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SL3ICS3001FW/F1

NXP Semiconductors

SL3ICS3001FW/F1 by NXP Semiconductors

SL3ICS3001FW/F1 by NXP Semiconductors is a telecom interface IC designed for efficient communication. It features an 8-terminal, no-lead design in a rectangular package, ideal for surface mount applications. This versatile chip enhances connectivity in various telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,059 parts In-Stock

1+ parts

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1k+ parts

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4,059

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Digiode

USA . 829 parts In-Stock

1+ parts

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1k+ parts

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829

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Anansix

USA . 780 parts In-Stock

1+ parts

-

100+ parts

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780

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 558 parts In-Stock

1+ parts

$530.000

100+ parts

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1k+ parts

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10k+ parts

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558

$530.000

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UNI Independent Distributors

Spain . 5,322 parts In-Stock

1+ parts

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5,322

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Corphita

USA . 3,246 parts In-Stock

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3,246

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Overview

Unlock the power of seamless communication with the SL3ICS3001FW/F1 from NXP Semiconductors, a leader in innovative tech solutions. This advanced telecom interface IC elevates your projects with its superior quality and reliability, ensuring optimal performance in diverse applications. With a compact design and no-lead terminals, it streamlines integration while delivering exceptional value, making it the ideal choice for enhancing connectivity in your next project.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for easier integration into compact circuit designs, making it suitable for modern applications with space constraints.

Package Shape: RECTANGULAR

A rectangular package shape provides an efficient use of board space, which helps in better layout configuration for high-density assemblies.

No. of Terminals: 8

With 8 terminals, this IC offers a balanced number of connections, providing flexibility for various circuit designs without overcomplicating layouts.

Package Style (Meter): UNCASED CHIP

The uncase chip style is advantageous for custom mounting solutions and allows for better thermal management in some designs.

Terminal Position: UPPER

Upper terminal positioning facilitates easier access for soldering and assembly, leading to reduced manufacturing complexities.

Terminal Form: NO LEAD

The no lead design minimizes the footprint on the PCB for space-sensitive applications and can enhance electrical performance by reducing inductance.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit IC, it is specifically designed for reliable performance in telecom applications, ensuring robustness and efficiency.

Technical Specifications

Other Function Telecom Interface ICs SL3ICS3001FW/F1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-XUUC-N8

No. of Terminals:

8

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

SL3ICS3001FW/F1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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