Loading...

HTMS8101FTK/AF,115

NXP Semiconductors

HTMS8101FTK/AF,115 by NXP Semiconductors

HTMS8101FTK/AF,115 by NXP Semiconductors is a CMOS telecom circuit IC designed for surface mount applications. It features a quad terminal position and can withstand peak reflow temperatures of 260 °C. Ideal for various telecom interface needs, it comes in a plastic/epoxy chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,645 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,645

-

-

-

-

Vyrian

USA . 2,788 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,788

-

-

-

-

Anansix

USA . 2,133 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,133

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 903 parts In-Stock

1+ parts

$13.900

100+ parts

-

1k+ parts

-

10k+ parts

-

903

$13.900

-

-

-

One Stop Electronics

USA . 188 parts In-Stock

1+ parts

$490.000

100+ parts

-

1k+ parts

-

10k+ parts

-

188

$490.000

-

-

-

UNI Independent Distributors

Spain . 7,615 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,615

-

-

-

-

Corphita

USA . 1,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,275

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Overview

Unlock seamless communication with the HTMS8101FTK/AF,115 from NXP Semiconductors. This cutting-edge telecom interface IC offers unparalleled reliability and superior performance, making it ideal for a variety of applications in today’s fast-paced digital landscape. With NXP's commitment to quality, you can trust this product to enhance your systems while providing exceptional value, efficiency, and durability tailored to meet your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides a lightweight and durable option, enhancing reliability in various environmental conditions.

Surface Mount: YES

Being surface mount compatible allows for efficient use of space on the PCB and facilitates automated assembly processes.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is ideal for high-density applications, allowing for a compact design while maintaining effective heat dissipation.

Terminal Position: QUAD

The quad terminal position offers flexibility in PCB design and can improve electrical performance by minimizing trace lengths.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with modern soldering processes, making it suitable for high-temperature soldering techniques.

Technology: CMOS

Utilizing CMOS technology provides low power consumption and high noise immunity, making this IC suitable for battery-operated devices.

Terminal Form: NO LEAD

A no lead terminal form improves the thermal performance of the device while also contributing to a smaller physical footprint on the PCB.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, this product is specifically designed for telecommunications applications, ensuring optimal performance in signal transmission and reception.

Technical Specifications

Other Function Telecom Interface ICs HTMS8101FTK/AF,115 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC(UNSPEC)

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Position:

QUAD

Trade Compliance

HTMS8101FTK/AF,115 Telecommunications trade compliance attributes, and parameters.

HTS

8542.32.00

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20