Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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ST33HTPH2028AHD1
STMicroelectronics
ST33HTPH2028AHD1 by STMicroelectronics is a cryptographic authenticator IC with CMOS technology. It operates b/w -40°C to 105°C, has 28 terminals in a small outline package, and requires a nominal voltage of 1.8V. Ideal for secure authentication applications due to its compact size and high-temperature range capabilities.
ALSO OPERATES AT 3.3V NOMINAL VOLATGE
R-PDSO-G28
9.7 mm
28
105 Cel
-40 Cel
PLASTIC/EPOXY
TSSOP
TSSOP28,.25
RECTANGULAR
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
NOT SPECIFIED
1.2 mm
1.8 V
YES
CMOS
GULL WING
.65 mm
DUAL
4.4 mm
CRYPTOGRAPHIC AUTHENTICATOR
ATTPM20P-G3MA1-10-B
Microchip Technology
Microchip Technology's ATTPM20P-G3MA1-10-B is a CMOS microprocessor circuit with 8 terminals, operating b/w 0-70 °C. It supports SPI bus compatibility, with supply voltage ranging from 1.8V to 3.3V. Ideal for applications requiring small outline and thin profile packages in commercial temperature grade environments.
SPI
R-PDSO-N8
3 mm
8
70 Cel
0 Cel
HVSON
SOLCC8,.11,20
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
TS 16949
.6 mm
3.3 V
COMMERCIAL
NO LEAD
.5 mm
2 mm
MICROPROCESSOR CIRCUIT
MPFS250TL-FCG1152I
MPFS250TL-FCG1152I by Microchip Technology is a SoC FPGA with 1152 terminals, CMOS technology, and operating temperature range of -40 to 100°C. It is used for various applications requiring high-performance computing in a compact rectangular package suitable for surface mounting.
R-PBGA-B1152
1152
100 Cel
BALL
BOTTOM
SoC FPGA
BM83SM1-00TB
BM83SM1-00TB by Microchip Technology is a 50-terminal IC with max supply voltage of 4.2V and min of 3.2V. It operates b/w -40 to 85 °C, suitable for PROGRAMMABLE RFSoC applications due to its CMOS technology and compact MICROELECTRONIC ASSEMBLY package style.
R-XXMA-N50
32 mm
50
85 Cel
UNSPECIFIED
XMA
MICROELECTRONIC ASSEMBLY
2.5 mm
4.2 V
3.2 V
3.8 V
1 mm
15 mm
PROGRAMMABLE RFSoC
ATWINC1500-MR210PB1976
ATWINC1500-MR210PB1976 by Microchip operates at 3-4.2V, with -40 to 85°C temp range. It is a CMOS microprocessor circuit with 28 terminals for IoT applications. This surface-mount IC measures 21.72x14.73mm and is ideal for compact electronic devices.
R-XXMA-N28
21.72 mm
2.113 mm
3 V
14.73 mm
ATWINC1500-MR210UB1976
MICROPROCESSOR CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: XMA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;
ATWINC1510-MR210PB1976
ATWINC1510-MR210PB1976 by Microchip operates at 3-4.2V, with CMOS technology and 28 terminals. Ideal for microprocessor circuits, it has a temp range of -40 to 85°C and compact dimensions of 21.72mm x 14.73mm x 2.113mm, making it suitable for various applications requiring low-power consumption and high performance in a surface-mount package style.
CC3200MODR1M2AMOBT
Texas Instruments
CC3200MODR1M2AMOBT by Texas Instruments is a MICROPROCESSOR CIRCUIT with 4-Ch 12-Bit ADC Channels. It operates at -20 to 70 °C and supports I2C, SPI, UART Bus Compatibility. Ideal for IoT applications due to its compact CHIP CARRIER package and low power consumption at 3.6V max supply voltage.
I2C; SPI; UART
NO
0
R-XBCC-B63
e4
20.5 mm
3
25
63
-20 Cel
BCC
CHIP CARRIER
260
2.45 mm
3.6 V
2.3 V
NICKEL GOLD
BUTT
1.27 mm
30
17.5 mm
4-Ch 12-Bit
CC3000MODT
CC3000MODT by Texas Instruments is a surface-mount microprocessor circuit with 46 terminals. It operates b/w -20°C to 70°C, with a supply voltage range of 2.7V to 4.8V. This CMOS technology-based IC is ideal for applications requiring low power consumption and compact design.
SEATED HGT-NOM
R-XQMA-N46
16.3 mm
46
4.8 V
2.7 V
OTHER
QUAD
13.5 mm
SP1ML-915
SP1ML-915 by STMicroelectronics is a CMOS microprocessor circuit with a supply voltage range of 1.8V to 3.6V and operates in extreme temperatures from -40 °C to 85 °C. It features a compact 16-terminal, no-lead design for industrial applications. Ideal for space-constrained environments, it measures just 13.4mm x 14mm with a max height of 2.5mm.
R-XDMA-N16
14 mm
16
INDUSTRIAL
1.5 mm
13.4 mm
CYTMA525-49FNI25ZZT
Cypress Semiconductor
CYTMA525-49FNI25ZZT by Cypress Semiconductor is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 1.71V to 5.5V, featuring a GRID ARRAY package style with 49 terminals for surface mount applications in various electronic devices.
