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SL3ICS3001FW/V7

NXP Semiconductors

SL3ICS3001FW/V7 by NXP Semiconductors

SL3ICS3001FW/V7 by NXP Semiconductors is an industrial-grade telecom interface IC designed for robust performance. It operates b/w -40 °C and 85 °C, features a no-lead terminal form, and comes in an uncasded chip package. Ideal for telecom applications requiring reliable connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,579 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,579

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Digiode

USA . 755 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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755

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Vyrian

USA . 439 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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439

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 952 parts In-Stock

1+ parts

$234.000

100+ parts

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1k+ parts

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10k+ parts

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952

$234.000

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UNI Independent Distributors

Spain . 4,516 parts In-Stock

1+ parts

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4,516

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Corphita

USA . 3,217 parts In-Stock

1+ parts

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100+ parts

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3,217

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Overview

Unlock superior performance and reliability with the SL3ICS3001FW/V7 from NXP Semiconductors, a leader in innovative technology solutions. Designed for demanding industrial applications, this telecom interface IC excels in extreme temperatures, ensuring seamless connectivity. With NXP's commitment to quality and cutting-edge engineering, you gain peace of mind and enhanced functionality, empowering your designs to thrive in any environment while delivering exceptional value and longevity.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for smaller designs and easier automated assembly, making it ideal for compact electronic devices.

Package Style (Meter): UNCASED CHIP

The uncasded chip design enables flexible integration into various applications without the added bulk of a traditional package, promoting versatility.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product ensures functionality in high-temperature environments, providing reliability under stress.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 85 °C) supports applications in extreme environments, making it suitable for industrial and outdoor use.

Terminal Position: UPPER

Having the terminal position on the upper side enhances the accessibility for connections, making installation straightforward.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robustness and reliability, suitable for a variety of demanding applications in harsh conditions.

Terminal Form: NO LEAD

The no lead design reduces space requirements and improves the performance of the IC by minimizing parasitic capacitance.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC type ensures optimal performance and reliability for communication systems.

Technical Specifications

Other Function Telecom Interface ICs SL3ICS3001FW/V7 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

SL3ICS3001FW/V7 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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