Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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SL3ICS3001FW/V1 by NXP Semiconductors is a robust telecom interface IC designed for industrial applications. It features a wide operating temperature range from -40 °C to 85 °C, a compact no-lead design with 4 terminals, and surface mount capability. Ideal for reliable communication in harsh environments.
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The surface mount feature allows for easier integration into compact electronic designs, saving space and improving overall circuit layout.
With 4 terminals, this IC provides a simple yet effective interface for multiple functions, ensuring versatility in application.
The uncased chip design contributes to a lower profile and lighter weight, suitable for high-density applications where space is crucial.
The high maximum operating temperature ensures reliable performance in warmer environments, making it ideal for industrial applications.
With the capability to operate at -40 °C, this IC is suitable for harsh climates and outdoor applications where extreme temperatures are a factor.
The upper terminal positioning enhances accessibility for soldering and integration, simplifying the assembly process.
The industrial temperature grade indicates robust performance and reliability in challenging environments, catering to industrial-grade applications.
The no lead form minimizes footprint and could reduce the risk of mechanical failure, allowing for more durable connections in various applications.
As a specialized telecom IC, it is tailored for telecom applications, ensuring optimal performance in communication systems and networks.
Other Function Telecom Interface ICs SL3ICS3001FW/V1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
JESD-30 Code:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Qualification:
Surface Mount:
Telecom IC Type:
Temperature Grade:
Terminal Form:
Terminal Position:
SL3ICS3001FW/V1 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138-7-F
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
Toshiba
KSZ9031RNXIA
Microchip Technology
KSZ9031RNXIA by Microchip is a 48-terminal Ethernet transceiver with data rate of 1000 Mbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. This square-shaped chip carrier has a very thin profile and matte tin finish, ideal for network interfaces.
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
SS14
Taiwan Semiconductor
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
2N7002
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Vishay Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
Surge Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Synsemi
LM358AN
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
ESP32-WROVER-E
Espressif Systems (shanghai)
ESP32-WROVER-E by Espressif Systems is a telecom IC with 150 Mbps data rate, operating at -40 to 85°C. With 3.3V supply voltage, it's ideal for industrial applications requiring high-speed wireless connectivity in compact form factor (31.4mm x 18mm).
XB3-24AUT-J
Digi International
XB3-24AUT-J by Digi International is a TELECOM CIRCUIT with 1 Mbps Data Rate. Operating Temperature ranges from -40 to 85 °C. It is used in telecom interfaces for various applications due to its RECTANGULAR package shape and SPECIAL SHAPE style.
HTRC11001T/03EE
NXP Semiconductors
NXP Semiconductors' HTRC11001T/03EE is a telecom IC with 14 terminals, operating at -40 to 85°C. It has a supply voltage of 3V and current of 0.01mA, suitable for industrial applications. The package is small outline, rectangular in shape, with gull wing terminals for surface mount assembly.
TDA5210XUMA1
Infineon Technologies
TDA5210XUMA1 by Infineon is a telecom IC with 28 terminals, operating from -40 to 105°C. It features a small outline package style, tin terminal finish, and 5V supply voltage. Ideal for telecom circuits, it has a rectangular shape and thin profile suitable for industrial applications.
TLE8457BSJXUMA1
TLE8457BSJXUMA1 by Infineon is a BICMOS technology telecom IC with 8 terminals in a small outline package. It operates at a nominal voltage of 8V and has a terminal pitch of 1.27mm. This AEC-Q100 screened IC is ideal for telecom circuit applications due to its compact size and gull wing terminal form.
ZOE-M8Q
U-blox Ag
TELECOM CIRCUIT;
MGM12P02F1024GA-V2
Silicon Labs
HMC624ALP4E
Hittite Microwave
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;
EYSHSNZWZ
Kaga Electronics
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 28; Package Shape: RECTANGULAR; JESD-30 Code: R-XBGA-N28; Minimum Operating Temperature: -40 Cel;
CC2640R2FRSMR
Texas Instruments
CC2640R2FRSMR by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. Suitable for telecom circuits, it has a terminal pitch of 0.4mm and is designed for industrial temperature grades.
AD9364BBCZREEL
Analog Devices
AD9364BBCZREEL by Analog Devices is a 144-terminal telecom IC with a supply voltage of 1.8V, operating b/w -40 to 85°C. It features a grid array package style and is suitable for telecom circuit applications requiring low profile and fine pitch components.
XB3-24AUM
The Digi International XB3-24AUM is a TELECOM CIRCUIT with 1 Mbps Data Rate. It operates b/w -40 to 85 °C, making it suitable for telecom applications. The RECTANGULAR package shape and SPECIAL SHAPE style enhance its performance in telecom interface ICs.
SX1281IMLTRT
Semtech
TELECOM CIRCUIT; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
AX5043-1-TW30
AX5043-1-TW30 by Onsemi is a telecom IC with CMOS technology, operating at -40 to 85°C. It features a data rate of 0.125 Mbps, 28 terminals in a square chip carrier package, and terminal pitch of 0.5 mm. Ideal for telecom circuits, this IC has a nominal voltage of 3V and peak reflow temperature of 260°C.
NRF51822-QFAA-R
Nordic Semiconductor Asa
NRF51822-QFAA-R by Nordic Semiconductor Asa is a 48-terminal telecom IC with 1.8V supply voltage, -25 to 75°C operating temperature range, and 0.4mm terminal pitch. It is used in telecom circuits due to its square chip carrier package style and very thin profile, suitable for surface mount applications.
CC1125RHMR
CC1125RHMR by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. Operating at -40 to 85°C, it has a supply voltage of 3V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features nickel palladium gold finish.
RN4871-I/RM130
RN4871-I/RM130 by Microchip Technology is a surface mount telecom interface IC with 16 terminals. It operates in an industrial temperature range of -40 to 85 °C and has a data rate of 0.01 Mbps. This IC is commonly used in telecom circuits for various applications.
ETRX357HR-LRS
Silicon Labs' ETRX357HR-LRS is a telecom IC with 33 terminals, operating b/w -40°C to 85°C. With a nominal voltage of 3V, it's ideal for industrial applications requiring a compact MICROELECTRONIC ASSEMBLY package and DUAL terminal position.
AT86RF215IQ-ZU
Atmel
RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: VQCCN; Package Shape: SQUARE;
MP45DT02TR-M
STMicroelectronics
STMicroelectronics MP45DT02TR-M is a telecom IC with 6 terminals, operating b/w -30 to 85°C. It has a rectangular shape, grid array package style, and nickel palladium gold finish. With a nominal voltage of 1.8V, it's ideal for telecom circuit applications due to its compact size (4.72mm x 3.76mm) and no-lead terminal form.
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SL3ICS1002FUG/V7AF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: DIE; Package Shape: RECTANGULAR;
SL3ICS1002FUGV7AFZ
SL3ICS1202FUG/V7AF
SL3ICS3001FW/F1
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Shape: RECTANGULAR; JESD-30 Code: R-XUUC-N8; Terminal Position: UPPER;
SL3ICS3001FW/V1,00
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Package Equivalence Code: DIE OR CHIP; Minimum Operating Temperature: -40 Cel; Maximum Operating Temperature: 85 Cel;
SL3ICS3001FW/V4
TELECOM CIRCUIT; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; JESD-30 Code: X-XUUC-N; Terminal Position: UPPER;
SL3ICS3001FW/V4,00
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Maximum Operating Temperature: 85 Cel; Package Equivalence Code: DIE OR CHIP; Qualification: Not Qualified; Minimum Operating Temperature: -40 Cel;
SL3ICS3001FW/V7
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Functions: 1;
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