Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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XCZU9EG-L1FFVB1156I
Xilinx
MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
R-PBGA-B1156
e1
4
1156
100 Cel
-40 Cel
PLASTIC/EPOXY
BGA
RECTANGULAR
GRID ARRAY
245
.742 V
.698 V
.72 V
YES
CMOS
INDUSTRIAL
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
BALL
BOTTOM
30
MICROPROCESSOR CIRCUIT
XCZU9EG-L1FFVC900I
XCZU9EG-L1FFVC900I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has 900 terminals in a GRID ARRAY package style. Suitable for industrial applications, it features a supply voltage range of 0.698V to 0.742V and can withstand peak reflow temperature of 245C.
R-PBGA-B900
900
Tin/Silver/Copper (Sn/Ag/Cu)
XCZU9EG-L2FFVB1156E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;
110 Cel
0 Cel
OTHER
6AV2181-8XP00-0AX0
Siemens
Siemens 6AV2181-8XP00-0AX0 is a surface mount rectangular chip with CMOS technology. It operates at temperatures ranging from 0 to 50°C and has a nominal voltage of 3.3V. This microprocessor circuit is commonly used in commercial applications requiring other function uPs, uCs, and peripheral ICs.
R-XUUC-N
50 Cel
UNSPECIFIED
DIE
UNCASED CHIP
NOT SPECIFIED
3.3 V
COMMERCIAL
NO LEAD
UPPER
LC898123F40XC-VH
Onsemi
LC898123F40XC-VH by Onsemi is a MICROPROCESSOR CIRCUIT with 35 terminals in a GRID ARRAY package. It operates b/w -30 to 85 °C with supply voltage range of 2.6V to 3.3V, making it ideal for applications requiring high performance and low power consumption.
R-PBGA-B35
3.22 mm
1
35
85 Cel
-30 Cel
VFBGA
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
260
.45 mm
2.6 V
2.8 V
TIN SILVER COPPER
.4 mm
2.3 mm
XCZU11EG-2FFVB1517E
XCZU11EG-2FFVB1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance uPs/uCs & Peripheral ICs in compact designs.
R-PBGA-B1517
40 mm
1517
3.51 mm
.876 V
.825 V
.85 V
1 mm
XCZU11EG-2FFVC1156E
35 mm
XCZU11EG-2FFVC1760E
XCZU11EG-2FFVC1760E by Xilinx is a CMOS microprocessor circuit with 1760 terminals in a grid array package. Operating b/w 0-100°C, it has a supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing and advanced processing capabilities.
R-PBGA-B1760
42.5 mm
1760
3.71 mm
XCZU11EG-2FFVF1517E
XCZU11EG-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, measuring 40x40 mm. Operating b/w 0-100°C, it requires a supply voltage of 0.825-0.876 V and can withstand peak reflow at 245°C for up to 30s.
XCZU15EG-2FFVB1156E
3.42 mm
XCZU15EG-2FFVC900E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;
31 mm
XCZU17EG-2FFVC1760E
XCZU17EG-2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance processing in compact form factors.
XCZU17EG-2FFVD1760E
XCZU17EG-2FFVD1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1760 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for applications requiring high processing power and advanced functionalities in compact designs.
XCZU17EG-2FFVE1924E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1924; Package Code: BGA; Package Shape: RECTANGULAR;
R-PBGA-B1924
45 mm
1924
XCZU19EG-2FFVC1760E
XCZU19EG-2FFVC1760E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance processing in compact designs.
XCZU19EG-2FFVD1760E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;
XCZU19EG-2FFVE1924E
XCZU19EG-2FFVE1924E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1924 terminals in a GRID ARRAY package style, with a max supply voltage of 0.876 V. Ideal for applications requiring high processing power and efficiency in environments up to 100°C.
XCZU2CG-2SBVA484E
XCZU2CG-2SBVA484E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high performance and low power consumption in compact designs.
R-PBGA-B484
19 mm
484
250
2.61 mm
.8 mm
XCZU3EG-2SBVA484E
PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
PROGRAMMABLE SoC
XCZU3EG-2SFVA625E
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;
R-PBGA-B625
21 mm
625
3.43 mm
XCZU4CG-2FBVB900E
XCZU4CG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in compact designs.
