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SL3ICS1002FUG/V7AF

NXP Semiconductors

SL3ICS1002FUG/V7AF by NXP Semiconductors

SL3ICS1002FUG/V7AF by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It features an operating temp range of -40 °C to 85 °C, an 8-terminal no-lead design, and utilizes CMOS technology. Ideal for surface mount integration in telecom circuits.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,041 parts In-Stock

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Digiode

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Anansix

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AZTECH Wire

Italy . 731 parts In-Stock

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$11.730

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One Stop Electronics

USA . 1,515 parts In-Stock

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Perfect Parts

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QUARKTWIN TECHNOLOGY LTD

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UNI Independent Distributors

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Corphita

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Overview

Unlock seamless connectivity and robust performance with the SL3ICS1002FUG/V7AF from NXP Semiconductors. Renowned for their innovation and reliability, NXP ensures this Telecom Interface IC excels in various industrial applications. With its advanced CMOS technology and wide temperature range, it’s designed to withstand challenging environments. Elevate your projects with a product that guarantees high quality, efficiency, and long-term value, tailored to meet your exacting standards.

Feature Benefit Bullets

Surface Mount: YES

This feature allows for efficient use of PCB space and facilitates automated assembly, making the product ideal for high-volume manufacturing.

Package Shape: RECTANGULAR

The rectangular shape offers optimal layout flexibility, enabling better integration into various designs and applications.

No. of Terminals: 8

With 8 terminals, this IC provides versatile connectivity options, allowing for more complex telecommunications functions.

Package Style (Meter): UNCASED CHIP

Being an uncased chip enhances thermal performance and miniaturization, crucial for compact electronic designs.

Maximum Operating Temperature: 85 °C

Rated for operation up to 85 °C, this product is reliable in demanding environments, extending its applicability in industrial settings.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for use in extreme conditions, ensuring performance reliability in harsh climates.

Terminal Position: UPPER

Upper terminal positioning allows for easy access during PCB assembly and testing, enhancing overall build efficiency.

Temperature Grade: INDUSTRIAL

Designed with an industrial temperature grade, this IC meets rigorous standards, ensuring durability and long-term functionality.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high speed, making this IC efficient for telecommunications applications.

Terminal Form: NO LEAD

No lead terminal design contributes to a compact footprint while complying with environmental regulations, suitable for modern applications.

Telecom IC Type: TELECOM CIRCUIT

Specialized as a telecom circuit, this IC is tailored for specific communication needs, providing optimized performance for telecom systems.

Technical Specifications

Other Function Telecom Interface ICs SL3ICS1002FUG/V7AF attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-XUUC-N8

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SL3ICS1002FUG/V7AF Telecommunications trade compliance attributes, and parameters.

HTS

8542.32.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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