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SL3ICS3001FW/V1

NXP Semiconductors

SL3ICS3001FW/V1 by NXP Semiconductors

SL3ICS3001FW/V1 by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It features a wide operating temperature range from -40 °C to 85 °C, a compact no-lead design with 4 terminals, and surface mount capability. Ideal for reliable communication in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,697 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,697

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-

-

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Digiode

USA . 3,114 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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3,114

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-

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Anansix

USA . 1,361 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,361

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 607 parts In-Stock

1+ parts

$965.000

100+ parts

-

1k+ parts

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10k+ parts

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607

$965.000

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UNI Independent Distributors

Spain . 4,526 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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4,526

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Corphita

USA . 1,119 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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1,119

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Overview

Unlock the potential of your telecom solutions with the SL3ICS3001FW/V1 from NXP Semiconductors, a trusted name in high-quality electronic components. This versatile interface IC is designed for reliability and performance across extreme temperatures, ensuring seamless communication in demanding environments. With its compact, surface-mount design, it’s perfect for a range of applications—from industrial to consumer electronics—delivering efficiency and enhanced connectivity that elevate your projects to new heights.

Feature Benefit Bullets

Surface Mount: YES

The surface mount feature allows for easier integration into compact electronic designs, saving space and improving overall circuit layout.

No. of Terminals: 4

With 4 terminals, this IC provides a simple yet effective interface for multiple functions, ensuring versatility in application.

Package Style (Meter): UNCASED CHIP

The uncased chip design contributes to a lower profile and lighter weight, suitable for high-density applications where space is crucial.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in warmer environments, making it ideal for industrial applications.

Minimum Operating Temperature: -40 °C

With the capability to operate at -40 °C, this IC is suitable for harsh climates and outdoor applications where extreme temperatures are a factor.

Terminal Position: UPPER

The upper terminal positioning enhances accessibility for soldering and integration, simplifying the assembly process.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates robust performance and reliability in challenging environments, catering to industrial-grade applications.

Terminal Form: NO LEAD

The no lead form minimizes footprint and could reduce the risk of mechanical failure, allowing for more durable connections in various applications.

Telecom IC Type: TELECOM CIRCUIT

As a specialized telecom IC, it is tailored for telecom applications, ensuring optimal performance in communication systems and networks.

Technical Specifications

Other Function Telecom Interface ICs SL3ICS3001FW/V1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

X-XUUC-N

No. of Functions:

1

No. of Terminals:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Trade Compliance

SL3ICS3001FW/V1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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