Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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HTMS8201FTB/AF,115 by NXP Semiconductors is a compact telecom interface IC featuring a no-lead design with 3 terminals. It supports peak reflow temps of 260 °C and utilizes CMOS technology for efficient performance. Ideal for surface mount applications in telecom circuits.
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The use of plastic/epoxy ensures durability and reliability, making this product suitable for various demanding environments.
Surface mount technology allows for compact designs and easier, automated assembly, enhancing manufacturing efficiency.
With three terminals, this IC offers relatively straightforward connectivity, making it easy to integrate into existing systems.
The chip carrier package style provides a robust connection and supports a greater variety of circuit designs.
Quad terminal positioning allows for efficient routing on PCBs, reducing the complexity of layouts and improving performance.
A peak reflow temperature of 260 °C indicates compatibility with high-temperature soldering processes, ensuring solder joint reliability.
CMOS technology offers low power consumption and high speed, making this IC suitable for energy-efficient applications.
No-lead terminal form enhances space efficiency on PCB layouts, allowing for more compact device designs.
Designed specifically for telecom applications, this IC ensures optimized performance for communication systems.
Other Function Telecom Interface ICs HTMS8201FTB/AF,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors
Moisture Sensitivity Level (MSL):
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HTMS8201FTB/AF,115 Telecommunications trade compliance attributes, and parameters.
HTS
8542.32.00
SB
8542.39.00.00
PCN Obsolescence/ EOL - Mult Dev obs 08/Jul/2023
PCN Packaging - All Dev Label Update 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
DS18B20Z+T&R
Analog Devices
DS18B20Z+T&R by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. The sensor comes in a plastic package suitable for surface mount applications, with a max supply voltage of 5.5V and min of 3V.
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
1N4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Body Material: PLASTIC/EPOXY;
Jiangsu Jiejie Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317TG
Onsemi
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Minimum Input-Output Voltage Differential: 3 V; Qualification Status: Not Qualified; No. of Functions: 1;
NDT2955
NDT2955 by Onsemi is a P-CHANNEL FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 15A and EAS of 174mJ, suitable for ENHANCEMENT MODE operation. With a compact SMALL OUTLINE package and -55 to 150 °C operating range, it offers efficient power dissipation up to 3W.
Continental Device India
M39029/58360
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/58360 is a MIL-Spec backshell with CRIMP contact type and male gender. It conforms to MIL-DTL-38999 standards, mates with M39029/56348 contacts, and requires M81969/14-01 insertion tools. Ideal for military applications requiring reliable crimp terminals.
MBR0530T1G
MBR0530T1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.375V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring high-speed switching in compact electronic devices like smartphones and tablets. The package style is small outline with gull wing terminals for surface mount assembly.
AH180-WG-7
Diodes Incorporated
AH180-WG-7 by Diodes Inc. is a magnetic field sensor with 1.5mT hysteresis, 0.30V output range, and 9mA max operating current. Ideal for applications requiring non-inverting analog voltage output in a compact rectangular package suitable for surface mount installations.
MBR1560CT
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 150 Cel; Maximum Repetitive Peak Reverse Voltage: 60 V; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 150 A;
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
LM107H
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
BSS138
North American Philips Discrete Products Div
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; No. of Elements: 1; Maximum Drain Current (Abs) (ID): .2 A;
LM358DR2G
LM358DR2G by Onsemi is a dual operational amplifier with 7000uV max input offset voltage and 70dB nominal CMRR. Ideal for applications requiring low bias current such as sensor interfaces, signal conditioning circuits, and audio amplifiers. Package style: Small Outline, Technology: Bipolar, Unity Gain Bandwidth: 1000 kHz.
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
Gulf Semiconductor
FDV303N
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
BGT24MR2E6327XUMA1
Infineon Technologies
BGT24MR2E6327XUMA1 by Infineon is a Telecom IC with 32 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 105°C, suitable for industrial use. It operates at 3.3V and features a thin profile design for telecom circuit applications.
PN7160B1HN/C100Y
NXP Semiconductors
PN7160B1HN/C100Y by NXP Semiconductors is a telecom IC with 40 terminals in a square chip carrier package. Operating b/w -25°C to 85°C, it has a data rate of 0.848 Mbps and nominal voltage of 1.8V. Ideal for telecom circuits, this IC is surface mountable and has a max seated height of 1mm.
HMC1094LP3ETR
Analog Devices' HMC1094LP3ETR is a telecom IC with 16 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It has a nominal voltage of 3.3V and matte tin terminal finish, ideal for telecom circuit applications.
PM-8916-0-176NSP-TR-02-1-01
Qualcomm
PM-8916-0-176NSP-TR-02-1-01 by Qualcomm is a 176-terminal GRID ARRAY IC with HVCMOS technology, 0.4mm terminal pitch, and 3.6V supply voltage. It's used in TELECOM CIRCUITS due to its thin profile and fine pitch for telecom interface applications.
