Loading...

HTMS8101FTB/AF,115

NXP Semiconductors

HTMS8101FTB/AF,115 by NXP Semiconductors

HTMS8101FTB/AF,115 from NXP Semiconductors is a telecom interface IC designed for surface mount applications. It features a quad terminal configuration, operates at peak reflow temps of 260 °C, and utilizes CMOS technology. Ideal for enhancing telecom circuit performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,175 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,175

-

-

-

-

Digiode

USA . 3,907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,907

-

-

-

-

Anansix

USA . 1,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,572

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 313 parts In-Stock

1+ parts

$21.890

100+ parts

-

1k+ parts

-

10k+ parts

-

313

$21.890

-

-

-

One Stop Electronics

USA . 456 parts In-Stock

1+ parts

$457.000

100+ parts

-

1k+ parts

-

10k+ parts

-

456

$457.000

-

-

-

UNI Independent Distributors

Spain . 5,228 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,228

-

-

-

-

Corphita

USA . 689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

689

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Unlock the power of connectivity with the HTMS8101FTB/AF,115 from NXP Semiconductors. Renowned for their exceptional quality and cutting-edge innovation, NXP delivers a telecom interface IC that seamlessly enhances communication systems. Designed for reliability and performance, this compact solution is perfect for a variety of applications, ensuring you experience superior efficiency and robust functionality—empowering your projects with unmatched value and competitive advantage.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliability and longevity in various environmental conditions, making it suitable for telecom applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of circuit board space, which is ideal for modern telecom systems.

No. of Terminals: 3

With 3 terminals, the IC is optimized for simplicity in design while still providing essential functionality, which is particularly beneficial for streamlined applications.

Package Style (Meter): CHIP CARRIER

Chip carrier styles offer excellent thermal performance and ease of soldering, enhancing the overall reliability and performance of the telecom IC.

Terminal Position: QUAD

Quad terminal positioning allows for efficient signal routing and connectivity, which is vital for maintaining high performance in telecom applications.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with robust soldering processes, thereby enhancing reliability during manufacturing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC an excellent choice for energy-efficient telecom devices.

Terminal Form: NO LEAD

No lead design reduces the footprint on the PCB, enabling even more compact and efficient telecom product designs.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit IC, this product is specifically designed to optimize communication functions, ensuring effective performance in telecommunication systems.

Technical Specifications

Other Function Telecom Interface ICs HTMS8101FTB/AF,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

3

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC3(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

HTMS8101FTB/AF,115 Telecommunications trade compliance attributes, and parameters.

HTS

8542.32.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20