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SL3S1203AC0,118

NXP Semiconductors

SL3S1203AC0,118 by NXP Semiconductors

SL3S1203AC0,118 by NXP Semiconductors is an industrial-grade telecom interface IC operating b/w -40 °C and 85 °C. It features a nominal voltage of 1.8V and a max current of 0.265mA, ideal for reliable telecom applications in harsh environments.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 7,241 parts In-Stock

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Anansix

USA . 1,747 parts In-Stock

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Digiode

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ACDS - Activité Composants Distribution Service

France . 5 parts In-Stock

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AZTECH Wire

Italy . 802 parts In-Stock

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One Stop Electronics

USA . 268 parts In-Stock

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UNI Independent Distributors

Spain . 3,486 parts In-Stock

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Corphita

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Overview

Elevate your telecom designs with the SL3S1203AC0,118 from NXP Semiconductors, a leader in innovation and quality. This industrial-grade interface IC excels in reliability across extreme temperatures, ensuring seamless communication in any environment. With its low power consumption and robust performance, you gain efficiency and durability for your applications, making it an unbeatable choice for future-proofing your technology and enhancing user experiences.

Feature Benefit Bullets

Power Supplies: 1.8 V

The 1.8 V power supply makes this Telecom Interface IC highly compatible with a wide range of modern digital applications, ensuring efficiency and reduced power consumption.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for use in environments subject to higher temperatures, enhancing its reliability in demanding applications.

Minimum Operating Temperature: -40 °C

The ability to function at a minimum temperature of -40 °C ensures that this Telecom IC can operate in extreme cold environments, making it ideal for industrial and outdoor applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature applications, this IC is designed to provide stability and reliability over a wide temperature range, suitable for rigorous use in various industries.

Maximum Supply Current: 0.265 mA

The low maximum supply current of 0.265 mA contributes to energy efficiency, prolonging the life of battery-powered devices and reducing overall operational costs.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit IC, it is optimized for communication tasks, ensuring excellent performance and reliability in managing telecom signals and interfacing.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V is consistent with many current technology standards, facilitating easy integration into existing designs while minimizing power requirements.

Technical Specifications

Other Function Telecom Interface ICs SL3S1203AC0,118 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Equivalence Code:

DIE OR CHIP

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.265 mA

Nominal Supply Voltage:

1.8 V

Telecom IC Type:

Temperature Grade:

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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