RS9116N-DB00-CC1-B00
Silicon Labs
TELECOM CIRCUIT;
RN4678APL-V/RM111
Microchip Technology
RN4678APL-V/RM111 by Microchip Tech is a telecom IC with 33 terminals, operating temp range of -20 to 70°C. It has a supply voltage of 1.9V and terminal pitch of 1.1mm. Ideal for telecom applications due to TS16949 screening level and no-lead terminal form.
SN65DSI84TPAPRQ1
Texas Instruments
Texas Instruments SN65DSI84TPAPRQ1 is a 64-terminal telecom IC with 1.8V supply voltage, 1Mbps data rate, and -40 to 105°C operating temperature range. Ideal for telecom circuits, it features AEC-Q100 screening level and gull wing terminal form for industrial applications.
NEO-6M-0
U-blox Ag
NEO-6M-0 by U-blox Ag is a telecom IC with 24 terminals, AEC-Q100 screening level, and operates b/w -40°C to 85°C. It features a rectangular package style suitable for industrial applications requiring a 3V nominal voltage.
HMC244AG16
HMC244AG16 by Analog Devices is a telecom IC with 16 terminals in a low profile flatpack package. It operates b/w -40 to 85°C, with gold over nickel terminal finish. Ideal for telecom circuits, it has a nominal voltage of 3V and gull wing terminal form.
WF111-A-V1-ETSI
BGT24MTR11E6327XUMA1
Infineon's BGT24MTR11E6327XUMA1 is a telecom IC with 32 terminals, operating at -40 to 105°C. It features a 3.3V supply voltage, quad terminal position, and no-lead form factor. This industrial-grade chip carrier is surface-mountable and suitable for telecom circuit applications due to its bipolar technology.
ST60-2230C-P
Laird Technologies
DA14531MOD-00F01002
Dialog Semiconductor
TELECOM CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 3;
TSC2000IPWR
TSC2000IPWR by Texas Instruments is a Telecom Interface IC with 20 terminals, operating temperature range of -40 to 85°C. It features CMOS technology, single-ended input type, and nominal voltage of 2.7V. Ideal for telecom circuits due to its compact size and industrial temperature grade suitability.
ODIN-W260-03B
TELECOM CIRCUIT; Peak Reflow Temperature (C): 245; Moisture Sensitivity Level (MSL): 4;
AT86RF215M-ZU
AT86RF215M-ZU by Microchip is a RF and baseband circuit IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3V, it's ideal for telecom applications requiring surface mount technology.
BGT24MTR12E6327XUMA1
BGT24MTR12E6327XUMA1 by Infineon is a telecom IC with 32 terminals in a chip carrier package. It operates b/w -40 to 105°C, suitable for industrial use. With a supply voltage of 3.3V, it features a terminal pitch of 0.5mm and is surface mountable for various telecom interface applications.
HMC799LP3ETR
Analog Devices' HMC799LP3ETR is a 16-terminal telecom IC with 5V supply, operating from -40 to 85°C. It's a surface-mount chip carrier package suitable for industrial applications, drawing max 80mA current. With matte tin finish and quad terminal position, it's ideal for telecom circuit interfaces.
STKNX
STMicroelectronics
TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
RN4678APL-V/RM120
RN4678APL-V/RM120 by Microchip Technology is a telecom IC with 33 terminals, operating b/w -20 to 70°C. It has a supply voltage of 1.9V and terminal pitch of 1.1mm. This surface-mount rectangular package is ideal for telecom circuit applications due to its compact size and commercial temperature grade suitability.
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HTMS1201FTK/AF,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: HVSON; Package Shape: RECTANGULAR;
HTMS1101FTK/AF,115
HTMS1001FTK/AF,115
HTMS1201FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Qualification: Not Qualified; Technology: CMOS;
HTMS1101FUG/AM,005
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: SQUARE; Package Equivalence Code: WAFER;
HTMS1101FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Package Body Material: PLASTIC/EPOXY; Terminal Position: QUAD;
HTMS1201FUG/AM
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 5; Package Code: DIE; Package Shape: RECTANGULAR;
HTMS1001FTB/AF,115
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: VSON; Package Shape: RECTANGULAR;
HTMS1101FUG/AM
HTMS1001FUG/AM
HTMS1201FTB/AF,115
HTMS1101FUG/AM,026
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; Package Code: DIE; Package Shape: SQUARE; No. of Functions: 1;
HTMS1101FTB/AF,115
HTMS1201FTK/AF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 2; Package Code: SON; Package Shape: RECTANGULAR;
HTMS1001FTK/AF
HTMS1101FTK/AF
HTMS1001FTB/AF
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: SON; Package Shape: RECTANGULAR;
HTMS1001FTB/AF,118
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 3; Package Code: QCCN; Terminal Position: QUAD; Qualification: Not Qualified;
HTMS1101FTB/AF
HTMS1201FTB/AF
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