With its compact, surface-mount design, it delivers exceptional performance while optimizing space. Experience enhanced communication efficiency and unlock new opportunities to propel your projects forward with NXP’s cutting-edge solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, ensuring the IC's longevity even in challenging environments.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of PCB space, making it suitable for modern electronics.

Package Shape: SQUARE

The square shape enables uniform distribution of heat and efficient layout in PCB designs.

Power Supplies (V): 5

Operating at a nominal voltage of 5V ensures compatibility with many existing digital systems.

No. of Terminals: 24

The 24 terminals provide ample connectivity options for diverse applications, enhancing versatility.

Package Style (Meter): CHIP CARRIER

The chip carrier package style facilitates better heat dissipation and robust mechanical support for the IC.

Terminal Position: QUAD

The quad terminal position allows for easier routing and layout on complex circuit boards.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures reliable soldering during manufacturing, minimizing defects.

Terminal Form: NO LEAD

No lead terminals contribute to a compact design and reduced assembly complexity, improving manufacturability.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V offers stability and is widely supported in digital circuit designs.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density placement on PCBs, ideal for space-constrained applications.

Technical Specifications

Other Function Telecom Interface ICs BGX7100HN/1,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N24

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

BGX7100HN/1,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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