2.88 mm
XCZU4EG-2FBVB900E
XCZU4EG-2SFVC784E
XCZU4EG-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. This GRID ARRAY package with 784 terminals is ideal for applications requiring high-performance computing in compact spaces.
R-PBGA-B784
23 mm
784
3.32 mm
XCZU4EV-2FBVB900E
XCZU4EV-2FBVB900E by Xilinx is a CMOS microprocessor with 900 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing in compact form factors.
XCZU4EV-2SFVC784E
XCZU4EV-2SFVC784E by Xilinx is a rectangular, surface mount microprocessor circuit with 784 terminals. It operates on a supply voltage range of 0.825 V to 0.876 V and has a max operating temperature of 100°C. This IC is commonly used in various applications requiring high-performance computing and advanced processing capabilities.
XCZU5CG-2FBVB900E
XCZU5CG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for Other Function uPs,uCs & Peripheral ICs applications.
XCZU5EG-2FBVB900E
XCZU5EG-2FBVB900E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package IC is ideal for various applications requiring high performance and flexibility in a compact form factor.
BGA900,30X30,40
XCZU5EG-2SFVC784E
XCZU5EG-2SFVC784E by Xilinx is a PROGRAMMABLE SoC with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. With 784 terminals in a GRID ARRAY package, it's ideal for various applications requiring high-performance computing and programmable logic solutions.
BGA784,28X28,32
XCZU5EV-2FBVB900E
XCZU5EV-2SFVC784E
XCZU5EV-2SFVC784E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C and has a supply voltage range of 0.825-0.876 V. With 784 terminals in a GRID ARRAY package, it's ideal for high-performance computing applications.
XCZU6CG-2FFVB1156E
XCZU6CG-2FFVC900E
XCZU6EG-2FFVB1156E
XCZU6EG-2FFVC900E
XCZU7CG-2FBVB900E
XCZU7CG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in compact designs.
2.97 mm
XCZU7CG-2FFVC1156E
XCZU7CG-2FFVF1517E
XCZU7CG-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in surface mount designs.
XCZU7EG-2FBVB900E
XCZU7EG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 900 terminals in a GRID ARRAY package style, with dimensions of 31mm x 31mm. Operating b/w 0 to 100 °C, it has a supply voltage range of 0.825V to 0.876V making it ideal for high-performance computing applications.
XCZU7EG-2FFVC1156E
The Xilinx XCZU7EG-2FFVC1156E is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. Ideal for applications requiring high-performance processing capabilities in compact form factors.
XCZU7EG-2FFVF1517E
The Xilinx XCZU7EG-2FFVF1517E is a MICROPROCESSOR CIRCUIT with CMOS technology. It has 1517 terminals in a GRID ARRAY package style, with a rectangular shape and PLASTIC/EPOXY body material. Operating b/w 0 to 100 °C, it's ideal for applications requiring high performance and low power consumption.
XCZU7EV-2FBVB900E
XCZU7EV-2FFVC1156E
XCZU7EV-2FFVC1156E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It features 1156 terminals in a GRID ARRAY package style, operating b/w 0-100 °C. Ideal for applications requiring high performance and reliability in compact designs.
XCZU7EV-2FFVF1517E
XCZU7EV-2FFVF1517E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in compact designs.
XCZU9CG-2FFVB1156E
XCZU9CG-2FFVC900E
XCZU9EG-2FFVB1156E
The Xilinx XCZU9EG-2FFVB1156E is a CMOS microprocessor circuit with 1156 terminals in a grid array package. It operates b/w 0 to 100°C, with supply voltage ranging from 0.825V to 0.876V. Ideal for applications requiring high-performance computing and signal processing capabilities.
XCZU9EG-2FFVC900E
LC898124EP2XC-MH
MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 27; Package Code: VFBGA; Package Shape: RECTANGULAR;
R-PBGA-B27
3.89 mm
27
.33 mm
1.3 mm
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