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SA606DK/03,118

NXP Semiconductors

SA606DK/03,118 by NXP Semiconductors

SA606DK/03,118 by NXP Semiconductors is a telecom interface IC designed for industrial applications. It features a dual terminal configuration with a max operating temp of 85 °C and operates at a nominal voltage of 3V. Its compact size (4.4mm x 6.5mm) ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,757 parts In-Stock

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Anansix

USA . 2,079 parts In-Stock

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Digiode

USA . 1,007 parts In-Stock

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AZTECH Wire

Italy . 435 parts In-Stock

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$19.240

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435

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One Stop Electronics

USA . 1,015 parts In-Stock

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$693.000

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$693.000

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UNI Independent Distributors

Spain . 6,233 parts In-Stock

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Corphita

USA . 3,021 parts In-Stock

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Overview

Elevate your telecom designs with the SA606DK/03,118 by NXP Semiconductors—a trusted leader in innovation and quality. This compact, high-performance interface IC is engineered to thrive in demanding environments, ensuring reliability at extreme temperatures. Perfect for industrial applications, it seamlessly integrates into your systems, delivering unmatched efficiency and performance. Choose NXP for cutting-edge technology that empowers your projects and enhances connectivity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, making the product suitable for various industrial applications.

Surface Mount: YES

Surface mount technology facilitates easy integration into compact designs, making it ideal for modern electronic assemblies.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCB layouts, which is critical in space-constrained applications.

No. of Terminals: 20

With 20 terminals, this IC offers multiple connectivity options, allowing for versatile circuit designs and enhanced functionality.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline and low profile design minimize PCB footprint, enabling efficient designs in high-density environments.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in moderately harsh conditions, suitable for industrial use.

Minimum Operating Temperature: -40 °C

The capability to operate at -40 °C allows this IC to perform reliably in extreme cold environments, expanding its application range.

Terminal Position: DUAL

The dual terminal position enhances electrical connection stability, contributing to overall circuit reliability.

Maximum Seated Height: 1.5 mm

A low seated height of 1.5 mm contributes to the low-profile design, which is advantageous in compact and portable electronic devices.

Width: 4.4 mm

With a width of 4.4 mm, this IC fits well in tight spaces, supporting efficient layout designs.

Length: 6.5 mm

The length of 6.5 mm contributes to its compact design, making it suitable for modern electronic applications requiring high functionality in limited space.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature conditions, this IC is designed for durability and reliability in demanding applications.

Terminal Form: GULL WING

Gull-wing terminals provide excellent soldering connections, ensuring robust electrical performance and reliability in assembly.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, it is specifically designed for communication applications, making it ideal for networking and telecom equipment.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3 V aligns with low-power design strategies, improving energy efficiency in electronic devices.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm supports high-density designs, enabling more terminals in a smaller area, which is key for advanced electronic solutions.

Technical Specifications

Other Function Telecom Interface ICs SA606DK/03,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G20

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Maximum Seated Height:

1.5 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

SA606DK/03,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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