IT ALSO OPERATES AT 2.65 TO 5.5V ANALOG SUPPLY
R-PBGA-B49
49
BGA
GRID ARRAY
5.5 V
1.71 V
XCZU9EG-1FFVC900E
Xilinx
XCZU9EG-1FFVC900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 900 terminals in a GRID ARRAY package style. Operating b/w 0-100 °C, it requires a supply voltage of 0.825-0.876 V. Ideal for applications requiring high-performance processing capabilities.
R-PBGA-B900
e1
4
900
245
.876 V
.825 V
.85 V
Tin/Silver/Copper (Sn/Ag/Cu)
XCZU11EG-1FFVB1517E
XCZU11EG-1FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for applications requiring high-performance processing in compact form factors.
R-PBGA-B1517
1517
XCZU11EG-1FFVB1517I
XCZU11EG-1FFVB1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
XCZU11EG-1FFVC1156E
XCZU11EG-1FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1156 terminals in a GRID ARRAY package style. Operating b/w 0-100 °C, it's ideal for applications requiring low power consumption and high performance.
R-PBGA-B1156
1156
XCZU11EG-1FFVC1156I
XCZU11EG-1FFVC1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1156 terminals in a GRID ARRAY package style, operating b/w -40 to 100 °C. Ideal for applications requiring high performance and reliability in industrial environments.
XCZU11EG-1FFVC1760E
XCZU11EG-1FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for applications requiring Other Function uPs,uCs & Peripheral ICs with supply voltage range of 0.825-0.876 V.
R-PBGA-B1760
1760
XCZU11EG-1FFVC1760I
XCZU11EG-1FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs & Peripheral ICs.
XCZU11EG-1FFVF1517E
XCZU11EG-1FFVF1517E by Xilinx is a CMOS microprocessor circuit with 1517 terminals. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. This grid array package is ideal for various applications requiring high-performance processing capabilities.
XCZU11EG-1FFVF1517I
XCZU11EG-1FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package with 1517 terminals is ideal for industrial applications requiring high-performance processing capabilities.
XCZU11EG-2FFVB1517I
XCZU11EG-2FFVB1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
XCZU11EG-2FFVC1156I
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;
XCZU11EG-2FFVC1760I
XCZU11EG-2FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
XCZU11EG-2FFVF1517I
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
XCZU11EG-3FFVB1517E
XCZU11EG-3FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.873-0.927 V. This GRID ARRAY package is ideal for Other Function uPs,uCs & Peripheral ICs applications.
.927 V
.873 V
.9 V
XCZU11EG-3FFVC1156E
XCZU11EG-3FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.873-0.927 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.
XCZU11EG-3FFVC1760E
XCZU11EG-3FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.873-0.927 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in various electronic devices.
XCZU11EG-L1FFVC1156I
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
.742 V
.698 V
.72 V
XCZU11EG-L1FFVC1760I
XCZU11EG-L1FFVC1760I by Xilinx is a MICROPROCESSOR CIRCUIT with 1760 terminals in a GRID ARRAY package. It operates b/w -40 to 100 °C and has a supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high-performance CMOS technology.
XCZU11EG-L1FFVF1517I
XCZU11EG-L1FFVF1517I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 1517 terminals in a GRID ARRAY package style. Suitable for industrial applications, it features a supply voltage range of 0.698V to 0.742V.
XCZU11EG-L2FFVC1156E
The Xilinx XCZU11EG-L2FFVC1156E is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w 0-110°C, with supply voltage range of 0.698-0.742 V. Ideal for applications requiring high-performance processing in compact form factors.
110 Cel
XCZU11EG-L2FFVC1760E
XCZU11EG-L2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with 1760 terminals in a GRID ARRAY package. It operates b/w 0-110 °C and has a supply voltage range of 0.698-0.742 V. Ideal for applications requiring high-performance processing capabilities in various electronic systems.
XCZU11EG-L2FFVF1517E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1517; Package Code: BGA; Package Shape: RECTANGULAR;
XCZU15EG-1FFVB1156E
XCZU15EG-1FFVB1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1156 terminals in a GRID ARRAY package style. Operating b/w 0-100 °C, it's ideal for applications requiring high performance and low power consumption.
XCZU15EG-1FFVB1156I
XCZU15EG-1FFVC900E
XCZU15EG-1FFVC900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high-performance processing in compact form factors.
XCZU15EG-1FFVC900I
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;
XCZU15EG-2FFVB1156I
XCZU15EG-2FFVB1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance and reliability.
XCZU15EG-2FFVC900I
XCZU15EG-2FFVC900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Ideal for industrial applications requiring high performance and reliability.
XCZU15EG-3FFVB1156E
XCZU15EG-3FFVB1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1156 terminals in a GRID ARRAY package style. Operating b/w 0 to 100 °C, it's ideal for applications requiring low power consumption and high performance.
XCZU15EG-L1FFVB1156I
XCZU15EG-L1FFVB1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C, with supply voltage range of 0.698V to 0.742V. Ideal for industrial applications requiring high performance and reliability in a compact GRID ARRAY package.
XCZU15EG-L1FFVC900I
XCZU15EG-L2FFVB1156E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;
XCZU17EG-1FFVB1517E
XCZU17EG-1FFVB1517I
XCZU17EG-1FFVC1760E
XCZU17EG-1FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Suitable for applications requiring high-performance processing in compact form factors.
XCZU17EG-1FFVC1760I
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;
XCZU17EG-1FFVD1760E
XCZU17EG-1FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Suitable for Other Function uPs,uCs & Peripheral ICs applications.
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