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XCZU5CG-2FBVB900E

Xilinx

XCZU5CG-2FBVB900E by Xilinx

XCZU5CG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for Other Function uPs,uCs & Peripheral ICs applications.

Median Price

$2,882.790

Lifecycle Status

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Nova Conductors

Japan . 53 parts In-Stock

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One Stop Electronics

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AZTECH Wire

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Modulus Dynamics

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Ampacity Inc.

Singapore . 734 parts In-Stock

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Corohmni

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Texas Native Microelectronics

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Kenton Components

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Microchip USA

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Argo Parts USA

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$2,773.616

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Continental Prestige Electronics

USA . 465 parts In-Stock

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Qasali Group International

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Supply Digital

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Overview

Discover the innovative XCZU5CG-2FBVB900E by Xilinx, a versatile solution in the category of Other Function uPs,uCs & Peripheral ICs. With its high-quality design and reliable performance, this product represents the excellence that Xilinx is known for. From enhancing system functionality to enabling advanced applications, this product offers exceptional value and benefits to customers seeking cutting-edge technology. Experience the advantages of this microprocessor circuit and unleash its potential in your next project. Choose Xilinx for superior quality and unmatched expertise in the world of semiconductor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic is a durable and cost-effective material, making the product reliable and affordable.

Surface Mount: YES

Surface mount technology allows for compact design and efficient assembly, saving space and labor costs.

Maximum Supply Voltage: 0.876 V

With a high maximum supply voltage, this product can handle fluctuations in power supply without risk of damage.

Package Shape: RECTANGULAR

Rectangular shape provides ease of handling and integration into various electronic devices.

No. of Terminals: 900

High number of terminals allows for versatile connectivity options and functionality.

Package Style (Meter): GRID ARRAY

Grid array package style offers good thermal performance and mechanical stability.

Minimum Supply Voltage: 0.825 V

Low minimum supply voltage ensures energy efficiency and compatibility with various power sources.

Maximum Operating Temperature: 100 °C

High maximum operating temperature allows for reliable performance even in extreme conditions.

Minimum Operating Temperature: 0 °C

Wide operating temperature range ensures functionality in both hot and cold environments.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Tin/silver/copper terminal finish provides good conductivity and solderability for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy installation and maintenance of the product.

Maximum Seated Height: 2.88 mm

Low seated height allows for compact design and space-saving in electronic applications.

Width: 31 mm

Standard width for easy integration into various electronic systems and designs.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature ensures efficient and reliable soldering during assembly.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures proper soldering and mounting of the product.

Length: 31 mm

Standard length for compatibility with different electronic devices and applications.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit offers high performance and functionality for advanced electronic systems.

Technology: CMOS

CMOS technology provides low power consumption and high speed performance for efficient operation.

Terminal Form: BALL

Ball terminal form ensures reliable connections and easy soldering during assembly.

Nominal Supply Voltage: 0.85 V

Stable nominal supply voltage ensures consistent and reliable operation of the product.

Terminal Pitch: 1 mm

Narrow terminal pitch allows for high-density mounting and compact design of electronic devices.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates the level of moisture sensitivity, ensuring proper handling and storage to prevent damage.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU5CG-2FBVB900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Length:

31 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.88 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

31 mm

Peripheral IC Type:

Trade Compliance

XCZU5CG-2FBVB900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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