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MFRC63102HN,157

NXP Semiconductors

MFRC63102HN,157 by NXP Semiconductors

MFRC63102HN,157 by NXP Semiconductors is a compact telecom interface IC with a 5V supply and operates b/w -25 °C to 85 °C. It features a data rate of 0.4 Mbps and comes in a very thin profile package with 32 terminals. Ideal for applications requiring efficient communication in space-constrained environments.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 7,604 parts In-Stock

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Digiode

USA . 4,813 parts In-Stock

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Anansix

USA . 931 parts In-Stock

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Corohmni

South Africa . 567 parts In-Stock

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$14.187

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AZTECH Wire

Italy . 678 parts In-Stock

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One Stop Electronics

USA . 1,310 parts In-Stock

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$148.000

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UNI Independent Distributors

Spain . 5,459 parts In-Stock

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Corphita

USA . 3,821 parts In-Stock

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Overview

Elevate your telecom designs with the MFRC63102HN,157 from NXP Semiconductors, a leader in innovation and quality. This advanced interface IC offers unparalleled reliability and performance, perfect for diverse applications from telecommunications to smart card systems. With its compact design and robust temperature range, it ensures seamless integration and long-term durability, empowering your projects with efficiency and dependability that you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and protection against environmental factors, making the product suitable for various telecom applications.

Surface Mount: YES

Surface mount technology allows for compact design and efficient space utilization on PCBs, making this IC a great choice for space-constrained applications.

Package Shape: SQUARE

The square shape facilitates uniform mounting and effective thermal management, enhancing performance in telecom applications.

No. of Terminals: 32

With 32 terminals, this IC provides substantial connectivity options, allowing for versatile integration in complex telecom systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile allows for a sleek design, enabling efficient cooling and integration into compact telecom equipment.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures stability and reliability under thermal stress, making it suitable for demanding telecom environments.

Minimum Operating Temperature: -25 °C

The wide temperature range allows for operation in extreme conditions, enhancing the versatility of this IC in various telecom applications.

Terminal Position: QUAD

The quad terminal arrangement provides excellent signal integrity and minimizes interference, thereby improving overall performance in circuit design.

Maximum Seated Height: 1 mm

A low profile of 1 mm contributes to a compact design, which is essential for modern telecommunications equipment where space is at a premium.

Width: 5 mm

The 5 mm width aligns well with standard layout practices, facilitating easy integration into existing designs.

Maximum Time At Peak Reflow Temperature (s): 30

Limiting peak reflow time helps to ensure thermal management during assembly, which contributes to reliable operation in the field.

Peak Reflow Temperature °C: 260

A high reflow temperature capability enhances compatibility with modern soldering processes, improving manufacturing efficiency and yield.

Length: 5 mm

The 5 mm length paired with the width makes it ideal for use in tight spaces typically found in telecom equipment.

Terminal Form: NO LEAD

A no-lead design minimizes parasitic inductance and capacitance, enhancing performance for high-speed applications in telecom circuits.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed as a telecom circuit IC ensures optimized function for telecommunications, enhancing reliability and performance.

Nominal Supply Voltage: 5 V

Operating at a standard voltage level of 5 V simplifies design and integration processes in telecom systems.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density PCB layout, making it ideal for advanced telecom applications requiring more functionality in smaller area.

Data Rate: 0.4 Mbps

A data rate of 0.4 Mbps is sufficient for many telecom applications, providing a good balance between performance and power consumption.

Technical Specifications

Other Function Telecom Interface ICs MFRC63102HN,157 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

Data Rate:

.4 Mbps

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

MFRC63102HN,157 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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