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XCZU7CG-2FBVB900E

Xilinx

XCZU7CG-2FBVB900E by Xilinx

XCZU7CG-2FBVB900E by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w 0-100 °C, with supply voltage range of 0.825-0.876 V. This GRID ARRAY package is ideal for applications requiring high performance and reliability in compact designs.

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Overview

Unlock the power of cutting-edge technology with the XCZU7CG-2FBVB900E from Xilinx. Known for its superior quality and reliability, Xilinx offers a wide range of applications in the category of Other Function uPs, uCs & Peripheral ICs. This product is designed to deliver unmatched performance and efficiency, making it the perfect choice for customers looking to stay ahead in today's fast-paced technological landscape. Experience the value and benefits that Xilinx brings to the table with the XCZU7CG-2FBVB900E.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and reducing production costs.

Maximum Supply Voltage: 0.876 V

The high maximum supply voltage ensures stable and reliable operation under varying load conditions.

No. of Terminals: 900

Having a large number of terminals allows for extensive connectivity options and functionality.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures the product can withstand harsh environmental conditions.

Terminal Finish: Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

The use of tin/silver/copper as terminal finish provides good electrical conductivity and corrosion resistance.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Incorporating a microprocessor circuit allows for advanced computation and control capabilities in the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of the product.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs XCZU7CG-2FBVB900E attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Xilinx

Specs

JESD-30 Code:

R-PBGA-B900

JESD-609 Code:

e1

Length:

31 mm

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

900

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

2.97 mm

Maximum Supply Voltage:

.876 V

Minimum Supply Voltage:

.825 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

31 mm

Peripheral IC Type:

Trade Compliance

XCZU7CG-2FBVB900E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.4

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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